ULTRA HIGH SPEED 1M x 1 STATIC CMOS RAM
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Pyramid Semiconductor Corporation |
| 零件包装代码 | SOJ |
| 包装说明 | 0.400 INCH, PLASTIC, SOJ-28 |
| 针数 | 28 |
| Reach Compliance Code | compli |
| ECCN代码 | 3A991.B.2.B |
| 最长访问时间 | 15 ns |
| JESD-30 代码 | R-PDSO-J28 |
| JESD-609代码 | e0 |
| 长度 | 18.415 mm |
| 内存密度 | 1048576 bi |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 1 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 1MX1 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOJ |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.7592 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 10.16 mm |
| P4C107-15J4I | P4C107 | P4C107-10J4C | P4C107-10J4I | P4C107-12J4C | P4C107-12J4I | P4C107-15J4C | P4C107-20J4C | P4C107-20J4I | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | ULTRA HIGH SPEED 1M x 1 STATIC CMOS RAM | ULTRA HIGH SPEED 1M x 1 STATIC CMOS RAM | ULTRA HIGH SPEED 1M x 1 STATIC CMOS RAM | ULTRA HIGH SPEED 1M x 1 STATIC CMOS RAM | ULTRA HIGH SPEED 1M x 1 STATIC CMOS RAM | ULTRA HIGH SPEED 1M x 1 STATIC CMOS RAM | ULTRA HIGH SPEED 1M x 1 STATIC CMOS RAM | ULTRA HIGH SPEED 1M x 1 STATIC CMOS RAM | ULTRA HIGH SPEED 1M x 1 STATIC CMOS RAM |
| 是否无铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Pyramid Semiconductor Corporation | - | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | - | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation |
| 零件包装代码 | SOJ | - | SOJ | SOJ | SOJ | SOJ | SOJ | SOJ | SOJ |
| 包装说明 | 0.400 INCH, PLASTIC, SOJ-28 | - | SOJ, | 0.400 INCH, PLASTIC, SOJ-28 | SOJ, | 0.400 INCH, PLASTIC, SOJ-28 | SOJ, | 0.400 INCH, PLASTIC, SOJ-28 | SOJ, |
| 针数 | 28 | - | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | compli | - | compli | compli | compli | compli | compli | compli | compli |
| ECCN代码 | 3A991.B.2.B | - | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
| 最长访问时间 | 15 ns | - | 10 ns | 10 ns | 12 ns | 12 ns | 15 ns | 20 ns | 20 ns |
| JESD-30 代码 | R-PDSO-J28 | - | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-J28 |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 18.415 mm | - | 18.415 mm | 18.415 mm | 18.415 mm | 18.415 mm | 18.415 mm | 18.415 mm | 18.415 mm |
| 内存密度 | 1048576 bi | - | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi |
| 内存集成电路类型 | STANDARD SRAM | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | - | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 1048576 words | - | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | - | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | - | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C |
| 组织 | 1MX1 | - | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOJ | - | SOJ | SOJ | SOJ | SOJ | SOJ | SOJ | SOJ |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.7592 mm | - | 3.7592 mm | 3.7592 mm | 3.7592 mm | 3.7592 mm | 3.7592 mm | 3.7592 mm | 3.7592 mm |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | - | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | - | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | J BEND | - | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
| 端子节距 | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 10.16 mm | - | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
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