Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE4968-1L
MA000987398
PG-SSO-3-2
Material Group
inorganic material
non noble metal
non noble metal
noble metal
non noble metal
Substances
silicon
chromium
titanium
silver
tin
copper
gold
carbon black
brominated resin
antimonytrioxide
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-47-3
7440-32-6
7440-22-4
7440-31-5
7440-50-8
7440-57-5
1333-86-4
-
1309-64-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
0.350
0.153
0.153
0.204
0.306
50.200
0.033
0.213
0.266
0.531
4.837
20.728
4.889
0.284
0.036
0.143
Average
Mass
[%]
0.42
0.18
0.18
0.24
0.37
60.25
0.04
0.26
0.32
0.64
5.80
24.88
5.87
0.34
0.04
0.17
28. August 2013
83.33 mg
Sum
[%]
0.42
Average
Mass
[ppm]
4194
1837
1837
2449
3674
61.22
0.04
602459
395
2551
3189
6378
58044
31.90
5.87
0.34
248761
58675
3413
429
0.21
1715
2144
1000000
318923
58675
3413
612256
395
Sum
[ppm]
4194
wire
encapsulation
non noble metal
noble metal
organic material
plastics
inorganic material
plastics
inorganic material
leadfinish
plating
glue
*deviation
non noble metal
noble metal
plastics
noble metal
< 10%
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com