NLX2G32
Dual 2-Input OR Gate
The NLX2G32 is a high performance dual 2−input OR Gate
operating from a 1.65 V to 5.5 V supply.
Features
•
•
•
•
•
•
•
•
•
•
Extremely High Speed: t
PD
2.5 ns (typical) at V
CC
= 5 V
Designed for 1.65 V to 5.5 V V
CC
Operation
Over Voltage Tolerant Inputs
LVTTL Compatible
−
Interface Capability With 5 V TTL Logic with
V
CC
= 3 V
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
Replacement for NC7WZ32
Chip Complexity: FET = 120
These are Pb−Free Devices
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MARKING
DIAGRAMS
ULLGA8
1.45 x 1.0
CASE 613AA
YM
1
1
ULLGA8
1.6 x 1.0
CASE 613AB
ATM
G
1
A1
1
8
V
CC
ULLGA8
1.95 x 1.0
CASE 613AC
ATM
G
B1
2
7
Y1
UDFN8
1.45 x 1.0
CASE 517BZ
XM
1
Y2
3
6
B2
UDFN8
1.6 x 1.0
CASE 517BY
XM
1
GND
4
5
A2
IEEE/IEC
UDFN8
1.95 x 1.0
CASE 517CA
Y1
Y2
XX
M
G
XM
1
Figure 1. Pinout
A1
B1
A2
B2
w1
= Specific Device Code
= Date Code
= Pb−Free Package
PIN ASSIGNMENT
Pin
1
2
3
4
5
6
7
8
Function
A1
B1
Y2
GND
A2
B2
Y1
V
CC
Figure 2. Logic Symbol
ORDERING INFORMATION
FUNCTION TABLE
Input
A
L
L
H
H
B
L
H
L
H
Output
Y=A+B
Y
L
H
H
H
See detailed ordering and shipping information in the
package dimensions section on page 4 of this data sheet.
©
Semiconductor Components Industries, LLC, 2012
July, 2012
−
Rev. 1
1
Publication Order Number:
NLX2G32/D
NLX2G32
MAXIMUM RATINGS
Symbol
V
CC
V
I
V
O
I
IK
I
OK
I
O
I
CC
I
GND
T
STG
T
L
T
J
q
JA
P
D
MSL
F
R
V
ESD
DC Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Sink Current
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature under Bias
Thermal Resistance
Power Dissipation in Still Air at 85°C
Moisture Sensitivity
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 28 to 34
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Above V
CC
and Below GND at 85°C (Note 5)
(Note 1)
V
I
< GND
V
O
< GND
Parameter
Value
*0.5
to
)7.0
*0.5
to
)7.0
*0.5
to
)7.0
*50
*50
$50
$100
$100
*65
to
)150
260
)150
250
250
Level 1
UL 94 V−0 @ 0.125 in
> 2000
> 200
N/A
$500
V
Unit
V
V
V
mA
mA
mA
mA
mA
°C
°C
°C
°C/W
mW
I
Latch−Up
Latch−Up Performance
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
V
I
V
O
T
A
Dt/DV
Supply Voltage
Input Voltage
Output Voltage
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
V
CC
= 1.8 V
$0.15
V
V
CC
= 2.5 V
$0.2
V
V
CC
= 3.0 V
$0.3
V
V
CC
= 5.0 V
$0.5
V
Parameter
Operating
Data Retention Only
(Note 6)
(HIGH or LOW State)
Min
1.65
1.5
0
0
*40
0
0
0
0
Max
5.5
5.5
5.5
V
CC
)85
20
20
10
5
Unit
V
V
V
°C
ns/V
6. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level.
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2
NLX2G32
DC ELECTRICAL CHARACTERISTICS
V
CC
Symbol
V
IH
V
IL
V
OH
Parameter
HIGH Level Input Voltage
LOW Level Input Voltage
HIGH Level Output Voltage
V
IN
= V
IH
I
OH
=
−100
mA
Condition
(V)
1.65 to 1.95
1.65 to 1.95
2.3 to 5.5
1.65
2.3
3.0
4.5
1.65
2.3
3.0
3.0
4.5
1.65
2.3
3.0
4.5
1.65
2.3
3.0
3.0
4.5
0 to 5.5
0.0
5.5
1.55
2.2
2.9
4.4
1.29
1.9
2.4
2.3
3.8
1.65
2.3
3.0
4.5
1.52
2.15
2.8
2.68
4.2
0
0
0
0
0.08
0.1
0.15
0.22
0.22
0.1
0.1
0.1
0.1
0.24
0.3
0.4
0.55
0.55
$0.1
1.0
1.0
$1.0
10
10
mA
mA
Min
0.75 V
CC
0.7 V
CC
0.3 V
CC
1.55
2.2
2.9
4.4
1.20
1.9
2.4
2.3
3.8
V
T
A
= +255C
Typ
Max
T
A
=
−405C
to
+855C
Min
0.75 V
CC
0.7 V
CC
0.3 V
CC
Max
Unit
V
V
V
I
OH
=
−4
mA
I
OH
=
−8
mA
I
OH
=
−16
mA
I
OH
=
−24
mA
I
OH
=
−32
mA
V
OL
Low−Level Output Voltage
V
IN
= V
IL
I
OL
= 100
mA
I
OH
= 4 mA
I
OH
= 8 mA
I
OH
= 16 mA
I
OH
= 24 mA
I
OH
= 32 mA
I
IN
I
OFF
I
CC
Input Leakage Current
Power OFF Leakage Cur-
rent
Quiescent Supply Current
V
IN
= V
CC
or GND
V
IN
or V
OUT
= 5.5 V
V
IN
= V
CC
or GND
AC ELECTRICAL CHARACTERISTICS
t
R
= t
F
= 3.0 ns
V
CC
Symbol
t
PLH
t
PHL
Parameter
Propagation Delay
(Figure 3 and 4)
Condition
R
L
= 1 MW, C
L
= 15 pF
R
L
= 1 MW, C
L
= 15 pF
R
L
= 500
W,
C
L
= 50 pF
R
L
= 1 MW, C
L
= 15 pF
R
L
= 500
W,
C
L
= 50 pF
5.0
$
0.5
(V)
1.8
$
0.15
2.5
$
0.2
3.3
$
0.3
Min
2.0
1.0
0.8
1.2
0.5
0.8
T
A
= 255C
Typ
8.0
3.5
2.6
3.2
1.9
2.5
Max
9.5
5.8
3.9
4.8
3.1
3.7
*405C
v
T
A
v
855C
Min
2.0
1.0
0.8
1.2
0.5
0.8
Max
10.5
6.2
4.3
5.2
3.3
4.0
Unit
ns
CAPACITIVE CHARACTERISTICS
Symbol
C
IN
C
PD
Input Capacitance
Power Dissipation Capacitance
(Note 7)
Parameter
Condition
V
CC
= 5.5 V, V
I
= 0 V or V
CC
10 MHz, V
CC
= 3.3 V, V
I
= 0 V or V
CC
10 MHz, V
CC
= 5.5 V, V
I
= 0 V or V
CC
Typical
2.5
9
11
Unit
pF
pF
7. C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I
CC(OPR
)
= C
PD
V
CC
f
in
+ I
CC
. C
PD
is used to determine the no−load dynamic
power consumption; P
D
= C
PD
V
CC2
f
in
+ I
CC
V
CC
.
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3
NLX2G32
t
f
= 3 ns
90%
50%
10%
90%
50%
10%
t
f
= 3 ns
V
CC
INPUT
GND
R
L
V
OH
C
L
INPUT
A and B
OUTPUT
t
PHL
t
PLH
OUTPUT Y
50%
50%
V
OL
A 1−MHz square input wave is recommended for
propagation delay tests.
Figure 3. Switching Waveform
Figure 4. Test Circuit
DEVICE ORDERING INFORMATION
Device Order Number
NLX2G32AMX1TCG
NLX2G32BMX1TCG
NLX2G32CMX1TCG
NLX2G32DMUTCG
NLX2G32EMUTCG
NLX2G32FMUTCG
Package Type
ULLGA, 1.95x1
(Pb−Free)
ULLGA, 1.6x1
(Pb−Free)
ULLGA, 1.45x1
(Pb−Free)
UDFN8, 1.95 x 1.0, 0.5P
(Pb−Free)
UDFN8, 1.6 x 1.0, 0.4P
(Pb−Free)
UDFN8, 1.45 x 1.0, 0.35P
(Pb−Free)
Tape and Reel Size
†
178 mm, 3000 Units / Tape & Reel
178 mm, 3000 Units / Tape & Reel
178 mm, 3000 Units / Tape & Reel
3000 Units / Tape & Reel
3000 Units / Tape & Reel
3000 Units / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NLX2G32
PACKAGE DIMENSIONS
UDFN8 1.6x1.0, 0.4P
CASE 517BY
ISSUE O
D
A B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
DIM
A
A1
A3
b
D
E
e
L
L1
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
1.60 BSC
1.00 BSC
0.40 BSC
0.25
0.35
0.30
0.40
2X
2X
0.10 C
0.10 C
0.05 C
0.05 C
SIDE VIEW
e/2
e
1
4
7X
L1
ÉÉÉ
ÉÉÉ
8
PIN ONE
REFERENCE
E
TOP VIEW
A3
A
A1
C
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
0.49
7X
L
0.26
8X
1.24
5
8X
b
0.10
0.05
0.53
M
M
1
PKG
OUTLINE
C A B
C
NOTE 3
0.40
PITCH
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
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