Multilayer Ceramic Capacitors(For General Usage)
Multilayer Ceramic Capacitors
(For General Electronic Equipment)
Series:
ECJ
■
Features
●
●
●
●
Small size and wide capacitance range
High humidity resistance and long life
Excellent solderability and resistance to soldering heat
Low inductance (ESL) and excellent frequency
characteristics
●
RoHS compliant
■
Recommended Applications
●
Class 1 (T.C. Type)
Tuned circuits, and filter circuitry, where low loss and
high stability of capacitance and high insulation
resistance is required
●
Class 2 (Hi-K Type)
Coupling and By-passing
■
Handling Precautions
See Page 48 to 53
■
Packaging Specifications
See Page 45, 46, 56
■
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
E
C
J
Z
E
B
1
A
1
0
3
K
(Example)
Product Code
(ECJ:Multilayer Ceramic
Chip Capacitors)
Packaging
Rated Voltage Code
Style Code
Temperature
Size Code
Characteristic Code
Capacitance
Tolerance Code
Nominal Capacitance
■
Construction
No
1
3
4
5
2
1
Name
Ceramic dielectric
Internal electrode
Substrate electrode
Terminal
electrode
Intermediate electrode
External electrode
2
3
4
5
■
Dimensions in mm (not to scale)
L
Size Code Size (EIA)
Z
0201
0402
0603
L
0.60±0.03
1.00±0.05
1.6±0.1
2.0±0.1
2.00±0.15
W
0.30±0.03
0.50±0.05
0.8±0.1
1.25±0.10
1.25±0.15
T
0.30±0.03
0.50±0.05
0.8±0.1
0.6±0.1
0.85±0.10
1.25±0.10
1.25±0.15
L
1
, L
2
0.15±0.05
0.2±0.1
0.3±0.2
W
0
1
T
L
1
L
2
2
0805
0.50±0.25
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Sep. 2008
– EC8 –
Multilayer Ceramic Capacitors(For General Usage)
■
Packaging Styles and Standard Packaging Quantities
Packaging
Size
Style
Thickness (mm)
Code Packaging Styles
Paper taping
E
(Pitch: 2 mm)
Paper taping
φ180
V
(Pitch: 4 mm)
reel
Embossed taping
F
(Pitch: 4 mm)
φ330
reel and bulk case type : Please contact us
Quantity (Taping: pcs./reel)
0201
T=0.3
15,000
—
—
0402
T=0.5
10,000
—
—
0603
T=0.8
—
4,000
—
T=0.6
—
5,000
—
0805
T=0.85
—
4,000
—
T=1.25
—
—
3,000
■
Temperature Characteristics
●
Class 1
Temperature
Characteristic
Code
Temperature
Characteristics
>10
pF
>4
pF
3 pF
<2
pF
SL
CG
CH
CJ
CK
Temp. Coeff.
(ppm/°C)
0± 30
0± 60
0±120
0±250
+350 to –1000
Rate of Capacitance change at each Temperature (%)
–25 °C
85 °C
max.
min.
max.
min.
0.33
–0.14
0.20
–0.20
0.49
–0.27
0.39
–0.39
0.82
–0.54
0.78
–0.78
1.54
–1.13
1.63
–1.63
—
—
2.28
–6.50
C
G
C∆
Temperature coefficient: calculated between 20 °C to 85 °C
For applicable “temperature characteristics”, see the lists of standard products on page 13 to 19.
●
Class 2
Temperature
Characteristic Code
B
F
Temperature
Characteristics
B
X7R
X5R
F
Y5V
Capacitance Change
±10 %
±15 %
±15 %
+30, –80 %
+22, –82 %
Measurement
Temperature Range
–25 to 85 °C
–55 to 125 °C
–55 to 85 °C
–25 to 85 °C
–30 to 85 °C
Reference
Temperature
20 °C
25 °C
25 °C
20 °C
25 °C
For applicable “temperature characteristics”, see the lists of standard products on page 13 to 19.
■
Rated Voltage
Code
Rated Voltage
1H
DC 50 V
1E
DC 25 V
1C
DC 16 V
1A
DC 10 V
0J
DC 6.3 V
■
Nominal Capacitance
Ex
Nominal
Capacitance
0R5
0.5 pF
010
1 pF
100
10 pF
104
100,000 pF
(0.1 µF)
■
Capacitance Tolerance
Class
Temperature Characteristics
C
<
5
C
<10
Capacitance
C∆, SL
C =10
range
C
>10
B, X7R, X5R
F, Y5V
pF
pF
pF
pF
Tol. Code
C
D
F
J
K
K
M
Z
Capacitance Tolerance
±0.25 pF
±0.5 pF
±1 pF
±5 %
±10 %
±10 %
±20 %
+80, –20 %
1
2
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Sep. 2008
– EC9 –
Multilayer Ceramic Capacitors(For General Usage)
■
Specifications and Testing Methods
Item
Operating
Temperature
Range
Specification
Class 1
Temp. Char. C∆
: –55 to 125 °C
: –25 to 85 °C
Temp. Char. SL
: –55 to 125 °C
Class 2
Temp. Char. B, X7R
: –55 to 125 °C
Temp. Char. B, X5R
: –55 to 85 °C
Temp. Char. F, Y5V
: –30 to 85 °C
No dielectric breakdown and /or damage
Test Method
Dielectric
Withstanding
Voltage
Insulation
Resistance
(I R)
Capacitance
Q Factor or
Dissipation
Factor
(tan
δ)
10000 M or 500/C (M ) whichever is less.
Note:100/C(M )min. for DC 10 V max.
C:Nominal Cap. in µF
Within the specified tolerance.
tan
δ:
Q:
Temp. Char. B, X7R, X5R:
C<30 pF: Q
>400+20C
0.15 max.
30 pF<C
<1000
pF:Q
>1000
Temp. Char. F, Y5V:
0.2 max.
tan
δ:
Please see the technical
C>1000 pF: tan
δ<
0.002
specifications for details.
(C:Nominal Cap. in pF)
Test voltage:
Class 1:Rated voltage 300 %
Class 2:Rated voltage 250 %
Duration:1 to 5 s
Charge/discharge current : 50 mA max.
Measuring voltage:Rated voltage
Duration: 60±5 s
Charge/discharge current : 50 mA max.
Measuring temperature: 20±2 °C
Class 1:
Nominal capacitance C
<
1000 pF C > 1000 pF
Measuring frequency 1 MHz ± 10 % 1 kHz ± 10 %
Measuring voltage 0.5 to 5 Vrms 0.5 to 5 Vrms
Class 2:
Preconditioning: The capacitors shall be kept
in temperature of 150 +0/–10 °C for 1 hour
and subjected to standard condition
½
48±4
hours before initial measurement.
Nominal capacitance
C < 1 µF
Measuring frequency 1 kHz ± 10 %
Measuring voltage 1.0 ± 0.2 Vrms
Temperature
Temp. Char.
Characteristics
CG : 0± 30 ppm/ °C
CH : 0± 60 ppm/ °C
CJ : 0±120 ppm/ °C
CK : 0±250 ppm/ °C
SL : +350 to –1000 ppm/ °C
Temp.
B
X7R
X5R
F
Y5V
Char.
: ±10 %
: ±15 %
: ±15 %
: +30, –80 %
: +22, –82 %
Maximum capacitance change at stage 1 to 5
Temp.
Char.
1
2
3
(Ref. Temp.)
4
5
C∆, SL
X7R X5R Y5V
B, F
20 °C 25 °C 25 °C 25 °C
–25 °C –55 °C –55 °C –30 °C
20 °C 25 °C 25 °C 25 °C
85 °C 125 °C 85 °C 85 °C
20 °C 25 °C 25 °C 25 °C
Adhesion
Terminal electrodes shall be free from peeling or signs of
peeling.
See the technical specifications for
details such as measuring voltage.
Applied force:
Size: 0201: 2 N
Size: 0402 to 0805: 5N
Duration: 10 s
Size: 0201 to 0402
1.0
0.5R
0.3/Size:0201
0.5/Size:0402
Sample
PC board
Size: 0603 to 0805
1.0
Sample
½Standard
conditions : Temperature 15 to 35 °C, Relative humidity 45 to 75 %
Unit : mm
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Sep. 2008
– EC10 –
Multilayer Ceramic Capacitors(For General Usage)
Item
Bending
Strength
Specification
Class 1
Appearance:
No mechanical damage
Capacitance change:
Within ±5 % or ±0.5 pF
whichever is larger.
45±2
45±2
Unit : mm
Vibration
Proof
Appearance: No mechanical damage.
Capacitance: within the specified tolerance
Q, tan
δ:
Initial standard value
Appearance:
No mechanical damage
Capacitance change:
Within ±2.5 % or ±0.25 pF
whichever is larger.
Q.tan
δ:Initial
standard value
IR:Initial standard value
Withstand voltage:
No dielectric breakdown
and/or damage
Appearance:
No mechanical damage
Capacitance change:
Temp. Char.
B, X7R, X5R : within ±7.5 %
F, Y5V
: within ±20 %
tan
δ:Initial
standard value
IR:Initial standard value
Withstand voltage:
No dielectric breakdown
and/or damage
Total amplitude : 1.5 mm
Vibration frequency : 10 to 55 to 10 Hz
for 1 min.
3 perpendicular directions for 2 hours
each, a total of 6 hours
Resistance
to Soldering
Heat
Soldering bath method
Preconditioning:Heat treatment/Class 2
(½1)
Solder temperature:270±5 °C
Dipping period:3.0±0.5 s
Preheat condition:
Order Temp. (°C) Size 0805 max.
1
2
80 to 100
150 to 200
120 to 180 s
120 to 180 s
Recovery (Standard condition):
Class 1:24±2 h
Class 2:48±4 h
Solderability More than 95 % of the soldered area of both terminal
Soldering bath method
electrodes should be covered with fresh solder.
Solder temperature:230±5 °C
Dipping period:4±1 s
Solder:H63A (JIS Z 3282)
Appearance:
Temperature Appearance:
Preconditioning:Heat treatment
No mechanical damage
Cycle
No mechanical damage
(150 °C, 1h) /Class 2
Capacitance change:
Capacitance change:
Condition of one cycle
Temp. Char.
Within ±2.5 % or ±0.25 pF
Step 1:Minimum operationing temp.
whichever is larger.
30±3 min
B, X7R, X5R : within ±7.5 %
Q.tan
δ:Initial
standard value
Step 2:Room temp.
3 min max.
F, Y5V
: within ±20 %
IR:Initial standard value
Step 3:Maximum operationing temp.
tan
δ:Initial
standard value
Withstand voltage:
30±3 min
IR:Initial standard value
No dielectric breakdown
Step 4:Room temp.
3 min max.
Withstand voltage:
and/or damage
Number of cycles:5 cycles
No dielectric breakdown
Recovery (Standard condition)
and/or damage
Class 1:24±2 h
Class 2:48±4 h
Damp Heat
Appearance:
Preconditioning:Heat treatment/Class 2
(½1)
Appearance:
(Steady state)
No mechanical damage
No mechanical damage
Temperature:40±2 °C
Capacitance change:
Capacitance change:
Relative humidity:90 to 95 %
Within ±5 % or ±0.5 pF
Temp. Char.
Test period:500+24/0 h
whichever is larger.
B, X7R, X5R: Within ±20 % Recovery (Standard condition)
Q:
F, Y5V: Within ±30 %
Class 1:24±2 h
C<10 pF:Q
>200+10C
tan
δ:
Class 2:48±4 h
Temp. Char.
10 pF<C<30 pF:Q
>275+5C/2
B, X7R, X5R: 0.25 max.
30 pF<C
<1000
pF:Q
>
350
F, Y5V: 0.3 max.
tan
δ:
IR:
C>1000 pF:tan
δ<
0.004
1000 M or 50/C (M )
C:Nominal capacitance in pF
Whichever is less.
IR:
1000 M or 50/C (M )
Note:10/C (M ) min. for DC 10 V max.
Whichever is less.
C:Nominal capacitance in µF
C:Nominal capacitance in µF Please see the technical
specifications for details.
(½1) Heat treatment: 1 h of heat treatment at 150 +0/-10 °C followed by 48±4 h recovery under standard conditions.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Sep. 2008
– EC11 –
Bending Value
Test Method
Class 2
Appearance:
Bending value:1 mm
No mechanical damage
Bending speed:1 mm/
Capacitance change:
Temp. Char.
20
B, X7R, X5R : within ±12.5 %
R340
F ,Y5V
: within ±30 %
Multilayer Ceramic Capacitors(For General Usage)
Specification
Class 1
Appearance:
No mechanical damage
Capacitance change:
Within ±7.5 % or ±0.75 pF
whichever is larger.
Q:
C<30 pF:Q
>100+10C/3
30 pF<C
<1000
pF:Q
>200
tan
δ:
C>1000 pF:tan
δ<
0.004
(C:Nominal capacitance in pF)
IR:
500 M or 25/C (M )
Whichever is less.
(C:Nominal capacitance in µF)
Class 2
Appearance:
No mechanical damage
Capacitance change:
Temp. Char.
B, X7R, X5R: Within ±20 %
F, Y5V: Within ±30 %
tan
δ:
Temp. Char.
B, X7R, X5R: 0.25 max.
F, Y5V: 0.3 max.
IR:
500 M or 25/C (M )
Whichever is less.
Note:5/C (M ) min. for
DC 10 V max.
C:Nominal capacitance in µF
Please see the technical
specifications for details.
Appearance:
No mechanical damage
Capacitance change:
Temp. Char.
B, X7R, X5R: Within ±20 %
F, Y5V: Within ±30 %
tan
δ:
Temp. Char.
B, X7R, X5R: 0.25 max.
F, Y5V: 0.3 max.
IR:
1000 MΩ or 50/C (M )
Whichever is less.
Note:10/C (M ) min. for
DC 10 V max.
C:Nominal capacitance in µF
Please see the technical
specifications for details.
Item
Damp Heat
Load
Test Method
Preconditioning:Voltage treatment/Class 2
(½2)
Temperature:40±2 °C
Relative humidity:90 to 95 %
Applied voltage:Rated voltage
Charge/discharge current: 50 mA max.
Test period:500+24/0 h
Recovery (Standard condition)
Class 1:24±2 h
Class 2:48±4 h
High
Temperature
Load
Appearance:
No mechanical damage
Capacitance change:
Within ±3 % or ±0.3 pF
whichever is larger.
Q:
C<10 pF:Q
>200+10C
10 pF<C<30 pF:Q
>275+5C/2
30 pF<C
<1000
pF:Q
>
350
tan
δ:
C>1000 pF:tan
δ<
0.004
C:Nominal capacitance in pF
IR:
1000 M or 50/C (M )
Whichever is less.
C:Nominal capacitance in µF
Preconditioning:Voltage treatment/Class 2
(½2)
Temperature:
Maximum operating temp. ±3 °C
Applied voltage:
(1) Rated voltage ×200 %
(2) Rated voltage ×100 %
Please see the technical specifications
for details.
Charge/discharge current: 50 mA max.
Test period:1000+48/0 h
Recovery (Standard condition)
Class 1:24±2 h
Class 2:48±4 h
(½1) Heat treatment:1 h of heat treatment at 150+0/–10 °C followed by 48±4 h recovery under standard conditions
(½2) Voltage treatment:1 h of voltage treatment under the specified temperature and voltage for testing followed by 48±4 h of recovery under
standard conditions
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Sep. 2008
– EC12 –
嵌入式系统
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