Multilayer Chip Diplexers
FEATURES
• LOW INSERTION LOSS
• HIGH ATTENTUATION
• LOW COST LTCC CONSTRUCTION
• SURFACE MOUNTABLE CONSTRUCTION
• TAPED AND REELED FOR AUTOMATIC INSERTION
RoHS
Compliant
NGD_C Series
includes all homogeneous materials
*See Part Number System for Details
CHARACTERISTICS
Case Code
Low Frequency Range (Min.)
High Frequency Range (Max.)
Operating Temperature Range
Impedance
Resistance to Solder Heat
0603
2400 ~ 2500 MHz
9800 ~ 11800 MHz
0805
Refer to Part
Number Table
-40°C ~ +85°C
50Ω
+260°C for 10 seconds
1210
900 ~ 1450 MHz
1650 ~ 2200 MHz
DIMENSIONS (mm)
Case Code
NGD0603C
NGD0805C
NGD1210C
DIMENSIONS
A
1.6 ± 0.1
2.0 ± 0.15
3.2 ± 0.2
B
0.8 ± 0.1
1.2 ± 0.15
2.5 ± 0.2
C
0.6 ± 0.1
0.95 ± 0.1
0.8 ± 0.1
1.5 ± 0.1
D
0.15 ± 0.1
0.2 ± 0.1
0.3 ± 0.2
E
0.2 ± 0.1
0.3 ± 0.15
0.55 ± 0.2
F
0.5 ± 0.1
0.65 ± 0.1
1.0 ± 0.1
G
0.3
0.75
1.6
LAND PATTERNS
H
0.55
0.5
0.95
I
0.25
0.35
0.6
J
0.5
0.65
-
K
-
-
0.35
COMPONENT LAYOUT
A
(3)
B
(4)
(5)
(6)
D
F
(2)
(1)
C
E
LAND PATTERNS
J
H
K
G
I
Refer to Part Number
Table for PIN Layout
PART NUMBER SYSTEM
NGD 0805C
2R450
G1
TR F
RoHS Compliant
Packaging: TR = Tape & Reel
Layout Code
Frequency Code (Ghz): “R” indicates decimal
Size Code (see dimensions table for details)
Series
®
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Specifications are subject to change
1
Multilayer Chip Diplexers
NGD0603C Size
NGD_C Series
Standard Values - Case Size 0603 (1.6 x 0.8 x 0.6mm)
Part Number
Frequency
Range
Impedance
(Ω)
Frequency
(MHz)
2400 ~ 2500
Low
NGD0603C2R450G1TRF
High
50
4800 ~ 6000
7200 ~ 7500
2400 ~ 2500
4900 ~ 5900
9800 ~ 11800
2400 ~ 2500
Low
NGD0603C2R450G2TRF
High
50
4800 ~ 6000
7200 ~ 7500
2400 ~ 2500
4900 ~ 5900
9800 ~ 11800
Max. IL in BW
@ 25°C (dB)
1.0
-
-
-
1.6
-
1.0
-
-
-
1.6
-
Ripple in
BW @
25°C (dB)
0.5
-
-
-
1.0
-
0.5
-
-
-
1.0
-
Max. VSWR
in BW @
25°C (dB)
2.0
-
-
-
2.0
-
2.0
-
-
-
2.0
-
Min.
Attenuation
@ 25°C (dB)
-
18
18
18
-
15
-
18
18
18
-
15
PIN
NGD0603C2R450G1TRF
NGD0603C2R450G2TRF
(1)
High
Low
(2)
Ground
(3)
Low
High
(4)
Ground
(5)
Common
(6)
Ground
(3)
(4)
(2)
(5)
(1)
(6)
®
2
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Specifications are subject to change
Multilayer Chip Diplexers
NGD0805C Size
Standard Values - Case Size 0805 (2.0 x 1.2 mm)
Part Number
Frequency
Range
Impedance
(Ω)
Frequency
(MHz)
824 ~ 960
Low
50
High
1710 ~ 1880
1880 ~ 1990
2400 ~ 2500
824 ~ 1990
2400 ~ 2500
2400 ~ 2500
Low
NGD0805C2R450G2TRF
(C:
0.95 ± 0.1 mm)
High
50
4800 ~ 6000
7200 ~ 7500
4900 ~ 5900
1800 ~ 2500
10300 ~ 10700
824 ~ 915
1545 ~ 1610
1710 ~ 1990
Low
NGD0805C2R450G3TRF
(C:
0.8 ± 0.1 mm)
50
2110 ~ 2170
2400 ~ 2500
4800 ~ 5000
7200 ~ 7500
1545 ~ 1610
High
2400 ~ 2500
5150 ~ 5850
10300 ~ 11700
824 ~ 915
1545 ~ 1610
1710 ~ 1990
Low
NGD0805C2R450G4TRF
(C:
0.8 ± 0.1 mm)
50
2110 ~ 2170
2400 ~ 2500
4800 ~ 5000
7200 ~ 7500
1545 ~ 1610
High
2400 ~ 2500
5150 ~ 5850
10300 ~ 11700
Max. IL in BW
@ 25°C (dB)
0.6
1.0
1.5
-
-
2.0
0.7
-
-
1.0
-
-
-
-
-
-
2.4
-
-
-
-
1.2
-
-
-
-
-
2.4
-
-
-
-
1.2
-
Ripple in
BW @
25°C (dB)
0.3
0.5
0.7
-
-
1.0
0.3
-
-
0.5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
NGD_C Series
Max. VSWR
in BW @
25°C (dB)
2.0
2.0
2.0
-
-
2.0
2.0
-
-
2.0
-
-
-
-
-
-
2.0
-
-
-
-
2.0
-
-
-
-
-
2.0
-
-
-
-
2.0
-
Min.
Attenuation
@ 25°C (dB)
-
-
-
15
20
-
-
18
18
-
19
25
28
28
24
18
-
27
20
25
25
-
20
28
28
24
18
-
27
20
25
25
-
20
NGD0805C2R450G1TRF
(C:
0.95 ± 0.1 mm)
PIN
NGD0805C2R450G1TRF
NGD0805C2R450G2TRF
NGD0805C2R450G3TRF
NGD0805C2R450G4TRF
(1)
High
High
Low
High
(2)
Ground
Ground
(3)
Low
Low
High
Low
(4)
Ground
Ground
(5)
Common
Common
(6)
Ground
Ground
(3)
(4)
(2)
(5)
(1)
(6)
®
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Specifications are subject to change
3
Multilayer Chip Diplexers
NGD1210C Size
NGD_C Series
Standard Values - Case Size 1210 (3.2 x 2.5 x 1.8mm)
Part Number
Frequency
Range
Impedance
(Ω)
Frequency
(MHz)
900 ~ 1450
1425 ~ 1450
Low
1450 ~ 1475
1650 ~ 2200
NGD1210C2R200G1TRF
50
1800
900 ~ 1450
1300
High
1625 ~ 1650
1650 ~ 1675
1650 ~ 2200
Max. IL in BW
@ 25°C (dB)
2.2
-
-
-
-
-
-
-
-
2.2
Ripple in
BW @
25°C (dB)
1.6
0.3
1.0
-
-
-
-
1.0
0.3
1.6
Max. VSWR
in BW @
25°C (dB)
2.0
-
-
-
-
-
-
-
-
2.0
Min.
Attenuation
@ 25°C (dB)
-
-
-
27
30
27
30
-
-
-
PIN
NGD1210C2R200G1TRF
(1)
Ground
(2)
Common
(3)
Ground
(4)
High
(5)
Ground
(6)
Low
(6)
(1)
(5)
(2)
(4)
(3)
®
4
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Specifications are subject to change
Multilayer Chip Diplexers
CARRIER TAPING DIMENSIONS (mm) AND REEL QUANTITY
Tape
Paper
Embossed
NGD_C Series
Case Size
NGD0603C
NGD0805C
NGD1210C
Ao
1.00
1.42
2.75
Bo
1.80
2.25
3.45
Po
So
Co
Ko
0.75 max.
1.14 max.
1.80 max.
t
-
0.27 max.
W
Qty
4,000
4,000
2,000
4.0
2.0 ±0.05
3.5 ± 0.1
8.0 ± 0.3
1.75mm ±0.1
So
4.0mm ±0.1
1.5mm ± 0.1
t
Co
W
Bo
Ao
Po
Ko
(Paper)
Ko
(Embossed)
Tape Width
NGD0603C
NGD0805C
NGD1210C
D
B
REEL DIMENSIONS (mm)
A(mm)
9.0 ± 1.5
B(mm)
58 ± 2.0
D(mm)
178 ± 2.0
A
REFLOW SOLDERING PROFILE
®
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Specifications are subject to change
5
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