SMBJ5.0 THRU SMBJ440CA
SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR
Stand-off Voltage: 5.0-440 Volts
Peak pulse power: 600 Watts
SMB/DO-214AA
FEATURE
For surface mounted applications in order to optimize board space
Low profile package
Built-in strain relief
Glass passivated junction
Low inductance
Excellent clamping capability
600W peak pulse power capability at 10/1000μs waveform,
repetition rate (duty cycle): 0.01%
Fast response time
Typical I
R
less than 1μA above 10V
High Temperature soldering: 260
℃
/10 seconds at terminals
Plastic package has underwriters laboratory flammability 94V-0
0.087 (2.20)
0.071 (1.80)
0.155(3.94)
0.130(3.30)
0.180(4.57)
0.160(4.06)
0.012(0.305)
0.006(0.152)
0.096(2.44)
0.084(2.13)
0.060(1.52)
0.030(0.76)
MECHANICAL DATA
0.008(0.203)MAX.
0.220(5.59)
0.205(5.21)
Dimensions in inches and (millimeters)
Case: JEDEC DO-214AA. Molded plastic over glass passivated junction
Terminal: Solder plated, solderable per MIL-STD-750, Method 2026
Polarity: Color band denotes cathode except bi-directional models
Standard Packaging: 12mm tape (EIA STD RS-481)
Weight: 0.10g
APPLICATIONS
I/O interface
AC/DC power supply
Low frequency signal transmission line (RS232, RS485, etc.)
MAXIMUM RATINGS AND CHARACTERISTICS
Ratings at 25℃ ambient temperature unless otherwise specified.
Peak pulse power dissipation at 10/1000μs waveform
(Note1, Note2, Fig.1)
Peak pulse current of at 10/1000μs waveform (Note 1, Fig.3)
Steady state power dissipation at T
A
=50℃ (Fig.5)
Peak forward surge current, 8.3ms single half sine-wave
superimposed on rated load, (JEDEC Method) (Note3, Fig.6)
Operating junction and Storage Temperature Range.
Typical thermal resistance junction to lead
Typical thermal resistance junction to ambient
P
PPM
I
PPM
P
M(AV)
I
FSM
T
J
,T
STG
R
θJL
R
θJA
Minimum 600
See Table
5.0
100
-65 to +150
20
100
Watts
Amps
Watts
Amps
℃
℃/W
℃/W
Notes: 1. Non-repetitive current pulse, per Fig.3 and derated above T
A
=25℃ per Fig.2.
2. Mounted on 5.0mm×5.0mm (0.03mm thick) copper pads to each terminal.
3. 8.3ms single half sine-wave, or equivalent square wave, duty cycle=4 pulses per minutes maximum.
Figure 5. Steady State Power Dissipation Derating
Curve
P
M(AV)
, Steady State Power Dissipation (W)
Figure 6. Maximum Non-Repetitive Forward
Surge Current Uni-Directional Only
Reflow Soldering
Recommended Conditions
Profile Feature
Average ramp-up rate (T
L
to T
P
)
Preheat
-Temperature Min (T
S min
)
-Temperature Max (T
S max
)
-Time (min to max) ( t
S
)
T
S max
to T
L
-Ramp-up Rate
Time maintained above:
-Temperature (T
L
)
-Time (t
L
)
Peak Temperature (T
P
)
Time within 5℃ of actual Peak Temperature (t
P
)
Ramp-down Rate
Time 25℃ to Peak Temperature
Pb-Free Assembly
3
℃/second
max.
150℃
200℃
60-180 seconds
3℃/second max.
217℃
60-150 seconds
260
℃
20-40 seconds
6
℃/second
max.
8 minutes max.
FPGA/CPLD
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