Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPA90R1K0C3
MA000468304
PG-TO220-3-111
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
tin
silver
antimony
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-31-5
7440-22-4
7440-36-0
Issued
Weight*
Weight
[mg]
5.558
1.407
0.422
1404.801
1.580
1.422
133.670
575.921
42.925
0.732
0.002
1.994
0.767
0.307
Average
Mass
[%]
0.26
0.06
0.02
64.69
0.07
0.07
6.16
26.52
1.98
0.03
0.00
0.09
0.04
0.01
29. August 2013
2171.47 mg
Sum
[%]
0.26
Average
Mass
[ppm]
2559
648
194
64.77
0.07
646925
728
655
61557
32.75
1.98
265217
19767
337
0.03
1
918
353
0.14
141
1413
1000000
338
327429
19767
647767
728
Sum
[ppm]
2559
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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