UV PLD, 30ns, 24-Cell, CMOS, CDIP40
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DIP, DIP40,.6 |
| Reach Compliance Code | unknown |
| 其他特性 | NO |
| 系统内可编程 | NO |
| JESD-30 代码 | R-XDIP-T40 |
| JESD-609代码 | e0 |
| JTAG BST | NO |
| 宏单元数 | 24 |
| 端子数量 | 40 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP40,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 可编程逻辑类型 | UV PLD |
| 传播延迟 | 30 ns |
| 认证状态 | Not Qualified |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| ATV2500-30DC | ATV2500-40KMB | ATV2500-45DMB | ATV2500-40DMB | ATV2500-45KMB | |
|---|---|---|---|---|---|
| 描述 | UV PLD, 30ns, 24-Cell, CMOS, CDIP40 | UV PLD, 40ns, 24-Cell, CMOS, CQCC44 | UV PLD, 45ns, 24-Cell, CMOS, CDIP40 | UV PLD, 40ns, 24-Cell, CMOS, CDIP40 | UV PLD, 45ns, 24-Cell, CMOS, CQCC44 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | NO | NO | NO | NO | NO |
| 系统内可编程 | NO | NO | NO | NO | NO |
| JESD-30 代码 | R-XDIP-T40 | S-XQCC-J44 | R-XDIP-T40 | R-XDIP-T40 | S-XQCC-J44 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| JTAG BST | NO | NO | NO | NO | NO |
| 宏单元数 | 24 | 24 | 24 | 24 | 24 |
| 端子数量 | 40 | 44 | 40 | 40 | 44 |
| 最高工作温度 | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | QCCJ | DIP | DIP | QCCJ |
| 封装等效代码 | DIP40,.6 | LDCC44,.7SQ | DIP40,.6 | DIP40,.6 | LDCC44,.7SQ |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 可编程逻辑类型 | UV PLD | UV PLD | UV PLD | UV PLD | UV PLD |
| 传播延迟 | 30 ns | 40 ns | 45 ns | 40 ns | 45 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | QUAD |
| 包装说明 | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | - | DIP, DIP40,.6 | - |
| 厂商名称 | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| 筛选级别 | - | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) |
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