Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPB160N04S2-03
MA000382367
PG-TO263-7-3
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
12.294
0.909
0.273
907.924
11.138
8.637
95.012
472.179
12.317
0.269
0.001
0.192
0.154
7.351
Average
Mass
[%]
0.80
0.06
0.02
59.39
0.73
0.56
6.22
30.89
0.81
0.02
0.00
0.01
0.01
0.48
29. August 2013
1528.65 mg
Sum
[%]
0.80
Average
Mass
[ppm]
8042
595
178
59.47
0.73
593940
7286
5650
62154
37.67
0.81
308886
8057
176
0.02
0
126
101
0.50
4809
5036
1000000
176
376690
8057
594713
7286
Sum
[ppm]
8042
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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