Octal Transparent D-Type Latch with 3-State Outputs 20-BGA MICROSTAR JUNIOR -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | VFBGA, BGA20,4X5,25 |
| 针数 | 20 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 控制类型 | ENABLE LOW/HIGH |
| 计数方向 | UNIDIRECTIONAL |
| 系列 | ALVC/VCX/A |
| JESD-30 代码 | R-PBGA-B20 |
| JESD-609代码 | e1 |
| 长度 | 4 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.024 A |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA20,4X5,25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 包装方法 | TR |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| 最大电源电流（ICC） | 0.02 mA |
| Prop。Delay @ Nom-Su | 3.6 ns |
| 传播延迟（tpd） | 6.1 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.65 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 翻译 | N/A |
| 宽度 | 3 mm |
| SN74ALVCH373ZQNR | SN74ALVCH373DWR | SN74ALVCH373DW | SN74ALVCH373DGVR | SN74ALVCH373PWRE4 | SN74ALVCH373PWRG4 | |
|---|---|---|---|---|---|---|
| 描述 | Octal Transparent D-Type Latch with 3-State Outputs 20-BGA MICROSTAR JUNIOR -40 to 85 | Octal Transparent D-Type Latch with 3-State Outputs 20-SOIC -40 to 85 | Octal Transparent D-Type Latch with 3-State Outputs 20-SOIC -40 to 85 | Octal Transparent D-Type Latch with 3-State Outputs 20-TVSOP -40 to 85 | Octal Transparent D-Type Latch with 3-State Outputs 20-TSSOP -40 to 85 | Octal Transparent D-Type Latch with 3-State Outputs 20-TSSOP -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | BGA | SOIC | SOIC | SOIC | TSSOP | TSSOP |
| 包装说明 | VFBGA, BGA20,4X5,25 | SOP, SOP20,.4 | SOP, SOP20,.4 | TSSOP, TSSOP20,.25,16 | TSSOP, TSSOP20,.25 | TSSOP, TSSOP20,.25 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli |
| 系列 | ALVC/VCX/A | ALVC/VCX/A | ALVC/VCX/A | ALVC/VCX/A | ALVC/VCX/A | ALVC/VCX/A |
| JESD-30 代码 | R-PBGA-B20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
| JESD-609代码 | e1 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 4 mm | 12.8 mm | 12.8 mm | 5 mm | 6.5 mm | 6.5 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VFBGA | SOP | SOP | TSSOP | TSSOP | TSSOP |
| 封装等效代码 | BGA20,4X5,25 | SOP20,.4 | SOP20,.4 | TSSOP20,.25,16 | TSSOP20,.25 | TSSOP20,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | TR | TR | TUBE | TR | TR | TR |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Su | 3.6 ns | 3.6 ns | 3.6 ns | 3.6 ns | 3.6 ns | 3.6 ns |
| 传播延迟（tpd） | 6.1 ns | 6.1 ns | 6.1 ns | 6.1 ns | 6.1 ns | 6.1 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1 mm | 2.65 mm | 2.65 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | BALL | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 1.27 mm | 1.27 mm | 0.4 mm | 0.65 mm | 0.65 mm |
| 端子位置 | BOTTOM | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3 mm | 7.5 mm | 7.5 mm | 4.4 mm | 4.4 mm | 4.4 mm |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - |
| Factory Lead Time | 1 week | - | 1 week | 6 weeks | 6 weeks | - |
| 控制类型 | ENABLE LOW/HIGH | ENABLE LOW/HIGH | ENABLE LOW/HIGH | ENABLE LOW/HIGH | ENABLE LOW/HIGH | - |
| 计数方向 | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL | - |
| 最大电源电流（ICC） | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | - |
| 翻译 | N/A | N/A | N/A | N/A | N/A | - |
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