Configurable Multiple-Function Gate 6-SON -40 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | VSON, SOLCC6,.04,20 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 8 weeks |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-N6 |
| JESD-609代码 | e4 |
| 长度 | 1.45 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | LOGIC CIRCUIT |
| 最大I（ol） | 0.032 A |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 6 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VSON |
| 封装等效代码 | SOLCC6,.04,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE |
| 包装方法 | TR |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| Prop。Delay @ Nom-Su | 6.3 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | YES |
| 座面最大高度 | 0.6 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 1 mm |
| SN74LVC1G58DRY2 | SN74LVC1G58DBVR | SN74LVC1G58DBVRG4 | SN74LVC1G58DCKRE4 | SN74LVC1G58DCKRG4 | SN74LVC1G58DRLR | SN74LVC1G58YZPR | SN74LVC1G58DRYR | SN74LVC1G58DSF2 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Configurable Multiple-Function Gate 6-SON -40 to 125 | Configurable Multiple-Function Gate 6-SOT-23 -40 to 125 | Configurable Multiple-Function Gate 6-SOT-23 -40 to 125 | Configurable Multiple-Function Gate 6-SC70 -40 to 125 | Configurable Multiple-Function Gate 6-SC70 -40 to 125 | Configurable Multiple-Function Gate 6-SOT-5X3 -40 to 125 | Configurable Multiple-Function Gate 6-DSBGA -40 to 85 | Configurable Multiple-Function Gate 6-SON -40 to 125 | Configurable Multiple-Function Gate 6-SON -40 to 125 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | VSON, SOLCC6,.04,20 | LSSOP, TSOP6,.11,37 | LSSOP, TSOP6,.11,37 | SC-70, 6 PIN | SC-70, 6 PIN | SOT-563, 6 PIN | DSBGA-6 | VSON, SOLCC6,.04,20 | VSON, SOLCC6,.04,14 |
| Reach Compliance Code | compli | compli | compli | compliant | compliant | compli | compli | compli | compli |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-N6 | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-F6 | R-XBGA-B6 | R-PDSO-N6 | S-PDSO-N6 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e1 | e4 | e4 |
| 长度 | 1.45 mm | 2.9 mm | 2.9 mm | 2 mm | 2 mm | 1.6 mm | 1.4 mm | 1.45 mm | 1 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT |
| 最大I（ol） | 0.032 A | 0.032 A | 0.024 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VSON | LSSOP | LSSOP | TSSOP | TSSOP | VSOF | VFBGA | VSON | VSON |
| 封装等效代码 | SOLCC6,.04,20 | TSOP6,.11,37 | TSOP6,.11,37 | TSSOP6,.08 | TSSOP6,.08 | FL6,.047,20 | BGA6,2X3,20 | SOLCC6,.04,20 | SOLCC6,.04,14 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE |
| 包装方法 | TR | TR | TR | TR | TR | TR | TR | TR | TR |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 座面最大高度 | 0.6 mm | 1.45 mm | 1.45 mm | 1.1 mm | 1.1 mm | 0.6 mm | 0.5 mm | 0.6 mm | 0.4 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | 3.3 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | FLAT | BALL | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.95 mm | 0.95 mm | 0.65 mm | 0.65 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.35 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | BOTTOM | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 1 mm | 1.6 mm | 1.6 mm | 1.25 mm | 1.25 mm | 1.2 mm | 0.9 mm | 1 mm | 1 mm |
| 是否无铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | - |
| Factory Lead Time | 8 weeks | 1 week | - | 6 weeks | 6 weeks | 1 week | 1 week | 1 week | 6 weeks |
| 输出极性 | TRUE | TRUE | - | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| Prop。Delay @ Nom-Su | 6.3 ns | 6.3 ns | 6.3 ns | - | - | 6.3 ns | 6.3 ns | 6.3 ns | 6.3 ns |
| 零件包装代码 | - | SOT-23 | SOT-23 | SOIC | SOIC | SOT | BGA | SON | SON |
| 针数 | - | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 |
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | - |
| Base Number Matches | - | 1 | - | 1 | 1 | 1 | 1 | - | - |
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