IC,EPROM,32KX16,CMOS,LDCC,44PIN,PLASTIC
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
Objectid | 101160366 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
最长访问时间 | 200 ns |
I/O 类型 | COMMON |
JESD-30 代码 | S-PQCC-J44 |
JESD-609代码 | e0 |
内存密度 | 524288 bit |
内存宽度 | 16 |
端子数量 | 44 |
字数 | 32768 words |
字数代码 | 32000 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 32KX16 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC44,.7SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
电源 | 5 V |
认证状态 | Not Qualified |
最大待机电流 | 0.0001 A |
最大压摆率 | 0.03 mA |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
M27C516-20XC6 | M27C516-20N1 | M27C516-12XN1 | M27C516-12C6 | M27C516-12XC6 | M27C516-20C6 | |
---|---|---|---|---|---|---|
描述 | IC,EPROM,32KX16,CMOS,LDCC,44PIN,PLASTIC | IC,EPROM,32KX16,CMOS,TSSOP,40PIN,PLASTIC | IC,EPROM,32KX16,CMOS,TSSOP,40PIN,PLASTIC | IC,EPROM,32KX16,CMOS,LDCC,44PIN,PLASTIC | IC,EPROM,32KX16,CMOS,LDCC,44PIN,PLASTIC | IC,EPROM,32KX16,CMOS,LDCC,44PIN,PLASTIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
最长访问时间 | 200 ns | 200 ns | 120 ns | 120 ns | 120 ns | 200 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | S-PQCC-J44 | R-PDSO-G40 | R-PDSO-G40 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
端子数量 | 44 | 40 | 40 | 44 | 44 | 44 |
字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | - | - | -40 °C | -40 °C | -40 °C |
组织 | 32KX16 | 32KX16 | 32KX16 | 32KX16 | 32KX16 | 32KX16 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | TSSOP | TSSOP | QCCJ | QCCJ | QCCJ |
封装等效代码 | LDCC44,.7SQ | TSSOP40,.56,20 | TSSOP40,.56,20 | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
最大压摆率 | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | J BEND | GULL WING | GULL WING | J BEND | J BEND | J BEND |
端子节距 | 1.27 mm | 0.5 mm | 0.5 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | DUAL | DUAL | QUAD | QUAD | QUAD |
Objectid | 101160366 | - | - | 101160358 | 101160359 | 101160365 |
ECCN代码 | EAR99 | - | - | EAR99 | EAR99 | EAR99 |
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