Power Ring Film Capacitors
SBE Part 700D10899-525
TM
Power Ring Film Capacitor™
1000 µF, 900 Vdc
The 700D10899-525 Power Ring is a
900Vdc, 1000 µF DC Link Capacitor with
an ESR of 175 micro-Ohms at 20kHz and
an ESL of less than 15nH.
Electrical Specifications
SBE Part #:
700D10899-525
Capacitance/Tolerance:
1000 µF ±10%
DC Voltage Rating:
900 Vdc
ESL:
Less than 15 nH in a suitable
laminar bus structure
Operating Temperature:
-40°C to +85°C at full
DC voltage rating
Voltage, Temperature
Contact SBE for applications
De-rating:
above 85°C
Dielectric/Construction:
Metallized polypropylene.
Single section design
Dielectric Withstand:
System Fault Current
10,000 Amps maximum
Units 100% tested at DC
Rating (external to the
potential of 1125 Volts for two
capacitor):
minutes at 25°C
Typical ESR vs. Frequency:
0.9
0.8
0.7
0.6
ESR, milliohms
0.5
0.4
0.3
0.2
0.1
0
0.01
0.1
1
Frequency, KHz
10
100
RMS Current Rating:
600
Typical ESR vs Frequency
500
Maximum Ripple Current (A rms)
400
300
Case Side Cooling Only
Case and Bus Side Cooling
200
100
700D525 with 20 kHz ripple current
Temperature rise due to capacitor losses
only
Bus heat load NOT included
0
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
Case Temperature (
o
C)
SBE reserves the right to amend design data
At the Leading Edge of Film Capacitor Technology®
Power Ring Film Capacitors
SBE Part 700D10899-525
TM
Thermal Specifications
Here are two representations of “Capacitor Surface
Temperature over Time” for two specific Thermal
Resistances of 1°C/W and 0.5°C/W.
Notes regarding these graphs:
• The thermal resistance is that from capacitor to
application. This is a function of the application
environment, not the capacitor itself.
• The capacitor can handle extreme current for small
duty ratios. Trise occurs very slowly. This is because
the capacitor has a high specific heat.
• These charts can be adapted for other currents by
multiplying y axis values for any time by (Iapp/254)²
• Internal capacitor Trise is added to the capacitor
surface/terminal temperature.
•
Terminals are assumed to be at case temperature.
Sample 1.
Capacitor surface temperature rise above application
environment @ 207 Amps RMS current load, 10 KHz.
Thermal resistance = 0.5°C/W:
Capacitor Surface Temperature
Cap at Uniform Temperature
29
28.5
Temperature degrees C
28
27.5
27
26.5
26
25.5
25
24.5
0
2000
4000 6000 8000 10000 12000
Time in seconds
Sample 2.
Capacitor surface temperature rise above application
environment @ 207 Amps RMS current load, 10 KHz.
Thermal resistance = 1°C/W:
Capacitor Surface Temperature
Cap at Uniform Temperature
34
Mechanical Specifications
Temperature degrees C
33
32
31
30
29
28
27
26
25
0
5000
10000 15000 20000
Time in seconds
25000
Dimensions:
Terminals:
Encapsulation:
Marking:
SBE
SBE company identification
700D525
SBE “short form” part number
1000 µF ±10% Capacitance value and
tolerance
900 Vdc
DC voltage rating
yyww-lot#-unit 12-digit serial number (date
code, lot number, unit number)
Refer to layout details
Tin plated copper,
0.032” thick
Molded polymer case,
potted with RTV
SBE reserves the right to amend design data
SBE Inc. 81 Parker Road
Barre, Vermont 05641 USA
telephone:
802.476.4146
fax:
802.661.3950
web site:
www.SBElectronics.com
e-mail:
PowerRing@SBElectronics.com
Power Ring Film Capacitors
SBE Part 700D10899-525
TM
Mechanical Mounting and Additional Thermal Notes:
that the capacitor internal heating is VERY small, and
other bus structure heat sources are very likely signifi-
This capacitor is optimized for extremely low self
cantly higher than the heat added to the bus by the
capacitor. Capacitor dissipation is approximately 7.5W
inductance when connected to a suitable laminar bus
at 207Arms, from 1-100KHz. It is highly recommended
structure. When so connected, the capacitor is very
to use infrared thermal imaging from a system cold
rigidly attached to such a structure and thus does not
necessarily need to be mounted to a chassis. However, start to determine the location and relative magnitude
of thermal input to the bus. The capacitor may well
the capacitor case can be attached to an application
function as a thermal conduit for bus structure heat,
surface/heat sink, etc. if desired. When so mounted,
and it will be very possible that the capacitor internal
the capacitor can be part of the bus structure sup-
port. Use of thermal interface compound between the
hot spot is less than the terminal temperature.
Thermal contour maps are available for some repre-
capacitor case and application surface/heat sink will
sentative conditions.
assist with removal of capacitor and bus heat. Note
Layout Details:
NOTES:
1.
2.
All Hole Positions Inspected
All Dimensions Inspected Unless
Marked As Reference
(7X)45.0°
C
8.494
Bolt Circle
A
(16X) M5x0.8-6H THRU
28 in-lbs MAX Torque
.020 A B C
REV.
01
DESCRIPTION
Initial Release
Revisions
CHG
BY
-
CHK
BY
-
APR
BY
-
DATE
01/26/2011
B
10.000
10.321
Bolt Circle
.040
16 Surfaces
10.945
Bolt Circle
.259 1.000
Accepts 1/4" Plastite Screw
40 in-lbs MAX Torque
.197±.005 THRU
4X
Accepts 1/4" Plastite Screw
40 in-lbs MAX Torque
.020 A B C
A
.221
2.721
1.000
.663
.500
.280
NON-TOLERANCED DIMENSIONS ARE BASIC
.010 A B C
UNLESS OTHERWISE SPECIFIED:
ALL DIMENSIONS ARE IN INCHES
SBE, INC.
81 PARKER ROAD
BARRE, VT 05641 USA
802.476.4146 FAX: 802.661.3950
GEOMETRIC TOLERANCING PER: Y14.5-2009
DETAIL A
PROPRIETARY AND CONFIDENTIAL
THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF SBE. ANY
REPRODUCTION IN PART OR AS A WHOLE WITHOUT THE WRITTEN PERMISSION OF SBE IS PROHIBITED.
MATERIAL
DRAWN
CHECKED
ENG APPR.
FINISH
DMB
MGS
MSB
1/23/2011
1/26/2011
1/26/2011
Power Ring Capacitor,
1000µF, 900VDC
DWG. NO.
TITLE
700D525LV
DO NOT SCALE DRAWING
SIZE
A
REV
01
SHEET 1 OF 1
Contact SBE Inc. to discuss your specific requirements.
SBE reserves the right to amend design data
At the Leading Edge of Film Capacitor Technology®
Power Ring Film Capacitors
SBE Part 700D10899-525
TM
Advantages of Power Ring DC Link Capacitors
• Ability to handle higher ripple currents with less
capacitance, weight, and volume
• Use of 105°C ICE coolant for power
electronics cooling
• Demonstrated MTTF >> 20,000 hours for realistic
operating conditions, due to lower losses and
better thermal performance
• Minimization of IGBT overshoot and elimination of the
need for additional snubber capacitors
• Most effective isolation of DC storage or supply
from AC switching artifacts
• Lowest industry ESL at <5nH typical with a
properly integrated bus structure
•
Smaller inverter packaging
•
Overall system cost savings
• Capacitance from 400 µF to 2500 µF and voltages
from 250 Vdc to 1200 Vdc
Integrating the Power Ring in an Existing Design
The “stacked” inverter design evolves from modifying
a typical automotive inverter by utilizing the excess
space left above the IGBT module (figure 1). By bend-
ing the end of the laminar bus plate, the IBGT, die,
cooling plate, and the ring capacitor are “stacked” on
top of each other in a symmetrical fashion. The ring
capacitor is placed underneath the cooling plate.
The cooling plate is shared with the IGBT module
which is mounted on the top.
Figure 1
The SBE Power Ring Film Capacitors™ utilize tradition-
ally available and economical polypropylene and poly-
ester capacitor dielectric films. However, the power
of the shape™ allows for both thermal and electrical
performance which has been unachievable in the film
capacitor industry to date.
Power Ring System Performance
The combination of lowest available Trise, ESR and ESL
coupled with highest ripple current handling capability
enable the development of industry leading inverter
designs with unbeatable performance and reliability.
Lowest available Trise for a given ripple current
Lowest available ESL, less than 5nH demonstrated with
optimal integrated bus
Lowest available ESR, less than 150 micro-Ohms typical
Crown terminal architecture provides for a multitude
of current paths which allows the monolithic capacitor
to function as a distributed element with a much lower
ESR than an equivalent array of smaller parts. SBE has
developed a next generation capacitor simulation tool
that allows accurate calculation of hotspot tempera-
ture to allow optimal rating with excellent reliability.
Figure 2
Figure 2 shows the “stacked” inverter design after the
integration of the ring capacitor and the laminar bus
plate. By now combining both aspects of vertical inte-
gration and the low temperature rise characteristics
of the capacitors, an increase to 50% or more volume
reduction is realistically possible. These improvements
clearly translate into weight and cost reductions.
#SBE-PR-525-01/11
SBE reserves the right to amend design data
SBE Inc. 81 Parker Road
Barre, Vermont 05641 USA
telephone:
802.476.4146
fax:
802.661.3950
web site:
www.SBElectronics.com
e-mail:
PowerRing@SBElectronics.com
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