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Datasheet> 器件分类 > 存储> 存储> UPD48288209FF-EF33-DW1-A

UPD48288209FF-EF33-DW1-A: 产品描述DDR DRAM; 产品类别存储存储; 文件大小856KB，共50页; 制造商Renesas(瑞萨电子); 官网地址https://www.renesas.com/; 标准

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UPD48288209FF-EF33-DW1-A概述

DDR DRAM

UPD48288209FF-EF33-DW1-A规格参数

参数名称	属性值
是否Rohs认证	符合
Objectid	1277592848
包装说明	BGA, BGA144,12X18,40/32
Reach Compliance Code	unknown
ECCN代码	EAR99
最大时钟频率 (fCLK)	300 MHz
I/O 类型	COMMON
交错的突发长度	2,4,8
JESD-30 代码	R-PBGA-B144
内存密度	301989888 bit
内存集成电路类型	DDR DRAM
内存宽度	9
端子数量	144
字数	33554432 words
字数代码	32000000
组织	32MX9
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	BGA
封装等效代码	BGA144,12X18,40/32
封装形状	RECTANGULAR
封装形式	GRID ARRAY
电源	1.5,1.8,2.5 V
认证状态	Not Qualified
表面贴装	YES
技术	CMOS
端子形式	BALL
端子节距	0.8 mm
端子位置	BOTTOM

UPD48288209FF-EF33-DW1-A相似产品对比

	UPD48288209FF-EF33-DW1-A	UPD48288218FF-E33-DW1-A	UPD48288218FF-EF25-DW1-A	UPD48288218FF-EF33-DW1-A	UPD48288236FF-E33-DW1-A	UPD48288209FF-EF25-DW1-A	UPD48288209FF-E33-DW1-A	UPD48288236FF-EF25-DW1-A	UPD48288236FF-EF33-DW1-A
描述	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合	符合
包装说明	BGA, BGA144,12X18,40/32	TBGA, BGA144,12X18,40/32	BGA, BGA144,12X18,40/32	BGA, BGA144,12X18,40/32	TBGA, BGA144,12X18,40/32	BGA, BGA144,12X18,40/32	TBGA, BGA144,12X18,40/32	BGA, BGA144,12X18,40/32	BGA, BGA144,12X18,40/32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
最大时钟频率 (fCLK)	300 MHz	300 MHz	400 MHz	300 MHz	300 MHz	400 MHz	300 MHz	400 MHz	300 MHz
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	R-PBGA-B144	R-PBGA-B144	R-PBGA-B144	R-PBGA-B144	R-PBGA-B144	R-PBGA-B144	R-PBGA-B144	R-PBGA-B144	R-PBGA-B144
内存密度	301989888 bit	301989888 bit	301989888 bit	301989888 bit	301989888 bit	301989888 bit	301989888 bit	301989888 bit	301989888 bit
内存集成电路类型	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
内存宽度	9	18	18	18	36	9	9	36	36
端子数量	144	144	144	144	144	144	144	144	144
字数	33554432 words	16777216 words	16777216 words	16777216 words	8388608 words	33554432 words	33554432 words	8388608 words	8388608 words
字数代码	32000000	16000000	16000000	16000000	8000000	32000000	32000000	8000000	8000000
组织	32MX9	16MX18	16MX18	16MX18	8MX36	32MX9	32MX9	8MX36	8MX36
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	BGA	TBGA	BGA	BGA	TBGA	BGA	TBGA	BGA	BGA
封装等效代码	BGA144,12X18,40/32	BGA144,12X18,40/32	BGA144,12X18,40/32	BGA144,12X18,40/32	BGA144,12X18,40/32	BGA144,12X18,40/32	BGA144,12X18,40/32	BGA144,12X18,40/32	BGA144,12X18,40/32
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY	GRID ARRAY, THIN PROFILE	GRID ARRAY	GRID ARRAY	GRID ARRAY, THIN PROFILE	GRID ARRAY	GRID ARRAY, THIN PROFILE	GRID ARRAY	GRID ARRAY
电源	1.5,1.8,2.5 V	1.8,2.5 V	1.5,1.8,2.5 V	1.5,1.8,2.5 V	1.8,2.5 V	1.5,1.8,2.5 V	1.8,2.5 V	1.5,1.8,2.5 V	1.5,1.8,2.5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	0.8 mm	1 mm	0.8 mm	0.8 mm	1 mm	0.8 mm	1 mm	0.8 mm	0.8 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Objectid	1277592848	-	-	-	-	1277592847	1277592846	1277592853	1277592854
ECCN代码	EAR99	-	-	-	-	EAR99	EAR99	EAR99	EAR99
连续突发长度	-	2,4,8	2,4,8	2,4,8	2,4	-	-	2,4	2,4

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