HCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP14
HCT系列, 双正边沿D触发器, 互补输出, PDIP14
参数名称 | 属性值 |
Source Url Status Check Date | 2013-06-14 00:00:00 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | MO-001 |
包装说明 | 0.300 INCH, PLASTIC, MO-001, SOT-27-1, DIP-14 |
针数 | 14 |
Reach Compliance Code | unknow |
ECCN代码 | EAR99 |
系列 | HC/UH |
JESD-30 代码 | R-PDIP-T14 |
长度 | 19.025 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | D FLIP-FLOP |
最大频率@ Nom-Su | 20000000 Hz |
最大I(ol) | 0.004 A |
位数 | 1 |
功能数量 | 2 |
端子数量 | 14 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
输出极性 | COMPLEMENTARY |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
包装方法 | TUBE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 2/6 V |
传播延迟(tpd) | 265 ns |
认证状态 | Not Qualified |
座面最大高度 | 4.2 mm |
最大供电电压 (Vsup) | 6 V |
最小供电电压 (Vsup) | 2 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | NICKEL/PALLADIUM/GOLD (NI/PD/AU) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
触发器类型 | POSITIVE EDGE |
宽度 | 7.62 mm |
最小 fmax | 24 MHz |
74HC74N | 74HCT74 | 74HCT74BQ | 74HCT74N | 74HC74 | |
---|---|---|---|---|---|
描述 | HCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP14 | HCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP14 | HCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP14 | HCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP14 | HCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP14 |
系列 | HC/UH | HCT | HCT | HCT | HCT |
位数 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 14 | 14 | 14 | 14 | 14 |
输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
端子位置 | DUAL | DUAL | QUAD | DUAL | DUAL |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
是否无铅 | 不含铅 | - | 不含铅 | 不含铅 | - |
是否Rohs认证 | 符合 | - | 符合 | 符合 | - |
厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | - |
零件包装代码 | MO-001 | - | QFN | MO-001 | - |
包装说明 | 0.300 INCH, PLASTIC, MO-001, SOT-27-1, DIP-14 | - | HVQCCN, LCC14,.1X.12,20 | 0.300 INCH, PLASTIC, MO-001, SOT-27-1, DIP-14 | - |
针数 | 14 | - | 14 | 14 | - |
Reach Compliance Code | unknow | - | compli | unknow | - |
JESD-30 代码 | R-PDIP-T14 | - | R-PQCC-N14 | R-PDIP-T14 | - |
长度 | 19.025 mm | - | 3 mm | 19.025 mm | - |
负载电容(CL) | 50 pF | - | 50 pF | 50 pF | - |
逻辑集成电路类型 | D FLIP-FLOP | - | D FLIP-FLOP | D FLIP-FLOP | - |
最大频率@ Nom-Su | 20000000 Hz | - | 18000000 Hz | 18000000 Hz | - |
最大I(ol) | 0.004 A | - | 0.004 A | 0.004 A | - |
最高工作温度 | 125 °C | - | 125 °C | 125 °C | - |
最低工作温度 | -40 °C | - | -40 °C | -40 °C | - |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装代码 | DIP | - | HVQCCN | DIP | - |
封装等效代码 | DIP14,.3 | - | LCC14,.1X.12,20 | DIP14,.3 | - |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - |
封装形式 | IN-LINE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | IN-LINE | - |
包装方法 | TUBE | - | TAPE AND REEL | TUBE | - |
峰值回流温度(摄氏度) | NOT SPECIFIED | - | 260 | NOT SPECIFIED | - |
电源 | 2/6 V | - | 5 V | 5 V | - |
传播延迟(tpd) | 265 ns | - | 53 ns | 53 ns | - |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - |
座面最大高度 | 4.2 mm | - | 1 mm | 4.2 mm | - |
最大供电电压 (Vsup) | 6 V | - | 5.5 V | 5.5 V | - |
最小供电电压 (Vsup) | 2 V | - | 4.5 V | 4.5 V | - |
标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | - |
表面贴装 | NO | - | YES | NO | - |
技术 | CMOS | - | CMOS | CMOS | - |
端子面层 | NICKEL/PALLADIUM/GOLD (NI/PD/AU) | - | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | - |
端子节距 | 2.54 mm | - | 0.5 mm | 2.54 mm | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | 30 | NOT SPECIFIED | - |
宽度 | 7.62 mm | - | 2.5 mm | 7.62 mm | - |
最小 fmax | 24 MHz | - | 18 MHz | 18 MHz | - |
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