Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPB036N12N3 G
MA000918620
PG-TO263-7-3
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
17.914
0.803
0.241
801.714
19.664
8.447
92.914
461.757
12.317
0.269
0.001
0.260
0.208
9.933
0.032
0.106
106.210
Average
Mass
[%]
1.17
0.05
0.02
52.30
1.28
0.55
6.06
30.13
0.80
0.02
0.00
0.02
0.01
0.65
0.00
0.01
6.93
29. August 2013
1532.79 mg
Sum
[%]
1.17
Average
Mass
[ppm]
11687
524
157
52.37
1.28
523043
12829
5511
60618
36.74
0.80
301252
8035
176
0.02
0
170
136
0.68
6480
21
69
6.94
69292
69382
1000000
6786
176
367381
8035
523724
12829
Sum
[ppm]
11687
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com