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74LVC1G97GM

产品描述Low-power configurable multiple function gate
产品类别逻辑    逻辑   
文件大小157KB,共21页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
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74LVC1G97GM概述

Low-power configurable multiple function gate

74LVC1G97GM规格参数

参数名称属性值
是否Rohs认证符合
厂商名称NXP(恩智浦)
零件包装代码SON
包装说明1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6
针数6
Reach Compliance Codeunknow
系列LVC/LCX/Z
JESD-30 代码R-PDSO-N6
JESD-609代码e3
长度1.45 mm
逻辑集成电路类型LOGIC CIRCUIT
湿度敏感等级1
功能数量1
端子数量6
最高工作温度125 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码VSON
封装形状RECTANGULAR
封装形式SMALL OUTLINE, VERY THIN PROFILE
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度0.5 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)1.65 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子面层TIN
端子形式NO LEAD
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度1 mm

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74LVC1G97
Low-power configurable multiple function gate
Rev. 3 — 7 December 2011
Product data sheet
1. General description
The 74LVC1G97 is a configurable multiple function gate with Schmitt-trigger inputs. The
device can be configured as any of the following logic functions MUX, AND, OR, NAND,
NOR, inverter and buffer; using the 3-bit input. All inputs can be connected to V
CC
or
GND.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these
devices as translators in mixed 3.3 V and 5 V environments.
This device is fully specified for partial power-down applications using I
OFF
.
The I
OFF
circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
2. Features and benefits
Wide supply voltage range from 1.65 V to 5.5 V
5 V tolerant input/output for interfacing with 5 V logic
High noise immunity
Complies with JEDEC standard:
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8B/JESD36 (2.7 V to 3.6 V).
24
mA output drive (V
CC
= 3.0 V)
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
CDM JESD22-C101E exceeds 1000 V
CMOS low power consumption
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
Inputs accept voltages up to 5 V
Multiple package options
Specified from
40 C
to +85
C
and
40 C
to +125
C.

74LVC1G97GM相似产品对比

74LVC1G97GM 74LVC1G97GF 74LVC1G97GN 74LVC1G97GS 74LVC1G97GV 74LVC1G97GW
描述 Low-power configurable multiple function gate Low-power configurable multiple function gate Low-power configurable multiple function gate Low-power configurable multiple function gate Low-power configurable multiple function gate Low-power configurable multiple function gate
是否Rohs认证 符合 符合 符合 符合 符合 符合
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 SON SON SON SON TSOP SOT-363
包装说明 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6 1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, XSON-6 0.90 X 1 MM, 0.35 MM HEIGHT, SOT-1115, XSON-6 1 X 1 MM, 0.35 MM HEIGHT, SOT-1202, XSON-6 PLASTIC, SOT-457, SC-74, TSOP-6 PLASTIC, SOT-363, SC-88, 6 PIN
针数 6 6 6 6 6 6
Reach Compliance Code unknow unknow unknow unknow unknow unknow
系列 LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 代码 R-PDSO-N6 S-PDSO-N6 R-PDSO-N6 S-PDSO-N6 R-PDSO-G6 R-PDSO-G6
JESD-609代码 e3 e3 e3 e3 e3 e3
长度 1.45 mm 1 mm 1 mm 1 mm 2.9 mm 2 mm
逻辑集成电路类型 LOGIC CIRCUIT LOGIC CIRCUIT LOGIC CIRCUIT LOGIC CIRCUIT LOGIC CIRCUIT LOGIC CIRCUIT
湿度敏感等级 1 1 1 1 1 1
功能数量 1 1 1 1 1 1
端子数量 6 6 6 6 6 6
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 VSON VSON SON VSON TSSOP TSSOP
封装形状 RECTANGULAR SQUARE RECTANGULAR SQUARE RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) 260 260 260 260 260 260
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 0.5 mm 0.5 mm 0.35 mm 0.35 mm 1.1 mm 1.1 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V
标称供电电压 (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子面层 TIN TIN TIN TIN TIN PURE TIN
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD GULL WING GULL WING
端子节距 0.5 mm 0.35 mm 0.3 mm 0.35 mm 0.95 mm 0.65 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 30 30 30 30 30 30
宽度 1 mm 1 mm 0.9 mm 1 mm 1.5 mm 1.25 mm

 
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