`
REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
06-03-09
APPROVED
Thomas M. Hess
A
Add footnotes to figure 3, switching waveforms and test circuit.
Update the boilerplate to current requirements as specified in
MIL-PRF-38535. Editorial changes throughout – jak.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
9
A
10
A
11
A
12
A
13
PREPARED BY
Marcia B. Kelleher
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Monica L. Poelking
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
89-11-20
REVISION LEVEL
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS,
PHASE LOCKED LOOP WITH VOLTAGE
CONTROLLED OSCILLATOR, MONOLITHIC
SILICON
SIZE
CAGE CODE
AMSC N/A
A
A
SHEET
67268
1 OF
13
5962-89609
DSCC FORM 2233
APR 97
5962-E218-06
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-89609
01
E
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
54HC4046A
Circuit function
Phase-locked loop with voltage controlled oscillator
1.2.2 Case outline. The case outline are as designated in MIL-STD-1835 and as follows:
Outline letter
E
Descriptive designator
GDIP1-T16 or CDIP2-T16
Terminals
16
Package style
Dual-in-line
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings. 1/
Supply voltage range (V
CC
) ..........................................................................
DC input voltage range (V
IN
) ........................................................................
DC output voltage range (V
OUT
) ...................................................................
Clamp diode current (I
IK
, I
OK
)........................................................................
DC drain current (I
OUT
) .................................................................................
DC V
CC
or GND current (I
CC
, I
GND
) ...............................................................
Storage temperature range (T
STG
) ...............................................................
Maximum power dissipation (P
D
) .................................................................
Lead temperature (soldering, 10 seconds)....................................................
Thermal resistance, junction-to-case (θ
JC
) ....................................................
Junction temperature (T
J
) .............................................................................
1.4 Recommended operating conditions.
Supply voltage range (V
CC
) ...........................................................................
Case operating temperature range (T
C
) ........................................................
Input voltage range (V
IN
) ...............................................................................
Output voltage range (V
OUT
)..........................................................................
Input rise or fall time (t
r
, t
f
):
V
CC
= 2.0 V ................................................................................................
V
CC
= 4.5 V ................................................................................................
V
CC
= 6.0 V ................................................................................................
+2.0 Vdc to +6.0 Vdc
-55°C to +125°C
0.0 V dc to V
CC
0.0 V dc to V
CC
0 to 1000 ns
0 to 500 ns
0 to 400 ns
-0.5 Vdc to +7.0 V dc
-0.5 Vdc to V
CC
+ 0.5 Vdc
-0.5 Vdc to V
CC
+ 0.5 Vdc
±20
mA
±25
mA
±50
mA
-65°C to +150°C
500 mW 2/
+300°C
See MIL-STD-1835
+175°C
1/ Unless other wise specified, all voltages are referenced to ground.
2/ For T
A
= +100°C to +125°C, derate linearly at 8 mW/°C to 300mW.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89609
SHEET
A
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for
non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified
Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional
certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program
plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality
Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or
function of the device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Logic diagram. The logic diagram shall be as specified on figure 2.
3.2.4 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 3.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89609
SHEET
A
3
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN
number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of
MIL-PRF-38535, appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89609
SHEET
A
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/
-55°C
≤
T
C
≤
+125°C
unless otherwise specified
V
CC
Group A
subgroups
Limits
Min
VOLTAGE-CONTROLLED OSCILLATOR SECTION
High level output voltage
V
OH
V
IN
= V
IH
minimum or V
IL
maximum
⎮I
O
⎮ ≤
20
µA
V
IN
= V
IH
minimum or V
IL
maximum
⎮I
O
⎮ ≤
4.0 mA
V
IN
= V
IH
minimum or V
IL
maximum
⎮I
O
⎮ ≤
5.2 mA
V
IN
= V
IH
minimum or V
IL
maximum
⎮I
O
⎮ ≤
20
µA
V
IN
= V
IH
minimum or V
IL
maximum
⎮I
O
⎮ ≤
4.0 mA
V
IN
= V
IH
minimum or V
IL
maximum
⎮I
O
⎮ ≤
5.2 mA
2/
3.0 V
4.5 V
6.0 V
4.5 V
6.0 V
3.0 V
4.5 V
6.0 V
4.5 V
6.0 V
3.0 V
4.5 V
6.0 V
Low level input voltage
V
IL
3.0 V
2/
4.5 V
6.0 V
Input leakage current
R1 and R2 range
C1 capacitance range
VCO
IN
operating voltage
range
Frequency stability with
temperature change
Maximum frequency
I
IN
R
RNG
C
RNG
V
OP
V
IN
= V
CC
or GND
3/ 4/
4/
4/ 6/
6.0 V
4.5 V
4.5 V
3.0 V
4.5 V
6.0 V
4.5 V
4.5 V
4.5 V
4.5 V
4.5 V
4.5 V
1, 2, 3
2.9
4.4
5.9
3.98
5.48
0.1
0.1
0.1
0.4
0.4
2.1
3.15
4.2
0.9
1.35
1.8
±1.0
300
5/
1.9
3.2
4.6
0.11
V
Max
Unit
1, 2, 3
1, 2, 3
1, 2, 3
V
V
V
Low level output voltage
V
OL
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1
1
1
1
1
9
9
9
9
9
9
400
V
V
V
V
V
V
V
V
µA
kΩ
pF
V
High level input voltage
V
IH
3.0
0.0
0.9
0.9
0.9
∆f/∆T
4/
f
MAX
4/
R1 = 100 kΩ, R2 =
∞
%/°C
MHz
MHz
MHz
C1 = 50 pF, R1 = 3.5 kΩ
R2 =
24
38
17
0.4
∞
C1 = 0 pF, R1 = 9.1 kΩ
Center frequency
Frequency linearity
Offset frequency
f
CTR
4/
∆f
VCO
4/
f
OFF
4/
R2 =
∞
C1 = 40 pF, R1 = 3 kΩ
R2 =
∞,
VCO
IN
= V
CC
/2
C1 = 100 pF, R1 = 100 kΩ
R2 =
%
kHz
∞
R2 = 220 kΩ
C1 = 1 nF
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89609
SHEET
A
5
51单片机
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