电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

5962-8871502PA

产品描述Buffer/Inverter Based Peripheral Driver, 0.5A, CDIP8, CERAMIC, DIP-8
产品类别模拟混合信号IC    驱动程序和接口   
文件大小62KB,共11页
制造商Microsemi
官网地址https://www.microsemi.com
下载文档 详细参数 选型对比 全文预览

5962-8871502PA概述

Buffer/Inverter Based Peripheral Driver, 0.5A, CDIP8, CERAMIC, DIP-8

5962-8871502PA规格参数

参数名称属性值
是否Rohs认证不符合
Objectid2078529531
零件包装代码DIP
包装说明DIP, DIP8,.3
针数8
Reach Compliance Codenot_compliant
ECCN代码EAR99
驱动器位数2
接口集成电路类型BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 代码R-GDIP-T8
JESD-609代码e0
功能数量2
端子数量8
最高工作温度125 °C
最低工作温度-55 °C
输出电流流向SINK
最大输出电流0.3 A
标称输出峰值电流0.5 A
封装主体材料CERAMIC, GLASS-SEALED
封装代码DIP
封装等效代码DIP8,.3
封装形状RECTANGULAR
封装形式IN-LINE
电源5 V
认证状态Not Qualified
筛选级别MIL-STD-883 Class B
最大供电电压5.5 V
最小供电电压4.5 V
标称供电电压5 V
表面贴装NO
技术BIPOLAR
温度等级MILITARY
端子面层Tin/Lead (Sn/Pb) - hot dipped
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL

文档预览

下载PDF文档
REVISIONS
LTR
A
B
C
DESCRIPTION
Add device types 02 and 03. Add case outline P. Make changes to table I and
editorial changes throughout.
Make changes to t
PLH
, t
PHL
, t
TLH
, and t
THL
tests as specified in table I herein. - ro
Update drawing to current requirements. - drw
DATE (YR-MO-DA)
90-05-24
00-06-21
04-06-01
APPROVED
M. A. Frye
R. Monnin
R. Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
Gary Zahn
C
1
C
2
C
3
C
4
C
5
C
6
C
7
C
8
C
9
C
10
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Ray Monnin
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
89-04-17
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
MICROCIRCUIT, DIGITAL-LINEAR, DUAL
PERIPHERAL NOR DRIVER, MONOLITHIC
SILICON
AMSC N/A
REVISION LEVEL
C
SIZE
A
SHEET
CAGE CODE
67268
1 OF
10
5962-88715
DSCC FORM 2233
APR 97
5962-E299-04

5962-8871502PA相似产品对比

5962-8871502PA 5962-88715032A 5962-88715022A
描述 Buffer/Inverter Based Peripheral Driver, 0.5A, CDIP8, CERAMIC, DIP-8 Buffer/Inverter Based Peripheral Driver, 2 Driver, 0.5A, TTL, CQCC20, CERAMIC, QCC-20 Buffer/Inverter Based Peripheral Driver, 2 Driver, 0.5A, BIPolar, CQCC20, CERAMIC, QCC-20
是否Rohs认证 不符合 不符合 不符合
零件包装代码 DIP QLCC QLCC
包装说明 DIP, DIP8,.3 CERAMIC, QCC-20 CERAMIC, QCC-20
针数 8 20 20
Reach Compliance Code not_compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99
驱动器位数 2 2 2
接口集成电路类型 BUFFER OR INVERTER BASED PERIPHERAL DRIVER BUFFER OR INVERTER BASED PERIPHERAL DRIVER BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 代码 R-GDIP-T8 S-CQCC-N20 S-CQCC-N20
JESD-609代码 e0 e0 e0
功能数量 2 2 2
端子数量 8 20 20
最高工作温度 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C
输出电流流向 SINK SINK SINK
最大输出电流 0.3 A 0.3 A 0.3 A
标称输出峰值电流 0.5 A 0.5 A 0.5 A
封装主体材料 CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 DIP QCCN QCCN
封装等效代码 DIP8,.3 LCC20,.35SQ LCC20,.35SQ
封装形状 RECTANGULAR SQUARE SQUARE
封装形式 IN-LINE CHIP CARRIER CHIP CARRIER
电源 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified
筛选级别 MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B
最大供电电压 5.5 V 5.5 V 5.5 V
最小供电电压 4.5 V 4.5 V 4.5 V
标称供电电压 5 V 5 V 5 V
表面贴装 NO YES YES
技术 BIPOLAR TTL BIPOLAR
温度等级 MILITARY MILITARY MILITARY
端子面层 Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped
端子形式 THROUGH-HOLE NO LEAD NO LEAD
端子节距 2.54 mm 1.27 mm 1.27 mm
端子位置 DUAL QUAD QUAD
厂商名称 - Microsemi Microsemi

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1972  2239  312  998  1293  34  7  13  11  49 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved