HSMS-281x
Surface Mount RF Schottky Barrier Diodes
Data Sheet
Description/Applications
These Schottky diodes are specifically designed for both
analog and digital applications. This series offers a wide
range of specifications and package configurations to
give the designer wide flexibility. The HSMS‑281x series of
diodes features very low flicker (1/f ) noise.
Note that Avago’s manufacturing techniques assure that
dice found in pairs and quads are taken from adjacent
sites on the wafer, assuring the highest degree of match.
Features
•
Surface Mount Packages
•
Low Flicker Noise
•
Low FIT (Failure in Time) Rate*
•
Six‑sigma Quality Level
•
Single, Dual and Quad Versions
•
Tape and Reel Options Available
•
Lead‑free
•
For more information see the Surface Mount Schottky
Reliability Data Sheet.
Pin Connections and Package Marking
1
2
3
6
5
4
Package Lead Code Identification, SOT-23/SOT-143
(Top View)
SINGLE
3
SERIES
3
COMMON
ANODE
3
COMMON
CATHODE
3
Notes:
1. Package marking provides orientation and identification.
2. See “Electrical Specifications” for appropriate package marking.
Package Lead Code Identification, SOT-323
(Top View)
SINGLE
SERIES
B
COMMON
ANODE
GUx
E
1
#0
2
1
#2
2
1
#3
2
1
#4
2
UNCONNECTED
PAIR
3
4
RING
QUAD
3
4
BRIDGE
QUAD
3
4
1
#5
2
1
#7
2
1
#8
2
Package Lead Code Identification, SOT-363
(Top View)
HIGH ISOLATION
UNCONNECTED PAIR
6
5
4
UNCONNECTED
TRIO
6
5
4
C
COMMON
CATHODE
1
2
K
3
1
2
L
3
COMMON
CATHODE QUAD
6
5
4
COMMON
ANODE QUAD
6
5
4
F
1
2
M
3
1
2
N
3
6
BRIDGE
QUAD
5
4
6
RING
QUAD
5
4
1
2
3
1
2
3
Absolute Maximum Ratings
[1]
T
C
= 25°C
Symbol
I
f
P
IV
T
j
T
stg
θ
jc
Parameter
Forward Current (1 μs Pulse)
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Thermal Resistance
[2]
Unit
Amp
V
°C
°C
°C/W
SOT-23/SOT-143
1
Same as V
BR
150
‑65 to 150
500
SOT-323/SOT-363
1
Same as V
BR
150
‑65 to 150
150
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. T
C
= +25°C, where T
C
is defined to be the temperature at the package pins where contact is made to the circuit board.
ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge.
Electrical Specifications T
C
= 25°C, Single Diode
[3]
Part
Number
HSMS
[4]
2810
2812
2813
2814
2815
2817
2818
281B
281C
281E
281F
281K
281L
Package
Marking
Code
B0
B2
B3
B4
B5
B7
B8
B0
B2
B3
B4
BK
BL
Lead
Code Configuration
0
2
3
4
5
7
8
B
C
E
F
K
L
Single
Series
Common Anode
Common Cathode
Unconnected Pair
Ring Quad
[4]
Bridge Quad
[4]
Single
Series
Common Anode
Common Cathode
High Isolation
Unconnected Pair
Unconnected Trio
Minimum Maximum
Breakdown Forward
Voltage
Voltage
V
BR
(V)
V
F
(mV)
20
410
Maximum
Forward
Voltage
V
F
(V) @
I
F
(mA)
1.0
35
Maximum
Reverse
Leakage
I
R
(nA) @
V
R
(V)
200
15
Maximum
Capacitance
C
T
(pF)
1.2
Typical
Dynamic
Resistance
R
D
(Ω)
[5]
15
Test Conditions
I
R
= 10
mA
I
F
= 1 mA
V
F
= 0 V
f = 1 MHz
I
F
= 5 mA
Notes:
1.
∆V
F
for diodes in pairs and quads in 15 mV maximum at 1 mA.
2.
∆C
TO
for diodes in pairs and quads is 0.2 pF maximum.
3. Effective Carrier Lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA.
4. See section titled “Quad Capacitance.”
5. R
D
= R
S
+ 5.2 Ω at 25°C and I
f
= 5 mA.
2
Quad Capacitance
Capacitance of Schottky diode quads is measured using
an HP4271 LCR meter. This instrument effectively isolates
individual diode branches from the others, allowing ac‑
curate capacitance measurement of each branch or each
diode. The conditions are: 20 mV R.M.S. voltage at 1 MHz.
Avago defines this measurement as “CM”, and it is equiva‑
lent to the capacitance of the diode by itself. The equiva‑
lent diagonal and adjacent capaci‑tances can then be cal‑
culated by the formulas given below.
In a quad, the diagonal capacitance is the capacitance be‑
tween points A and B as shown in the figure below. The
diagonal capacitance is calculated using the following
formula
C
3
x C
4
C
1
x C
2
C
DIAGONAL
= _______ + _______
C
1
+ C
2
C
3
+ C
4
The equivalent adjacent
2
capacitance is the capacitance
C1x C
4
C
1
x C
C
DIAGONAL
= _______ +
the
3
figure
ADJACENT
1
+
C in
_______
between points
=
A
C
and
____________
below. This capaci‑
1 1
1
C
1
+ C
the following
3
tance is calculated using
2
–– +C––+ C––
formula
+
4
C
2
C
3
C
4
1
C
ADJACENT
= C
1
+ ____________
1
1
8.33 X 10
1
-5
nT
R
j
=
–– + –– + ––
I
b
+ I
s
C
2
C
3
C
4
This information does not apply to cross‑over quad di‑
8.33 X 10
-5
nT
odes.
R
j
=
I
b
+ I
s
Linear Equivalent Circuit Model Diode Chip
R
j
R
S
C
j
R
S
= series resistance (see Table of SPICE parameters)
C
j
= junction capacitance (see Table of SPICE parameters)
R
j
=
8.33 X 10
-5
nT
I
b
+ I
s
where
I
b
= externally applied bias current in amps
I
s
= saturation current (see table of SPICE parameters)
T = temperature,
°K
n = ideality factor (see table of SPICE parameters)
Note:
To effectively model the packaged HSMS-281x product,
please refer to Application Note AN1124.
ESD WARNING:
Handling Precautions Should Be Taken To Avoid Static Discharge.
SPICE Parameters
Parameter
B
V
C
J0
E
G
I
BV
I
S
N
R
S
P
B
P
T
M
Ω
V
Units
V
pF
eV
A
A
HSMS-281x
25
1.1
0.69
E‑5
4.8E‑9
1.08
10
0.65
2
0.5
3
Typical Performance, T
C
= 25°C (unless otherwise noted), Single Diode
100
100,000
10,000
1000
I
F
– FORWARD CURRENT (mA)
10
R
D
– DYNAMIC RESISTANCE ()
15
I
R
– REVERSE CURRENT (nA)
1000
100
1
T
A
= +125C
T
A
= +75C
T
A
= +25C
T
A
= –25C
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
V
F
– FORWARD VOLTAGE (V)
100
10
1
T
A
= +125C
T
A
= +75C
T
A
= +25C
0
5
10
V
R
– REVERSE VOLTAGE (V)
0.1
10
0.01
1
0.1
1
10
100
I
F
– FORWARD CURRENT (mA)
Figure 1. Forward Current vs. Forward Voltage at
Temperatures.
1.25
Figure 2. Reverse Current vs. Reverse Voltage at
Temperatures.
30
30
I
F
(Left Scale)
Figure 3. Dynamic Resistance vs. Forward
Current.
C
T
– CAPACITANCE (pF)
1
0.75
10
10
0.50
0.25
0
V
F
(Right Scale)
1
1
0
2
4
6
8
10
12
14
16
0.3
0.2
0.4
0.6
0.8
1.0
1.2
0.3
1.4
V
R
– REVERSE VOLTAGE (V)
V
F
- FORWARD VOLTAGE (V)
Figure 4. Total Capacitance vs. Reverse Voltage.
Figure 5. Typical V
f
Match, Pairs and Quads.
4
V
F
- FORWARD VOLTAGE DIFFERENCE (mV)
I
F
- FORWARD CURRENT (mA)
Applications Information
Introduction — Product Selection
Avago’s family of Schottky products provides unique solu‑
tions to many design problems.
The first step in choosing the right product is to select
the diode type. All of the products in the HSMS‑282x fam‑
ily use the same diode chip, and the same is true of the
HSMS‑281x and HSMS‑280x families. Each family has a dif‑
ferent set of characteristics which can be compared most
easily by consulting the SPICE parameters in Table 1.
A review of these data shows that the HSMS‑280x family
has the highest breakdown voltage, but at the expense of
a high value of series resistance (R
s
). In applications which
do not require high voltage the HSMS‑282x family, with a
lower value of series resistance, will offer higher current
carrying capacity and better performance. The HSMS‑281x
family is a hybrid Schottky (as is the HSMS‑280x), offering
lower 1/f or flicker noise than the HSMS‑282x family.
In general, the HSMS‑282x family should be the designer’s
first choice, with the ‑280x family reserved for high volt‑
age applications and the HSMS‑281x family for low flicker
noise applications.
Assembly Instructions
SOT-323 PCB Footprint
A recommended PCB pad layout for the miniature SOT‑
323 (SC‑70) package is shown in Figure 6 (dimensions are
in inches). This layout provides ample allowance for pack‑
age placement by automated assembly equipment with‑
out adding parasitics that could impair the performance.
0.026
0.079
0.039
0.022
Dimensions in inches
Figure 6. Recommended PCB Pad Layout for Avago’s SC70 3L/SOT-323 Products.
Assembly Instructions
SOT-363 PCB Footprint
A recommended PCB pad layout for the miniature SOT‑
363 (SC‑70, 6 lead) package is shown in Figure 7 (dimen‑
sions are in inches). This layout provides ample allowance
for package placement by automated assembly equip‑
ment without adding parasitics that could impair the per‑
formance.
0.026
Table 1. Typical SPICE Parameters.
Parameter
B
V
C
J0
E
G
I
BV
I
S
N
R
S
P
B
(V
J
)
P
T
(XTI)
M
Ω
V
Units
V
pF
eV
A
A
HSMS-280x HSMS-281x HSMS-282x
75
1.6
0.69
1 E‑5
3 E‑8
1.08
30
0.65
2
0.5
25
1.1
0.69
1 E‑5
4.8 E‑9
1.08
10
0.65
2
0.5
15
0.7
0.69
1 E‑4
2.2 E‑8
1.08
6.0
0.65
2
0.5
0.079
0.039
0.018
Dimensions in inches
Figure 7. Recommended PCB Pad Layout for Avago’s SC70 6L/SOT-363 Products.
5
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