Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SPD30P06P G
MA000444030
PG-TO252-3-311
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
inorganic material
plastics
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
antimonytrioxide
brominated resin
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
tin
silver
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1309-64-4
-
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-31-5
7440-22-4
7439-92-1
Issued
Weight*
Weight
[mg]
3.913
0.162
0.049
162.275
1.042
1.968
2.109
2.250
18.981
115.293
3.740
0.086
0.000
0.063
0.079
3.030
Average
Mass
[%]
1.24
0.05
0.02
51.51
0.33
0.62
0.67
0.71
6.02
36.60
1.19
0.03
0.00
0.02
0.03
0.96
29. August 2013
315.04 mg
Sum
[%]
1.24
Average
Mass
[ppm]
12422
516
155
51.58
0.33
515089
3306
6248
6694
7141
60250
44.62
1.19
365961
11872
274
0.03
1
201
252
1.01
9618
10071
1000000
275
446294
11872
515760
3306
Sum
[ppm]
12422
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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