Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
IDH05SG60C
MA000629884
PG-TO220-2-1
Material Group
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
< 10%
Substances
silicon
gold
tin
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
CAS#
if applicable
7440-21-3
7440-57-5
7440-31-5
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
Issued
Weight*
Weight
[mg]
0.807
0.025
0.007
1.343
0.403
1341.263
0.162
9.109
100.198
497.954
14.487
0.198
0.000
Average
Mass
[%]
0.04
0.00
0.00
0.07
0.02
68.22
0.01
0.46
5.10
25.33
0.74
0.01
0.00
29. August 2013
1965.96 mg
Sum
[%]
Average
Mass
[ppm]
411
13
0.04
3
683
205
68.31
0.01
682244
82
4633
50967
30.89
0.74
253289
7369
101
0.01
0
101
1000000
308889
7369
683132
82
427
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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