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AM7200-50BXA: 产品描述RAM BASED FIRST-IN FIRST-OUT useful in a wide range of applications 256x9 FIFO; 文件大小485KB，共1页; 制造商Rochester Electronics; 官网地址https://www.rocelec.com/

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AM7200-50BXA概述

RAM BASED FIRST-IN FIRST-OUT useful in a wide range of applications 256x9 FIFO

AM7200-50BXA相似产品对比

	AM7200-50BXA	AM7200-25JC	AM7200-25JCTR	AM7200-35PC	AM7200-50JCTR	AM7200-25PC	AM7200-25RC	AM7200-35JC	AM7200-50JC	AM7200-50PC
描述	RAM BASED FIRST-IN FIRST-OUT useful in a wide range of applications 256x9 FIFO	RAM BASED FIRST-IN FIRST-OUT useful in a wide range of applications 256x9 FIFO	RAM BASED FIRST-IN FIRST-OUT useful in a wide range of applications 256x9 FIFO	RAM BASED FIRST-IN FIRST-OUT useful in a wide range of applications 256x9 FIFO	RAM BASED FIRST-IN FIRST-OUT useful in a wide range of applications 256x9 FIFO	RAM BASED FIRST-IN FIRST-OUT useful in a wide range of applications 256x9 FIFO	RAM BASED FIRST-IN FIRST-OUT useful in a wide range of applications 256x9 FIFO	RAM BASED FIRST-IN FIRST-OUT useful in a wide range of applications 256x9 FIFO	RAM BASED FIRST-IN FIRST-OUT useful in a wide range of applications 256x9 FIFO	RAM BASED FIRST-IN FIRST-OUT useful in a wide range of applications 256x9 FIFO
厂商名称	-	-	-	Rochester Electronics	-	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
包装说明	-	-	-	DIP,	-	DIP,	DIP,	QCCJ,	QCCJ,	DIP,
Reach Compliance Code	-	-	-	unknown	-	unknown	unknown	unknown	unknown	unknown
ECCN代码	-	-	-	EAR99	-	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	-	-	-	35 ns	-	25 ns	25 ns	35 ns	50 ns	50 ns
其他特性	-	-	-	RETRANSMIT	-	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT
周期时间	-	-	-	45 ns	-	35 ns	35 ns	45 ns	65 ns	65 ns
JESD-30 代码	-	-	-	R-PDIP-T28	-	R-PDIP-T28	R-PDIP-T28	R-PQCC-J32	R-PQCC-J32	R-PDIP-T28
长度	-	-	-	37.084 mm	-	37.084 mm	35.2425 mm	13.97 mm	13.97 mm	37.084 mm
内存密度	-	-	-	2304 bit	-	2304 bit	2304 bit	2304 bit	2304 bit	2304 bit
内存宽度	-	-	-	9	-	9	9	9	9	9
功能数量	-	-	-	1	-	1	1	1	1	1
端子数量	-	-	-	28	-	28	28	32	32	28
字数	-	-	-	256 words	-	256 words	256 words	256 words	256 words	256 words
字数代码	-	-	-	256	-	256	256	256	256	256
工作模式	-	-	-	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	-	-	-	70 °C	-	70 °C	70 °C	70 °C	70 °C	70 °C
组织	-	-	-	256X9	-	256X9	256X9	256X9	256X9	256X9
可输出	-	-	-	NO	-	NO	NO	NO	NO	NO
封装主体材料	-	-	-	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	-	-	-	DIP	-	DIP	DIP	QCCJ	QCCJ	DIP
封装形状	-	-	-	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	-	-	-	IN-LINE	-	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE
并行/串行	-	-	-	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
座面最大高度	-	-	-	5.715 mm	-	5.715 mm	5.08 mm	3.556 mm	3.556 mm	5.715 mm
最大供电电压 (Vsup)	-	-	-	5.5 V	-	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	-	-	-	4.5 V	-	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	-	-	-	5 V	-	5 V	5 V	5 V	5 V	5 V
表面贴装	-	-	-	NO	-	NO	NO	YES	YES	NO
技术	-	-	-	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	-	-	-	COMMERCIAL	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	-	-	-	THROUGH-HOLE	-	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND	THROUGH-HOLE
端子节距	-	-	-	2.54 mm	-	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm
端子位置	-	-	-	DUAL	-	DUAL	DUAL	QUAD	QUAD	DUAL
宽度	-	-	-	15.24 mm	-	15.24 mm	7.62 mm	11.43 mm	11.43 mm	15.24 mm
Base Number Matches	-	-	-	1	-	1	1	1	1	1

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