Quad bilateral switches
| 参数名称 | 属性值 |
| Source Url Status Check Date | 2013-06-14 00:00:00 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | MO-001 |
| 包装说明 | DIP, DIP14,.3 |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 模拟集成电路 - 其他类型 | SPST |
| JESD-30 代码 | R-PDIP-T14 |
| JESD-609代码 | e4 |
| 长度 | 19.025 mm |
| 正常位置 | NO |
| 信道数量 | 1 |
| 功能数量 | 4 |
| 端子数量 | 14 |
| 标称断态隔离度 | 50 dB |
| 通态电阻匹配规范 | 5 Ω |
| 最大通态电阻 (Ron) | 142 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出 | SEPARATE OUTPUT |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 2/9 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.2 mm |
| 最大供电电压 (Vsup) | 10 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 4.5 V |
| 表面贴装 | NO |
| 最长断开时间 | 45 ns |
| 最长接通时间 | 30 ns |
| 切换 | MAKE-BEFORE-BREAK |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |

| 74HC4066N | 74HCT4066BQ | 74HCT4066N | 74HC4066 | 74HC4066BQ | 74HC4066DB | 74HC4066PW | |
|---|---|---|---|---|---|---|---|
| 描述 | Quad bilateral switches | Quad bilateral switches | Quad bilateral switches | Quad bilateral switches | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PQCC14 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO14 | Quad bilateral switches |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | - | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | MO-001 | QFN | MO-001 | - | QFN | SSOP | TSSOP |
| 包装说明 | DIP, DIP14,.3 | 2.5 X 3 MM, 0.85 MM HEIGHT, PLASTIC, SOT-762-1, MO-241, DHVQFN-14 | DIP, DIP14,.3 | - | VQCCN, LCC14,.1X.12,20 | SSOP, SSOP14,.3 | TSSOP, TSSOP14,.25 |
| 针数 | 14 | 14 | 14 | - | 14 | 14 | 14 |
| Reach Compliance Code | unknown | compliant | unknown | - | compliant | unknown | compliant |
| 模拟集成电路 - 其他类型 | SPST | SPST | SPST | - | SPST | SPST | SPST |
| JESD-30 代码 | R-PDIP-T14 | R-PQCC-N14 | R-PDIP-T14 | - | R-PQCC-N14 | R-PDSO-G14 | R-PDSO-G14 |
| JESD-609代码 | e4 | e4 | e4 | - | e4 | e4 | e4 |
| 长度 | 19.025 mm | 3 mm | 19.025 mm | - | 3 mm | 6.2 mm | 5 mm |
| 正常位置 | NO | NO | NO | - | NO | NO | NO |
| 信道数量 | 1 | 1 | 1 | - | 1 | 1 | 1 |
| 功能数量 | 4 | 4 | 4 | - | 4 | 4 | 4 |
| 端子数量 | 14 | 14 | 14 | - | 14 | 14 | 14 |
| 标称断态隔离度 | 50 dB | 50 dB | 50 dB | - | 50 dB | 50 dB | 50 dB |
| 通态电阻匹配规范 | 5 Ω | 5 Ω | 5 Ω | - | 5 Ω | 5 Ω | 5 Ω |
| 最大通态电阻 (Ron) | 142 Ω | 142 Ω | 142 Ω | - | 142 Ω | 142 Ω | 142 Ω |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | - | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 输出 | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | - | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | VQCCN | DIP | - | VQCCN | SSOP | TSSOP |
| 封装等效代码 | DIP14,.3 | LCC14,.1X.12,20 | DIP14,.3 | - | LCC14,.1X.12,20 | SSOP14,.3 | TSSOP14,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER, VERY THIN PROFILE | IN-LINE | - | CHIP CARRIER, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | 260 | NOT SPECIFIED | - | 260 | 260 | 260 |
| 电源 | 2/9 V | 5 V | 5 V | - | 2/9 V | 2/9 V | 2/9 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.2 mm | 1 mm | 4.2 mm | - | 1 mm | 2 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 10 V | 5.5 V | 5.5 V | - | 10 V | 10 V | 10 V |
| 最小供电电压 (Vsup) | 2 V | 4.5 V | 4.5 V | - | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V |
| 表面贴装 | NO | YES | NO | - | YES | YES | YES |
| 最长断开时间 | 45 ns | 53 ns | 53 ns | - | 45 ns | 45 ns | 45 ns |
| 最长接通时间 | 30 ns | 36 ns | 36 ns | - | 30 ns | 30 ns | 30 ns |
| 切换 | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK | - | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | - | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | - | NO LEAD | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 0.5 mm | 2.54 mm | - | 0.5 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | QUAD | DUAL | - | QUAD | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | NOT SPECIFIED | - | 30 | 30 | 30 |
| 宽度 | 7.62 mm | 2.5 mm | 7.62 mm | - | 2.5 mm | 5.3 mm | 4.4 mm |
| Base Number Matches | 1 | 1 | 1 | - | 1 | 1 | 1 |
| 湿度敏感等级 | - | 1 | - | - | 1 | 1 | 1 |
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