DUAL 150mW AUDIO POWER AMPLIFIER
参数名称 | 属性值 |
厂商名称 | UNISONIC TECHNOLOGIES CO.,LTD |
零件包装代码 | MSOP |
包装说明 | MSOP-10 |
针数 | 10 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
标称带宽 | 20 kHz |
商用集成电路类型 | AUDIO AMPLIFIER |
JESD-30 代码 | S-PDSO-G10 |
长度 | 3 mm |
信道数量 | 2 |
功能数量 | 2 |
端子数量 | 10 |
标称输出功率 | 0.15 W |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
座面最大高度 | 1.04 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
技术 | CMOS |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | DUAL |
宽度 | 3 mm |
Base Number Matches | 1 |
PA3112-SM2-T | PA3112-SM2-R | PA3112G-SM2-R | PA3112G-SM2-T | PA3112L-SM2-R | PA3112L-SM2-T | PA3112_15 | |
---|---|---|---|---|---|---|---|
描述 | DUAL 150mW AUDIO POWER AMPLIFIER | DUAL 150mW AUDIO POWER AMPLIFIER | DUAL 150mW AUDIO POWER AMPLIFIER | DUAL 150mW AUDIO POWER AMPLIFIER | DUAL 150mW AUDIO POWER AMPLIFIER | DUAL 150mW AUDIO POWER AMPLIFIER | DUAL 150mW AUDIO POWER AMPLIFIER |
厂商名称 | UNISONIC TECHNOLOGIES CO.,LTD | UNISONIC TECHNOLOGIES CO.,LTD | UNISONIC TECHNOLOGIES CO.,LTD | UNISONIC TECHNOLOGIES CO.,LTD | UNISONIC TECHNOLOGIES CO.,LTD | UNISONIC TECHNOLOGIES CO.,LTD | - |
零件包装代码 | MSOP | MSOP | MSOP | MSOP | MSOP | MSOP | - |
包装说明 | MSOP-10 | MSOP-10 | HALOGEN FREE, MSOP-10 | HALOGEN FREE, MSOP-10 | LEAD FREE, MSOP-10 | LEAD FREE, MSOP-10 | - |
针数 | 10 | 10 | 10 | 10 | 10 | 10 | - |
Reach Compliance Code | compliant | compliant | compli | compli | compli | compli | - |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
标称带宽 | 20 kHz | 20 kHz | 20 kHz | 20 kHz | 20 kHz | 20 kHz | - |
商用集成电路类型 | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | - |
JESD-30 代码 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | - |
长度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | - |
信道数量 | 2 | 2 | 2 | 2 | 2 | 2 | - |
功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | - |
端子数量 | 10 | 10 | 10 | 10 | 10 | 10 | - |
标称输出功率 | 0.15 W | 0.15 W | 0.15 W | 0.15 W | 0.15 W | 0.15 W | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | - |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | - |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - |
座面最大高度 | 1.04 mm | 1.04 mm | 1.04 mm | 1.04 mm | 1.04 mm | 1.04 mm | - |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | - |
表面贴装 | YES | YES | YES | YES | YES | YES | - |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | - |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - |
宽度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | - |
是否Rohs认证 | - | - | 符合 | 符合 | 符合 | 符合 | - |
峰值回流温度(摄氏度) | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
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