Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE4678-2LD
MA001238828
PG-TSON-10-2
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
0.689
0.003
0.013
0.265
10.773
0.056
0.038
1.966
17.087
0.370
0.064
0.081
0.244
Average
Mass
[%]
2.18
0.01
0.04
0.84
34.04
0.18
0.12
6.21
53.98
1.17
0.20
0.26
0.77
25. June 2015
31.65 mg
Sum
[%]
2.18
Average
Mass
[ppm]
21778
105
419
8382
34.93
0.18
340358
1763
1206
62130
60.31
1.17
0.20
539865
11693
2030
2568
1.03
7703
10271
1000000
603201
11693
2030
349264
1763
Sum
[ppm]
21778
wire
encapsulation
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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