SPECIFICATION FOR APPROVAL
REF : 20070320-A
PROD.
NAME
PAGE: 1
ABC'S DWG NO.
ABC'S ITEM NO.
CB6011□□□□L□-□□□
SMD POWER INDUCTOR
Ⅰ﹒CONFIGURATION
& DIMENSIONS：
A
A :
B :
C :
D :
E :
F :
G:
H:
6.20±0.15
6.60 max.
1.10±0.10
2.00±0.30
1.50±0.20
2.20 ref.
6.60 ref.
4.00 ref.
m/m
m/m
m/m
m/m
m/m
m/m
m/m
m/m
4 R 7
B
E
C
G
D
F
H
(PCB Pattern Suggestion)
Ⅱ﹒SCHEMATIC
DIAGRAM：
a
c
b
Ⅲ﹒MATERIALS：
a﹒Core：Ferrite core
b﹒Wire：Enamelled copper wire
c﹒Base：Cu/Ag(1.0um)
d﹒Adhesive：Epoxy resin
e﹒Remark：Products comply with RoHS'
requirements
Temperature (
℃
)
250
d
Peak Temp：260℃ max.
Max time above 230℃
：50sec
max.
Max time above 200℃
：70sec
max.
Temperature
Rising Area
+4.0
℃
/ sec max.
Preheat Area
150 ~ 200
℃
/ 60 ~ 120sec
Reflow Area
+2.0 ~ 4.0
℃
Forced Cooling Area
-(1.0 ~ 5.0)
℃
/ sec max.
Peak Temperature:
260℃
50sec max.
230℃
Ⅳ﹒GENERAL
SPECIFICATION：
a﹒Temp. rise
：40℃
typ.
b﹒Storage temp.：-40℃ ----+120℃
c﹒Operating temp.：-40℃----+125℃
(included Temp. rise)
d﹒Resistance to solder heat：260℃.10 secs.
AR-001A
200
150
70sec max.
100
50
0
50
100
150
Time ( seconds )
200
250
SPECIFICATION FOR APPROVAL
REF : 20070320-A
PROD.
NAME
PAGE: 2
ABC'S DWG NO.
ABC'S ITEM NO.
CB6011□□□□L□-□□□
SMD POWER INDUCTOR
Ⅴ﹒ELECTRICAL
CHARACTERISTICS
：
DWG No.
CB60111R5ML□-□□□
CB60112R7ML□-□□□
CB60114R7ML□-□□□
CB60116R8ML□-□□□
CB6011100ML□-□□□
CB6011150ML□-□□□
CB6011220ML□-□□□
CB6011330ML□-□□□
CB6011470ML□-□□□
Inductance
(µH)
0.1V/100KHz
1.5±20%
2.7±20%
4.7±20%
6.8±20%
10.0±20%
15.0±20%
22.0±20%
33.0±20%
47.0±20%
RDC
(
Ω
)
max.
0.09
0.12
0.17
0.30
0.36
0.55
0.74
1.25
1.65
Irms.
(A)
typ.
1.90
1.65
1.38
1.24
1.07
0.88
0.73
0.57
0.50
Isat.
(A)
max.
2.50
1.80
1.55
1.24
1.07
0.88
0.72
0.54
0.46
1). Packing information : A : Bulk B : Taping Reel
2)."-
□□□
":Reference code
3). Irms. base on temp. rise 40
℃
typ.
4). Isat. base on
△
L/LOA=10% max.
AR-001A
SPECIFICATION FOR APPROVAL
REF :
20070320-A
PROD.
NAME
PAGE: 3
ABC'S DWG NO.
ABC'S ITEM NO.
CB6011□□□□L□-□□□
SMD POWER INDUCTOR
Ⅵ﹒PACKAGING
INFORMATION
( 1 ) Configuration
T
Cover Tape
2.0±0.5
A
B
∮
C
∮
C
N
G
D
Embossed Carrier
※
Carrier tape width : D
P:8m/m
End
4 R 7
4 R 7
4 R 7
4 R 7
4 R 7
4 R 7
4m/m
Start
．
．
．
．
．
．
Leader
no component
200 m/m min.
Components
User direction of feed
Trailer
no component
400 m/m min.
( 2 ) Dimensions
Style
07 - 12
A
178
B
21±0.8
C
13
D
12
G
14
+0
N
50
-0
Unit:m/m
T
18.4
( 3 ) Q'TY & G.W. Per package
Inner : Reel
Series
CB6011
Q'TY (pcs)
G.W. (gw)
Style
Q'TY (pcs)
Outer : Carton
G.W. (Kg)
Size (cm)
1,500
330
07 - 12
60,000
13.2
42 x 41 x 24
AR-001A
SPECIFICATION FOR APPROVAL
REF :
20070320-A
PROD.
NAME
PAGE: 4
ABC'S DWG NO.
ABC'S ITEM NO.
CB6011□□□□L□-□□□
SMD POWER INDUCTOR
Ⅶ﹒DWGING
NUMBER EXPRESSION：
C
B
3
0
1
1
Reference code
Appendix code 2 : Package
Appendix code 1 : Classification
Tolerance code
Electrical code
Dimension code
Type code
Appendix code 1：Product Classification
L：Lead Free Standard products comply with RoHS' requirements
1 ~ 9：Lead Free Special products comply with RoHS' requirements
Appendix code 2：Package Information
Code
A
B
Inner package
T.B.D.
T /R (Reel package)
Inner package Q'TY
T.B.D.
1500 pcs
Remark
AR-001A
SPECIFICATION FOR APPROVAL
REF :
20070320-A
PROD.
NAME
PAGE: 5
ABC'S DWG NO.
ABC'S ITEM NO.
CB6011□□□□L□-□□□
SMD POWER INDUCTOR
Ⅷ﹒RELIABILITY
TEST：
Test item
Specification
More than 90% of the
terminal electrode
Shall be covered
With fresh solder.
Test condition
Preheat : 150±25
℃
for 60 seconds
Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
Solderability
Thermal shock test
( Temp. cycle )
Inductance shall
not change more
than ±20%
Room temp.
15 minutes
Room temp.
15 minutes
Total : 50 cycles
-25±2
℃
30 minutes
85±2
℃
30 minutes
Humidity
Resistance test
Temperature : 40±2℃
Humidity : 90 ~ 95%
Applied current : Per spec.
Time : 500 hours
High temp.
Resistance test
Temperature : 80±2℃
Applied current : Per spec.
Time : 500 hours
AR-001A
微控制器 MCU
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