Dual/Quad 14MHz, Rail-to-Rail CMOS Amplifiers
参数名称 | 属性值 |
Brand Name | Linear Technology |
是否Rohs认证 | 不符合 |
厂商名称 | Linear ( ADI ) |
零件包装代码 | MSOP |
包装说明 | TSSOP, |
针数 | 8 |
制造商包装代码 | MS8 |
Reach Compliance Code | _compli |
放大器类型 | OPERATIONAL AMPLIFIER |
最大平均偏置电流 (IIB) | 0.0005 µA |
标称共模抑制比 | 80 dB |
最大输入失调电压 | 1100 µV |
JESD-30 代码 | S-PDSO-G8 |
JESD-609代码 | e0 |
长度 | 3 mm |
湿度敏感等级 | 1 |
功能数量 | 2 |
端子数量 | 8 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 245 |
座面最大高度 | 1.1 mm |
标称压摆率 | 7.2 V/us |
供电电压上限 | 6 V |
标称供电电压 (Vsup) | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 20 |
标称均一增益带宽 | 14000 kHz |
宽度 | 3 mm |
LTC6087HMS8 | LTC6087 | LTC6087CDD | LTC6088 | LTC6088CDHC | LTC6088HDHC | LTC6088HGN | |
---|---|---|---|---|---|---|---|
描述 | Dual/Quad 14MHz, Rail-to-Rail CMOS Amplifiers | Dual/Quad 14MHz, Rail-to-Rail CMOS Amplifiers | Dual/Quad 14MHz, Rail-to-Rail CMOS Amplifiers | Dual/Quad 14MHz, Rail-to-Rail CMOS Amplifiers | Dual/Quad 14MHz, Rail-to-Rail CMOS Amplifiers | Dual/Quad 14MHz, Rail-to-Rail CMOS Amplifiers | Dual/Quad 14MHz, Rail-to-Rail CMOS Amplifiers |
Brand Name | Linear Technology | - | Linear Technology | - | Linear Technology | Linear Technology | Linear Technology |
是否Rohs认证 | 不符合 | - | 不符合 | - | 不符合 | 不符合 | 不符合 |
厂商名称 | Linear ( ADI ) | - | Linear ( ADI ) | - | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
零件包装代码 | MSOP | - | DFN | - | DFN | DFN | SSOP |
包装说明 | TSSOP, | - | HVSON, | - | HVSON, | HVSON, | SSOP, |
针数 | 8 | - | 10 | - | 16 | 16 | 16 |
制造商包装代码 | MS8 | - | DD | - | DHC | DHC | GN |
Reach Compliance Code | _compli | - | _compli | - | _compli | _compli | _compli |
放大器类型 | OPERATIONAL AMPLIFIER | - | OPERATIONAL AMPLIFIER | - | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
最大平均偏置电流 (IIB) | 0.0005 µA | - | 0.00004 µA | - | 0.00004 µA | 0.0005 µA | 0.0005 µA |
标称共模抑制比 | 80 dB | - | 80 dB | - | 80 dB | 80 dB | 80 dB |
最大输入失调电压 | 1100 µV | - | 1350 µV | - | 1350 µV | 1600 µV | 1100 µV |
JESD-30 代码 | S-PDSO-G8 | - | S-PDSO-N10 | - | R-PDSO-N16 | R-PDSO-N16 | R-PDSO-G16 |
JESD-609代码 | e0 | - | e0 | - | e0 | e0 | e0 |
长度 | 3 mm | - | 3 mm | - | 5 mm | 5 mm | 4.8895 mm |
湿度敏感等级 | 1 | - | 1 | - | 1 | 1 | 1 |
功能数量 | 2 | - | 2 | - | 4 | 4 | 4 |
端子数量 | 8 | - | 10 | - | 16 | 16 | 16 |
最高工作温度 | 125 °C | - | 85 °C | - | 85 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | - | -40 °C | - | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | - | HVSON | - | HVSON | HVSON | SSOP |
封装形状 | SQUARE | - | SQUARE | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 245 | - | 245 | - | 245 | 245 | 245 |
座面最大高度 | 1.1 mm | - | 0.8 mm | - | 0.8 mm | 0.8 mm | 1.75 mm |
标称压摆率 | 7.2 V/us | - | 7.2 V/us | - | 7.2 V/us | 7.2 V/us | 7.2 V/us |
供电电压上限 | 6 V | - | 6 V | - | 6 V | 6 V | 6 V |
标称供电电压 (Vsup) | 3 V | - | 3 V | - | 3 V | 3 V | 3 V |
表面贴装 | YES | - | YES | - | YES | YES | YES |
技术 | CMOS | - | CMOS | - | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | - | INDUSTRIAL | - | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | - | NO LEAD | - | NO LEAD | NO LEAD | GULL WING |
端子节距 | 0.65 mm | - | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.635 mm |
端子位置 | DUAL | - | DUAL | - | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 20 | - | 20 | - | 20 | 20 | 20 |
标称均一增益带宽 | 14000 kHz | - | 14000 kHz | - | 14000 kHz | 14000 kHz | 14000 kHz |
宽度 | 3 mm | - | 3 mm | - | 3 mm | 3 mm | 3.899 mm |
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