NICHIA STS-DA1-2757D <Cat.No.131119>
SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Allowable Reverse Current
Power Dissipation
Operating Temperature
Storage Temperature
Junction Temperature
Symbol
I
F
I
FP
I
R
P
D
T
opr
T
stg
T
J
Absolute Maximum Rating
25
80
85
100
-30~85
-40~100
100
Unit
mA
mA
mA
mW
°C
°C
°C
* Absolute Maximum Ratings at T
A
=25°C.
* I
FP
conditions with pulse width
≤10ms
and duty cycle
≤10%.
(2) Initial Electrical/Optical Characteristics
Item
Forward Voltage
Radiant Flux
Peak Wavelength
Spectrum Half Width
Thermal Resistance
* Characteristics at T
A
=25°C.
* Radiant Flux value as per CIE 127:2007 standard.
* R
θJS
is Thermal Resistance from junction to T
S
measuring point.
Symbol
V
F
Φ
e
λ
p
Δλ
R
θJS
Condition
I
F
=20mA
I
F
=20mA
I
F
=20mA
I
F
=20mA
-
Typ
3.4
4.8
365
12
90
Max
-
-
-
-
101
Unit
V
mW
nm
nm
°C/W
1
NICHIA STS-DA1-2757D <Cat.No.131119>
RANKS
Item
Forward Voltage
Radiant Flux
Peak Wavelength
* Ranking at T
A
=25°C.
* Forward Voltage Tolerance: ±0.05V
* Radiant Flux Tolerance: ±10%
* Peak Wavelength Tolerance: ±3nm
* LEDs from the above ranks will be shipped.
The rank combination ratio per shipment will be decided by Nichia.
-
8
7
6
Ua
Rank
Min
2.9
6.8
4.8
3.4
360
Max
4.0
9.6
6.8
4.8
370
nm
mW
Unit
V
2
NICHIA STS-DA1-2757D <Cat.No.131119>
SOLDERING
• Recommended Reflow Soldering Condition(Lead-free Solder)
• Recommended Hand Soldering Condition
Temperature
1 to 5°C per sec
Pre-heat
180 to 200°C
60sec Max
Above 220°C
120sec Max
260°CMax
10sec Max
Soldering Time
350°C Max
3sec Max
• Recommended Soldering Pad Pattern
1.5
4.4
(単½ Unit: mm)
* This LED is designed to be reflow soldered on to a PCB. If dip soldered, Nichia cannot guarantee its reliability.
* Reflow soldering must not be performed more than twice. Hand soldering must not be performed more than once.
* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.
* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,
caused by heat and/or atmosphere.
* Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin.
Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability.
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a double-head soldering iron should be used.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
* When soldering, do not apply stress to the LED while the LED is hot.
* When using a pick and place machine, choose an appropriate nozzle for this product. Using a pick-and-place nozzle
with a smaller diameter than the size of the LED's emitting surface will cause damage to the emitting surface
and may also cause the LED not to illuminate.
* The recommended soldering pad pattern is designed for attachment of the LED without problems.
When precise mounting accuracy is required, such as high-density mounting, ensure that the size and shape of the pad
are suitable for the circuit design.
* Consider factors such as the reflow soldering temperature, hand soldering temperature, etc. when choosing the solder.
* When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner
where the flux will come in contact with the LEDs.
* Make sure that there are no issues with the type and amount of solder that is being used.
2.2
4
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