OP-AMP, 5000 uV OFFSET-MAX, PDIP8
运算放大器, 5000 uV 最大补偿, PDIP8
参数名称 | 属性值 |
最大输入失调电压 | 5000 µV |
最大负供电电压 | -3.5 V |
额定负供电电压 | -3.25 V |
功能数量 | 1 |
端子数量 | 8 |
最小工作温度 | 0.0 Cel |
最大工作温度 | 70 Cel |
额定旋转率 | 0.2000 V/us |
最大供电/工作电压 | 3.5 V |
额定供电电压 | 3.25 V |
加工封装描述 | DIP-8 |
each_compli | Yes |
状态 | Transferred |
放大器类型 | OPERATIONAL AMPLIFIER |
chitecture | VOLTAGE-FEEDBACK |
最大输入偏置电流IIB | 0.0400 µA |
bias_current_max__iib___25c | 0.0300 µA |
额定共模抑制比 | 102 dB |
frequency_compensati | YES |
jesd_30_code | R-PDIP-T8 |
jesd_609_code | e0 |
low_offse | NO |
micropowe | YES |
moisture_sensitivity_level | 1 |
包装材料 | PLASTIC/EPOXY |
ckage_code | DIP |
ckage_equivalence_code | DIP8,.3 |
包装形状 | RECTANGULAR |
包装尺寸 | IN-LINE |
cking_method | RAIL |
eak_reflow_temperature__cel_ | 260 |
wer_supplies__v_ | +-3.25 |
qualification_status | COMMERCIAL |
seated_height_max | 5.08 mm |
sub_category | Operational Amplifiers |
最大供电电压 | 0.5700 mA |
表面贴装 | NO |
工艺 | BIPOLAR |
温度等级 | COMMERCIAL |
端子涂层 | TIN LEAD |
端子形式 | THROUGH-HOLE |
端子间距 | 2.54 mm |
端子位置 | DUAL |
ime_peak_reflow_temperature_max__s_ | 40 |
最小电压增益 | 750 |
length | 9.82 mm |
width | 7.62 mm |
LM10CLH | LM10CH | LM10CLN | LM10CN | LM10CWM | LM10H/883 | |
---|---|---|---|---|---|---|
描述 | OP-AMP, 5000 uV OFFSET-MAX, PDIP8 | OP-AMP, 5000 uV OFFSET-MAX, PDIP8 | OP-AMP, 5000 uV OFFSET-MAX, PDIP8 | OP-AMP, 5000 uV OFFSET-MAX, PDIP8 | OP-AMP, 5000 uV OFFSET-MAX, PDSO14 | OP-AMP, 3000 uV OFFSET-MAX, MBCY8 |
最大输入失调电压 | 5000 µV | 5000 µV | 5000 µV | 5000 µV | 5000 µV | 3000 µV |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 14 | 8 |
放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
表面贴装 | NO | NO | NO | NO | YES | NO |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
端子形式 | THROUGH-HOLE | WIRE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | WIRE |
端子位置 | DUAL | BOTTOM | DUAL | DUAL | DUAL | BOTTOM |
最小电压增益 | 750 | 750 | 750 | 750 | 750 | 500 |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | - | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | - | National Semiconductor(TI ) |
零件包装代码 | - | BCY | DIP | DIP | SOIC | BCY |
包装说明 | - | METAL CAN-8 | DIP-8 | DIP-8 | PLASTIC, SOP-14 | , CAN8,.2 |
针数 | - | 8 | 8 | 8 | 14 | 8 |
Reach Compliance Code | - | _compli | _compli | _compli | _compli | _compli |
ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
架构 | - | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
最大平均偏置电流 (IIB) | - | 0.04 µA | 0.04 µA | 0.04 µA | 0.04 µA | 0.03 µA |
25C 时的最大偏置电流 (IIB) | - | 0.03 µA | 0.03 µA | 0.03 µA | 0.03 µA | 0.02 µA |
标称共模抑制比 | - | 102 dB | 102 dB | 102 dB | 102 dB | 102 dB |
频率补偿 | - | YES | YES | YES | YES | YES |
JESD-30 代码 | - | O-MBCY-W8 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G14 | O-MBCY-W8 |
JESD-609代码 | - | e0 | e0 | e0 | e0 | e0 |
低-失调 | - | NO | NO | NO | NO | NO |
微功率 | - | YES | YES | YES | YES | YES |
湿度敏感等级 | - | 1 | 1 | 1 | 2A | 1 |
负供电电压上限 | - | -22.5 V | -3.5 V | -22.5 V | -22.5 V | -22.5 V |
标称负供电电压 (Vsup) | - | -20 V | -3.25 V | -20 V | -20 V | -20 V |
最高工作温度 | - | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C |
封装主体材料 | - | METAL | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | METAL |
封装等效代码 | - | CAN8,.2 | DIP8,.3 | DIP8,.3 | SOP14,.4 | CAN8,.2 |
封装形状 | - | ROUND | RECTANGULAR | RECTANGULAR | RECTANGULAR | ROUND |
封装形式 | - | CYLINDRICAL | IN-LINE | IN-LINE | SMALL OUTLINE | CYLINDRICAL |
峰值回流温度(摄氏度) | - | 260 | 260 | 260 | 220 | 260 |
电源 | - | +-20 V | +-3.25 V | +-20 V | +-20 V | +-20 V |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称压摆率 | - | 0.2 V/us | 0.2 V/us | 0.2 V/us | 0.2 V/us | 0.2 V/us |
最大压摆率 | - | 0.57 mA | 0.57 mA | 0.57 mA | 0.57 mA | 0.5 mA |
供电电压上限 | - | 22.5 V | 3.5 V | 22.5 V | 22.5 V | 22.5 V |
标称供电电压 (Vsup) | - | 20 V | 3.25 V | 20 V | 20 V | 20 V |
技术 | - | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
处于峰值回流温度下的最长时间 | - | 40 | 40 | 40 | 30 | 40 |
包装方法 | - | - | RAIL | RAIL | RAIL | TRAY |
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