Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TDA4863G
MA001367866
PG-DSO-8-41
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
acrylic resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
3.391
0.008
0.034
0.673
27.330
0.091
0.142
4.575
42.453
0.824
0.090
0.326
1.305
Average
Mass
[%]
4.17
0.01
0.04
0.83
33.64
0.11
0.17
5.63
52.27
1.01
0.11
0.40
1.61
20. May 2015
81.24 mg
Sum
[%]
4.17
Average
Mass
[ppm]
41738
104
414
8285
34.52
0.11
336408
1126
1742
56319
58.07
1.01
0.11
522547
10143
1102
4014
2.01
16058
20072
1000000
580608
10143
1102
345211
1126
Sum
[ppm]
41738
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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