b. Pulse width limited by maximum junction temperature
Document Number: 72322
S09-0130-Rev. B, 02-Feb-09
www.vishay.com
1
t
≤
5s
Steady State
Steady State
Symbol
R
thJA
R
thJF
Typical
75
120
40
Maximum
100
166
50
°C/W
Unit
Si2318DS
Vishay Siliconix
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
Limits
Parameter
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-Resistance
a
Forward Transconductance
a
Diode Forward Voltage
Dynamic
b
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Switching
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
t
d(on)
t
r
t
d(off)
t
f
V
DD
= 20 V, R
L
= 20
Ω
I
D
≅
1.0 A, V
GEN
= 10 V, R
G
= 6
Ω
5
12
20
15
10
20
30
25
ns
Q
g
Q
gs
Q
gd
R
g
C
iss
C
oss
C
rss
V
DS
= 20 V, V
GS
= 0 V, f = 1 MHz
V
DS
= 20 V, V
GS
= 10 V, I
D
= 3.9 A
10
1.6
2.1
1.8
540
80
45
pF
Ω
15
nC
V
(BR)DSS
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
V
SD
V
GS
= 0 V, I
D
= 250 µA
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= 0 V, V
GS
= ± 20 V
V
DS
= 32 V, V
GS
= 0 V
V
DS
= 32 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
≥
4.5 V, V
GS
= 10 V
V
GS
= 10 V, I
D
= 3.9 A
V
GS
= 4.5 V, I
D
= 3.5 A
V
DS
= 10 V, I
D
= 3.9 A
I
S
= 1.25 A, V
GS
= 0 V
6
0.036
0.045
11
0.8
1.2
0.045
0.058
40
1
3
± 100
0.5
10
V
nA
µA
A
Ω
S
V
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Notes:
a. Pulse test; PW
≤
300 µs, duty cycle
≤
2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
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