Video/Imaging Fixed-Point Digital Signal Processor 548-FCBGA
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | BGA |
| 包装说明 | FBGA, BGA548,26X26,32 |
| 针数 | 548 |
| Reach Compliance Code | compli |
| ECCN代码 | 3A991.A.2 |
| Factory Lead Time | 1 week |
| Is Samacsys | N |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY |
| 地址总线宽度 | 23 |
| 桶式移位器 | NO |
| 位大小 | 32 |
| 边界扫描 | YES |
| 最大时钟频率 | 75 MHz |
| 外部数据总线宽度 | 32 |
| 格式 | FIXED POINT |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-PBGA-B548 |
| JESD-609代码 | e1 |
| 长度 | 23 mm |
| 低功率模式 | YES |
| 湿度敏感等级 | 4 |
| 端子数量 | 548 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | FBGA |
| 封装等效代码 | BGA548,26X26,32 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.4,3.3 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 16384 |
| 座面最大高度 | 2.5 mm |
| 最大供电电压 | 1.44 V |
| 最小供电电压 | 1.36 V |
| 标称供电电压 | 1.4 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 23 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 |
| TMS320DM641AZDK6 | TMS320DM640AGNZ4 | TMS320DM640AZDK4 | TMS320DM640AZDKA4 | TMS320DM640AZNZA4 | TMS320DM641AGNZ5 | TMS320DM641AZNZ5 | TMS320DM641AZNZ6 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Video/Imaging Fixed-Point Digital Signal Processor 548-FCBGA | Video/Imaging Fixed-Point Digital Signal Processor 548-FCBGA | Video/Imaging Fixed-Point Digital Signal Processor 548-FCBGA | Video/Imaging Fixed-Point Digital Signal Processor 548-FCBGA | Digital Signal Processors & Controllers - DSP, DSC Video/Imaging Fixed Pt Dig Sig Proc | Digital Signal Processors & Controllers - DSP, DSC Video/Imaging Fixed Pt Dig Signal Proc | Video/Imaging Fixed-Point Digital Signal Processor 548-FCBGA | Video/Imaging Fixed-Point Digital Signal Processor 548-FCBGA |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 不符合 | 符合 | 不符合 | 符合 | 不符合 | 符合 | 符合 |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | FBGA, BGA548,26X26,32 | BGA, BGA548,26X26,40 | FBGA, BGA548,26X26,32 | FBGA, BGA548,26X26,32 | BGA, BGA548,26X26,40 | 27 X 27 MM, 1 MM PITCH, PLASTIC, BGA-548 | BGA-548 | BGA-548 |
| 针数 | 548 | 548 | 548 | 548 | 548 | 548 | 548 | 548 |
| Reach Compliance Code | compli | _compli | compli | compli | compli | _compli | compli | compli |
| ECCN代码 | 3A991.A.2 | 3A001.A.3 | 3A991.A.2 | 3A991.A.2 | 3A001.A.3 | 3A001.A.3 | 3A991.A.2 | 3A991.A.2 |
| Factory Lead Time | 1 week | 1 week | 1 week | 1 week | 1 week | 1 week | 6 weeks | 6 weeks |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY |
| 地址总线宽度 | 23 | 23 | 23 | 23 | 23 | 23 | 23 | 23 |
| 桶式移位器 | NO | NO | NO | NO | NO | NO | NO | NO |
| 位大小 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 边界扫描 | YES | YES | YES | YES | YES | YES | YES | YES |
| 最大时钟频率 | 75 MHz | 75 MHz | 75 MHz | 75 MHz | 75 MHz | 75 MHz | 75 MHz | 75 MHz |
| 外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | S-PBGA-B548 | S-PBGA-B548 | S-PBGA-B548 | S-PBGA-B548 | S-PBGA-B548 | S-PBGA-B548 | S-PBGA-B548 | S-PBGA-B548 |
| 长度 | 23 mm | 27 mm | 23 mm | 23 mm | 27 mm | 27 mm | 27 mm | 27 mm |
| 低功率模式 | YES | YES | YES | YES | YES | YES | YES | YES |
| 端子数量 | 548 | 548 | 548 | 548 | 548 | 548 | 548 | 548 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | FBGA | BGA | FBGA | FBGA | BGA | BGA | BGA | BGA |
| 封装等效代码 | BGA548,26X26,32 | BGA548,26X26,40 | BGA548,26X26,32 | BGA548,26X26,32 | BGA548,26X26,40 | BGA548,26X26,40 | BGA548,26X26,40 | BGA548,26X26,40 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, FINE PITCH | GRID ARRAY | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 峰值回流温度（摄氏度） | 260 | 220 | 260 | 260 | 260 | NOT SPECIFIED | 260 | 260 |
| 电源 | 1.4,3.3 V | 1.4,3.3 V | 1.4,3.3 V | 1.4,3.3 V | 1.2,3.3 V | 1.4,3.3 V | 1.4,3.3 V | 1.4,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字数） | 16384 | 16384 | 16384 | 16384 | 4096 | 16384 | 16384 | 16384 |
| 座面最大高度 | 2.5 mm | 2.8 mm | 2.5 mm | 2.5 mm | 2.8 mm | 2.8 mm | 2.8 mm | 2.8 mm |
| 最大供电电压 | 1.44 V | 1.26 V | 1.26 V | 1.26 V | 1.26 V | 1.26 V | 1.26 V | 1.44 V |
| 最小供电电压 | 1.36 V | 1.14 V | 1.14 V | 1.14 V | 1.14 V | 1.14 V | 1.14 V | 1.36 V |
| 标称供电电压 | 1.4 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.4 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 1 mm | 0.8 mm | 0.8 mm | 1 mm | 1 mm | 1 mm | 1 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 23 mm | 27 mm | 23 mm | 23 mm | 27 mm | 27 mm | 27 mm | 27 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| 是否无铅 | 不含铅 | - | 不含铅 | - | 含铅 | 含铅 | 不含铅 | 不含铅 |
| JESD-609代码 | e1 | e0 | e1 | e1 | e1 | - | e1 | e1 |
| 湿度敏感等级 | 4 | 4 | 4 | 4 | 4 | - | 4 | 4 |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn/Pb) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 集成缓存 | - | YES | YES | YES | - | - | YES | YES |
| DMA 通道数量 | - | 64 | 64 | 64 | - | - | 64 | 64 |
| 外部中断装置数量 | - | 4 | 4 | 4 | - | - | 4 | 4 |
| 计时器数量 | - | 3 | 3 | 3 | - | - | 3 | 3 |
| 最高工作温度 | - | 90 °C | 90 °C | 90 °C | - | - | 90 °C | 90 °C |
| 温度等级 | - | OTHER | OTHER | OTHER | - | - | OTHER | OTHER |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
