Low-power configurable multiple function gate
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | SON |
| 包装说明 | 0.90 X 1 MM, 0.35 MM HEIGHT, SOT-1115, XSON-6 |
| 针数 | 6 |
| Reach Compliance Code | unknow |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-N6 |
| JESD-609代码 | e3 |
| 长度 | 1 mm |
| 逻辑集成电路类型 | LOGIC CIRCUIT |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 6 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SON |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.35 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | TIN |
| 端子形式 | NO LEAD |
| 端子节距 | 0.3 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 0.9 mm |
| 74LVC1G97GN | 74LVC1G97GF | 74LVC1G97GM | 74LVC1G97GS | 74LVC1G97GV | 74LVC1G97GW | |
|---|---|---|---|---|---|---|
| 描述 | Low-power configurable multiple function gate | Low-power configurable multiple function gate | Low-power configurable multiple function gate | Low-power configurable multiple function gate | Low-power configurable multiple function gate | Low-power configurable multiple function gate |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | SON | SON | SON | SON | TSOP | SOT-363 |
| 包装说明 | 0.90 X 1 MM, 0.35 MM HEIGHT, SOT-1115, XSON-6 | 1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, XSON-6 | 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6 | 1 X 1 MM, 0.35 MM HEIGHT, SOT-1202, XSON-6 | PLASTIC, SOT-457, SC-74, TSOP-6 | PLASTIC, SOT-363, SC-88, 6 PIN |
| 针数 | 6 | 6 | 6 | 6 | 6 | 6 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-N6 | S-PDSO-N6 | R-PDSO-N6 | S-PDSO-N6 | R-PDSO-G6 | R-PDSO-G6 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 1 mm | 1 mm | 1.45 mm | 1 mm | 2.9 mm | 2 mm |
| 逻辑集成电路类型 | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 6 | 6 | 6 | 6 | 6 | 6 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SON | VSON | VSON | VSON | TSSOP | TSSOP |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.35 mm | 0.5 mm | 0.5 mm | 0.35 mm | 1.1 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | TIN | TIN | TIN | TIN | TIN | PURE TIN |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | GULL WING | GULL WING |
| 端子节距 | 0.3 mm | 0.35 mm | 0.5 mm | 0.35 mm | 0.95 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 0.9 mm | 1 mm | 1 mm | 1 mm | 1.5 mm | 1.25 mm |
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