Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
APPLICATIONS
• Network
• System Power DC/DC
D
1
D
2
Part # Code
3.
0
m
m
1.
8
mm
G
1
G
2
Bottom
View
Ordering Information:
Si5936DU-T1-GE3 (Lead (Pb)-free and Halogen-free)
S
1
N-Channel
MOSFET
S
2
N-Channel
MOSFET
ABSOLUTE MAXIMUM RATINGS
(T
A
= 25 °C, unless otherwise noted)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T
J
= 150 °C)
Pulsed Drain Current (t = 300 µs)
T
C
= 25 °C
T
A
= 25 °C
T
C
= 25 °C
T
C
= 70 °C
Maximum Power Dissipation
T
A
= 25 °C
T
A
= 70 °C
Operating Junction and Storage Temperature Range
Continuous Source-Drain Diode Current
Soldering Recommendations (Peak Temperature)
d, e
Symbol
V
DS
V
GS
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
I
D
I
DM
I
S
P
D
T
J
, T
stg
Limit
30
± 20
6
a
6
a
6
a, b, c
5.3
b, c
25
6
a
1.9
b, c
10.4
6.7
2.3
b, c
1.5
b, c
- 55 to 150
260
Unit
V
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient
b, f
Maximum Junction-to-Case (Drain)
t
5s
Steady State
Symbol
R
thJA
R
thJC
Typical
43
9.5
Maximum
55
12
Unit
°C/W
Notes:
a. Package limited
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 105 °C/W.
Document Number: 62804
S12-2729-Rev. A, 12-Nov-12
For technical questions, contact:
pmostechsupport@vishay.com
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
New Product
Si5936DU
Vishay Siliconix
SPECIFICATIONS
(T
J
= 25 °C, unless otherwise noted)
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
b
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
I
F
= 5.3 A, dI/dt = 100 A/µs, T
J
= 25 °C
I
S
= 5.3 A, V
GS
½0
V
0.8
11
5
6
5
T
C
= 25 °C
6
25
1.2
20
10
A
V
ns
nC
ns
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
V
DD
= 15 V, R
L
= 2.8
I
D
5.3 A, V
GEN
= 10 V, R
g
= 1
V
DD
= 15 V, R
L
= 2.8
I
D
5.3 A, V
GEN
= 4.5 V, R
g
= 1
f = 1 MHz
0.8
V
DS
= 15 V, V
GS
= 10 V, I
D
= 7 A
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 7 A
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
320
70
38
7
3.5
1
1.3
4
15
65
15
10
5
12
12
6
8
30
130
30
20
10
25
25
15
ns
11
5.3
nC
pF
V
DS
V
DS
/T
J
V
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
V
GS
= 0 V, I
D
= 250 µA
I
D
= 250 µA
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= 0 V, V
GS
= ± 20 V
V
DS
= 30 V, V
GS
= 0 V
V
DS
= 30 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
5
V, V
GS
= 10 V
V
GS
½10
V, I
D
= 5 A
V
GS
½4.5
V, I
D
= 4 A
V
DS
= 15 V, I
D
= 5 A
20
0.025
0.032
11
0.030
0.040
1.2
30
34
- 4.4
2.2
± 100
1
10
V
mV/°C
V
nA
µA
A
S
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Notes:
a. Pulse test; pulse width
300 µs, duty cycle
2 %
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Document Number: 62804
S12-2729-Rev. A, 12-Nov-12
For technical questions, contact:
pmostechsupport@vishay.com
www.vishay.com
2
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
New Product
Si5936DU
Vishay Siliconix
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
25
V
GS
= 10 V thru 5 V
20
I
D
- Drain Current (A)
10
V
GS
= 4 V
8
15
I
D
- Drain Current (A)
6
10
4
T
C
= 25
°C
5
V
GS
= 3 V
2
T
C
= 125
°C
T
C
= - 55
°C
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
V
DS
- Drain-to-Source Voltage (V)
0
0.0
1.0
2.0
3.0
4.0
V
GS
- Gate-to-Source Voltage (V)
Output Characteristics
0.100
500
Transfer Characteristics
0.080
R
DS(on)
- On-Resistance (Ω)
400
0.060
C - Capacitance (pF)
C
iss
300
0.040
V
GS
= 4.5 V
200
0.020
V
GS
= 10 V
100
C
rss
C
oss
0.000
0
10
20
I
D
- Drain Current (A)
30
40
0
0
6
12
18
24
30
V
DS
- Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current and Gate Voltage
10
R
DS(on)
- On-Resistance (Normalized)
1.8
Capacitance
V
GS
= 10V
V
GS
- Gate-to-Source Voltage (V)
8
I
D
= 7 A
V
DS
= 15 V
1.6
I
D
= 5 A
1.4
V
GS
= 4.5 V
1.2
6
V
DS
= 7.5 V
V
DS
= 24 V
4
1.0
2
0.8
0
0
2
4
6
8
Q
g
- Total Gate Charge (nC)
0.6
- 50
- 25
0
25
50
75
100
125
150
T
J
- Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 62804
S12-2729-Rev. A, 12-Nov-12
For technical questions, contact:
pmostechsupport@vishay.com
www.vishay.com
3
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
New Product
Si5936DU
Vishay Siliconix
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
100
0.100
I
D
= 5 A
0.080
R
DS(on)
- On-Resistance (Ω)
I
S
- Source Current (A)
10
T
J
= 150
°C
0.060
T
J
= 125
°C
0.040
T
J
= 25
°C
1
0.020
T
J
= 25
°C
0.1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
V
SD
- Source-to-Drain Voltage (V)
0.000
0.0
2.0
4.0
6.0
8.0
10.0
V
GS
- Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
2.0
30
1.8
25
1.6
Power (W)
20
V
GS(th)
(V)
1.4
I
D
= 250 μA
1.2
15
10
1.0
5
0.8
- 50
- 25
0
25
50
75
100
125
150
0
0.001
0.01
0.1
1
Time (s)
10
100
1000
T
J
- Temperature (°C)
Threshold Voltage
100
Limited by R
DS(on)
*
10
Single Pulse Power (Junction-to-Ambient)
I
D
- Drain Current (A)
100 μs
1
1 ms
10 ms
0.1
T
A
= 25
°C
100 ms
1s
10 s
DC
BVDSS Limited
0.01
0.1
1
10
100
V
DS
- Drain-to-Source Voltage (V)
* V
GS
> minimum V
GS
at which R
DS(on)
is specified
Safe Operating Area, Junction-to-Ambient
Document Number: 62804
S12-2729-Rev. A, 12-Nov-12
For technical questions, contact:
pmostechsupport@vishay.com
www.vishay.com
4
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
New Product
Si5936DU
Vishay Siliconix
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
16
12
10
I
D
- Drain Current (A)
Power Dissipation (W)
12
8
8
6
Package Limited
4
4
2
0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
Current Derating*
Power Derating
* The power dissipation P
D
is based on T
J(max.)
= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
Document Number: 62804
S12-2729-Rev. A, 12-Nov-12
For technical questions, contact:
pmostechsupport@vishay.com
www.vishay.com
5
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
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