Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
BCR 320U E6327
MA000904736
PG-SC74-6-3
Material Group
noble metal
non noble metal
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
plastics
inorganic material
non noble metal
noble metal
< 10%
Substances
gold
arsenic
silicon
silicon
titanium
chromium
copper
gold
carbon black
brominated resin
antimonytrioxide
epoxy resin
silicondioxide
tin
silver
CAS#
if applicable
7440-57-5
7440-38-2
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
1309-64-4
-
60676-86-0
7440-31-5
7440-22-4
Issued
Weight*
Weight
[mg]
0.010
0.000
0.115
0.001
0.005
0.015
5.090
0.025
0.055
0.069
0.137
1.452
5.138
0.299
0.132
Average
Mass
[%]
0.08
0.00
0.92
0.01
0.04
0.12
40.58
0.20
0.44
0.55
1.09
11.58
40.95
2.39
1.05
27. February 2015
12.54 mg
Sum
[%]
Average
Mass
[ppm]
808
8
1.00
9201
81
407
1222
40.75
0.20
405753
1976
4369
5462
10923
115784
54.61
2.39
1.05
409615
23872
10519
546153
23872
10519
1000000
407463
1976
10017
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
