HCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP14
HCT系列, 双正边沿D触发器, 互补输出, PDIP14
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | QFN |
包装说明 | HVQCCN, LCC14,.1X.12,20 |
针数 | 14 |
Reach Compliance Code | compli |
系列 | HCT |
JESD-30 代码 | R-PQCC-N14 |
JESD-609代码 | e4 |
长度 | 3 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | D FLIP-FLOP |
最大频率@ Nom-Su | 18000000 Hz |
最大I(ol) | 0.004 A |
湿度敏感等级 | 1 |
位数 | 1 |
功能数量 | 2 |
端子数量 | 14 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
输出极性 | COMPLEMENTARY |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVQCCN |
封装等效代码 | LCC14,.1X.12,20 |
封装形状 | RECTANGULAR |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
包装方法 | TAPE AND REEL |
峰值回流温度(摄氏度) | 260 |
电源 | 5 V |
传播延迟(tpd) | 53 ns |
认证状态 | Not Qualified |
座面最大高度 | 1 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | NICKEL PALLADIUM GOLD |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
触发器类型 | POSITIVE EDGE |
宽度 | 2.5 mm |
最小 fmax | 18 MHz |
74HCT74BQ | 74HCT74 | 74HCT74N | 74HC74 | 74HC74N | |
---|---|---|---|---|---|
描述 | HCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP14 | HCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP14 | HCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP14 | HCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP14 | HCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP14 |
系列 | HCT | HCT | HCT | HCT | HC/UH |
位数 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 14 | 14 | 14 | 14 | 14 |
输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
是否无铅 | 不含铅 | - | 不含铅 | - | 不含铅 |
是否Rohs认证 | 符合 | - | 符合 | - | 符合 |
厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | - | NXP(恩智浦) |
零件包装代码 | QFN | - | MO-001 | - | MO-001 |
包装说明 | HVQCCN, LCC14,.1X.12,20 | - | 0.300 INCH, PLASTIC, MO-001, SOT-27-1, DIP-14 | - | 0.300 INCH, PLASTIC, MO-001, SOT-27-1, DIP-14 |
针数 | 14 | - | 14 | - | 14 |
Reach Compliance Code | compli | - | unknow | - | unknow |
JESD-30 代码 | R-PQCC-N14 | - | R-PDIP-T14 | - | R-PDIP-T14 |
长度 | 3 mm | - | 19.025 mm | - | 19.025 mm |
负载电容(CL) | 50 pF | - | 50 pF | - | 50 pF |
逻辑集成电路类型 | D FLIP-FLOP | - | D FLIP-FLOP | - | D FLIP-FLOP |
最大频率@ Nom-Su | 18000000 Hz | - | 18000000 Hz | - | 20000000 Hz |
最大I(ol) | 0.004 A | - | 0.004 A | - | 0.004 A |
最高工作温度 | 125 °C | - | 125 °C | - | 125 °C |
最低工作温度 | -40 °C | - | -40 °C | - | -40 °C |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
封装代码 | HVQCCN | - | DIP | - | DIP |
封装等效代码 | LCC14,.1X.12,20 | - | DIP14,.3 | - | DIP14,.3 |
封装形状 | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | IN-LINE | - | IN-LINE |
包装方法 | TAPE AND REEL | - | TUBE | - | TUBE |
峰值回流温度(摄氏度) | 260 | - | NOT SPECIFIED | - | NOT SPECIFIED |
电源 | 5 V | - | 5 V | - | 2/6 V |
传播延迟(tpd) | 53 ns | - | 53 ns | - | 265 ns |
认证状态 | Not Qualified | - | Not Qualified | - | Not Qualified |
座面最大高度 | 1 mm | - | 4.2 mm | - | 4.2 mm |
最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | - | 6 V |
最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | - | 2 V |
标称供电电压 (Vsup) | 5 V | - | 5 V | - | 5 V |
表面贴装 | YES | - | NO | - | NO |
技术 | CMOS | - | CMOS | - | CMOS |
端子面层 | NICKEL PALLADIUM GOLD | - | NICKEL PALLADIUM GOLD | - | NICKEL/PALLADIUM/GOLD (NI/PD/AU) |
端子节距 | 0.5 mm | - | 2.54 mm | - | 2.54 mm |
处于峰值回流温度下的最长时间 | 30 | - | NOT SPECIFIED | - | NOT SPECIFIED |
宽度 | 2.5 mm | - | 7.62 mm | - | 7.62 mm |
最小 fmax | 18 MHz | - | 18 MHz | - | 24 MHz |
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