MN15G1601
Type
ROM (×8-bit)
×
RAM (× 4-bit)
×
Package
Number of Instructions
Minimum Instruction
Execution Time
MN15G1601
16 K
512
LQFP064-P-1414
*Lead-free
103
0.5
µs
at 1/4 frequency dividing (at 3.0 V to 5.5 V, 8 MHz)
1.0
µs
at 1/4 frequency dividing (at 2.4 V to 5.5 V, 4 MHz)
2.0
µs
at 1/8 frequency dividing (at 2.0 V to 5.5 V, 4 MHz)*
* The lower limit for operation guarantee for EPROM built-in type is 2.3 V.
• RESET • IRQ1 • IRQ2 • IRQ3
Timer counter 1 : 8-bit
×
1 (event count, pulse output, remote control carrier output)
Clock source ····················· 1/2 of system clock frequency; 1/1, 1/2
14
of OSC oscillation clock frequency;
1/1, 1/2
6
of XI oscillation clock frequency
Possible 16-bit cascade connection with timer counter 0
Timer counter 2 : 8-bit
×
1
(event count, pulse output, simple pulse width meausurement, PWM output, remote control carrier output,
one-shot timer output, trigger start PWM output, trigger start timer output)
Clock source ····················· 1/2 of system clock frequency; 1/1, 1/2 of OSC oscillation clock frequency;
1/1 of XI oscillation clock frequency; TCI input
Timer counter 3 : 8-bit
×
1 (event count, pulse output, remote control carrier output, high-functional PWM output)
Clock source ····················· 1/2 of system clock frequency; 1/1, 1/2 of OSC oscillation clock frequency;
1/1 of XI oscillation clock frequency; TCI input
Possible 16-bit cascade connection with timer counter 2
Watchdog timer
Serial Interface
I/O Pins
Serial : 8-bit
×
1 (synchronous type)
Clock source ····················· 1/1, 1/2 of system clock frequency; SBT pin input
35
I/O
LCD
Zero-Cross Inputs
Special Ports
1
Pl
1
A/D Inputs
10-bit
×
8-ch. (with S/H)
30 segments
×
4 commons (1/2 , 1/3 , 1/4 duty)
Buzzer output (1 kHz, 2 kHz, 4 kHz : fosc = at 4 MHz)
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Interrupts
Timer Counter
Timer counter 0 : 8-bit
×
1
(event count, pulse output, simple pulse width meausurement, PWM output, remote control carrier output)
Clock source ····················· 1/2, 1/8, 1/32, 1/128 of system clock frequency; 1/1, 1/4, 1/16, 1/64 of XI(OSC)
oscillation clock frequency
• Common use : 31 • Specified pull-up resistor available : 27 (software programmable)
• Specified output architecture available : Nch open drain / push-pull : 31 (software programmable)
MAC00001DEM
MN15G1601
Electrical Characteristics
Supply current
Limit
Parameter
Symbol
IDD1
Operating supply current
IDD2
IDD3
IDD4
Condition
min
fosc = 8 MHz (1/8 dividing)
fosc = 4 MHz (1/8 dividing)
fosc = 32.768 kHz (1/8 dividing)
fosc = 4 MHz (1/8 dividing)
typ
1.8
1.2
9.0
0.3
1.5
4.0
max
3.5
2.5
20
0.6
8.0
10
30
1.0
5.0
mA
mA
µA
mA
µA
µA
µA
µA
µA
Unit
IDD9
Pin Assignment
SEG16
SEG17
SEG18
SEG19
SEG20
SEG21
COM0
COM1
COM2
COM3
SEG22/AD0
SEG23/AD1
SEG24/AD2
SEG25/AD3
SEG26/AD4
SEG27/AD5
SupportTool
In-circuit Emulator
EPROM Built-in Type
Type
ROM (× 8-bit)
RAM (× 4-bit)
PX-ICE1500 + PX-PRB15G1601-LQFP064-P-1414
MN15GP1601
16 K
512
0.5
µs
at 1/4 frequency dividing (at 3.0 V to 5.5 V, 8 MHz)
1.0
µs
at 1/4 frequency dividing (at 2.4 V to 5.5 V, 4 MHz)
2.0
µs
at 1/8 frequency dividing (at 2.3 V to 5.5 V, 4 MHz)
Package
LQFP064-P-1414
*Lead-free
Minimum instruction execution time
SEG28 / AD6
SEG29 / AD7
VREF+
VDD
VLC1
VLC2
VLC3
OSC1
OSC2
XI
XO
NRST
VSS
P00
P01
P02
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Ta =
−40°C
to +85°C
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
PB3/SEG15
PB2/SEG14
PB1/SEG13
PB0/SEG12
PA3/SEG11
PA2/SEG10
PA1/SEG9
PA0/SEG8
P93/SEG7
P92/SEG6
P91/SEG5
P90/SEG4
P83/SEG3
P82/SEG2
P81/SEG1
P80/SEG0
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
M
Di ain
sc te
on na
tin nc
ue e/
d
Supply current at HALT
IDD5
IDD6
IDD7
fosc = 32.768 kHz (1/8 dividing)
ACZ = 1/2 VDD, Ta = 25°C
Supply current at STOP
ACZ = 1/2 VDD, Ta =
−40°C
to +85°C
Ta = 25°C
IDD8
MN15G1601
MN15G1601
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
P62/TCO
P61/START
P60/NIRQ
P33/key7
P32/BZ/key6
P31/NTCI/key5
P30/ACZ/key4
P23/SBT/key3
P22/SBO/key2
P21/SBI/key1
P20/NSYNC/key0
P13/PWMO3
P12/PWMO2
P11/PWMO1
P10/PWMO0
P03
(Ta =
−40°C
to +85°C, VDD = 5.0 V, VSS = 0 V)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
LQFP064-P-1414
*Lead-free
MAC00001DEM
2
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)
If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–
Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
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