PULSE WIDTH MODULATOR
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 模拟集成电路 - 其他类型 | SWITCHING CONTROLLER |
| 控制模式 | VOLTAGE-MODE |
| 控制技术 | PULSE WIDTH MODULATION |
| 最大输入电压 | 35 V |
| 最小输入电压 | 8 V |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 长度 | 19.43 mm |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 最大输出电流 | 0.2 A |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电流 (Isup) | 18 mA |
| 表面贴装 | NO |
| 切换器配置 | PUSH-PULL |
| 最大切换频率 | 400 kHz |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| LM1525AJ | LM3525A | LM3525AJ | LM3525AN | LM3527A | LM3527AJ | LM3527AN | LM1525A | LM1527A | LM1527AJ | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | PULSE WIDTH MODULATOR | PULSE WIDTH MODULATOR | PULSE WIDTH MODULATOR | PULSE WIDTH MODULATOR | PULSE WIDTH MODULATOR | PULSE WIDTH MODULATOR | PULSE WIDTH MODULATOR | PULSE WIDTH MODULATOR | PULSE WIDTH MODULATOR | PULSE WIDTH MODULATOR |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | - | 不符合 | 不符合 | - | - | 不符合 |
| 包装说明 | DIP, DIP16,.3 | - | DIP, DIP16,.3 | DIP, DIP16,.3 | - | DIP, DIP16,.3 | DIP, DIP16,.3 | - | - | DIP, DIP16,.3 |
| Reach Compliance Code | unknow | - | unknow | unknow | - | unknow | unknow | - | - | unknow |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | - | EAR99 | EAR99 | - | - | EAR99 |
| 模拟集成电路 - 其他类型 | SWITCHING CONTROLLER | - | SWITCHING CONTROLLER | SWITCHING CONTROLLER | - | SWITCHING CONTROLLER | SWITCHING CONTROLLER | - | - | SWITCHING CONTROLLER |
| 控制模式 | VOLTAGE-MODE | - | VOLTAGE-MODE | VOLTAGE-MODE | - | VOLTAGE-MODE | VOLTAGE-MODE | - | - | VOLTAGE-MODE |
| 控制技术 | PULSE WIDTH MODULATION | - | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | - | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | - | - | PULSE WIDTH MODULATION |
| 最大输入电压 | 35 V | - | 35 V | 35 V | - | 35 V | 35 V | - | - | 35 V |
| 最小输入电压 | 8 V | - | 8 V | 8 V | - | 8 V | 8 V | - | - | 8 V |
| JESD-30 代码 | R-GDIP-T16 | - | R-GDIP-T16 | R-PDIP-T16 | - | R-GDIP-T16 | R-PDIP-T16 | - | - | R-GDIP-T16 |
| JESD-609代码 | e0 | - | e0 | e0 | - | e0 | e0 | - | - | e0 |
| 长度 | 19.43 mm | - | 19.43 mm | 21.755 mm | - | 19.43 mm | 21.755 mm | - | - | 19.43 mm |
| 功能数量 | 1 | - | 1 | 1 | - | 1 | 1 | - | - | 1 |
| 端子数量 | 16 | - | 16 | 16 | - | 16 | 16 | - | - | 16 |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | - | 125 °C | 125 °C | - | - | 125 °C |
| 最大输出电流 | 0.2 A | - | 0.2 A | 0.2 A | - | 0.2 A | 0.2 A | - | - | 0.2 A |
| 封装主体材料 | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | - | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | - | - | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | - | DIP | DIP | - | DIP | DIP | - | - | DIP |
| 封装等效代码 | DIP16,.3 | - | DIP16,.3 | DIP16,.3 | - | DIP16,.3 | DIP16,.3 | - | - | DIP16,.3 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR |
| 封装形式 | IN-LINE | - | IN-LINE | IN-LINE | - | IN-LINE | IN-LINE | - | - | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - | - | Not Qualified |
| 座面最大高度 | 5.08 mm | - | 5.08 mm | 5.08 mm | - | 5.08 mm | 5.08 mm | - | - | 5.08 mm |
| 最大供电电流 (Isup) | 18 mA | - | 20 mA | 20 mA | - | 20 mA | 20 mA | - | - | 18 mA |
| 表面贴装 | NO | - | NO | NO | - | NO | NO | - | - | NO |
| 切换器配置 | PUSH-PULL | - | PUSH-PULL | PUSH-PULL | - | PUSH-PULL | PUSH-PULL | - | - | PUSH-PULL |
| 最大切换频率 | 400 kHz | - | 400 kHz | 400 kHz | - | 400 kHz | 400 kHz | - | - | 400 kHz |
| 技术 | BIPOLAR | - | BIPOLAR | BIPOLAR | - | BIPOLAR | BIPOLAR | - | - | BIPOLAR |
| 温度等级 | MILITARY | - | OTHER | OTHER | - | OTHER | OTHER | - | - | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | - | - | THROUGH-HOLE |
| 端子节距 | 2.54 mm | - | 2.54 mm | 2.54 mm | - | 2.54 mm | 2.54 mm | - | - | 2.54 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | - | DUAL | DUAL | - | - | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
| 宽度 | 7.62 mm | - | 7.62 mm | 7.62 mm | - | 7.62 mm | 7.62 mm | - | - | 7.62 mm |
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