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SIHFU9210

产品描述1.9 A, 200 V, 3 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-252AA
产品类别分立半导体    晶体管   
文件大小798KB,共11页
制造商Vishay(威世)
官网地址http://www.vishay.com
下载文档 详细参数 选型对比 全文预览

SIHFU9210概述

1.9 A, 200 V, 3 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-252AA

1.9 A, 200 V, 3 ohm, P沟道, 硅, POWER, 场效应管, TO-252AA

SIHFU9210规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
零件包装代码TO-251
包装说明IN-LINE, R-PSIP-T3
针数3
Reach Compliance Codeunknow
ECCN代码EAR99
其他特性AVALANCHE RATED
雪崩能效等级(Eas)300 mJ
外壳连接DRAIN
配置SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压200 V
最大漏极电流 (Abs) (ID)1.9 A
最大漏极电流 (ID)1.9 A
最大漏源导通电阻3 Ω
FET 技术METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码TO-251
JESD-30 代码R-PSIP-T3
JESD-609代码e0
元件数量1
端子数量3
工作模式ENHANCEMENT MODE
最高工作温度150 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式IN-LINE
峰值回流温度(摄氏度)240
极性/信道类型P-CHANNEL
最大功率耗散 (Abs)25 W
最大脉冲漏极电流 (IDM)7.6 A
认证状态Not Qualified
表面贴装NO
端子面层Tin/Lead (Sn/Pb)
端子形式THROUGH-HOLE
端子位置SINGLE
处于峰值回流温度下的最长时间30
晶体管应用SWITCHING
晶体管元件材料SILICON
Base Number Matches1

文档预览

下载PDF文档
IRFR9210, IRFU9210, SiHFR9210, SiHFU9210
www.vishay.com
Vishay Siliconix
Power MOSFET
PRODUCT SUMMARY
V
DS
(V)
R
DS(on)
()
Q
g
(Max.) (nC)
Q
gs
(nC)
Q
gd
(nC)
Configuration
- 200
V
GS
= - 10 V
8.9
2.1
3.9
Single
S
FEATURES
3.0
DPAK
(TO-252)
D
D
IPAK
(TO-251)
G
Dynamic dV/dt Rating
Repetitive Avalanche Rated
Surface Mount (IRFR9210, SiHFR9210)
Straight Lead (IRFU9210, SiHFU9210)
Available in Tape and Reel
P-Channel
Fast Switching
Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
DESCRIPTION
The power MOSFETs technology is the key to Vishay’s
advanced line of Power MOSFET transistors. The efficient
geometry and unique processing of the Power MOSFET
design achieve very low on-state resistance combined with
high transconductance and extreme device ruggedness.
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU, SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface mount applications.
G
S
G
D S
D
P-Channel MOSFET
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
Lead (Pb)-free
Note
a. See device orientation.
DPAK (TO-252)
SiHFR9210-GE3
IRFR9210PbF
SiHFR9210-E3
DPAK (TO-252)
SiHFR9210TR-GE3
IRFR9210TRPbF
a
SiHFR9210T-E3
a
IPAK (TO-251)
SiHFU9210-GE3
IRFU9210PbF
SiHFU9210-E3
ABSOLUTE MAXIMUM RATINGS
(T
C
= 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
a
Linear Derating Factor
Linear Derating Factor (PCB
Repetitive Avalanche
Mount)
e
E
AS
I
AR
E
AR
T
C
= 25 °C
Mount)
e
T
A
= 25 °C
P
D
dV/dt
T
J
, T
stg
for 10 s
Temperature)
d
Single Pulse Avalanche Energy
b
Current
a
Repetitive Avalanche Energy
a
Maximum Power Dissipation
Maximum Power Dissipation (PCB
Peak Diode Recovery dV/dt
c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
DD
= - 50 V, starting T
J
= 25 °C, L = 124 mH, R
g
= 25
,
I
AS
= - 1.9 A (see fig. 12).
c. I
SD
- 1.9 A, dI/dt
70 A/μs, V
DD
V
DS
, T
J
150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
S13-0166-Rev. C, 04-Feb-13
Document Number: 91281
1
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
V
GS
at - 10 V
T
C
= 25 °C
T
C
= 100 °C
SYMBOL
V
DS
V
GS
I
D
I
DM
LIMIT
- 200
± 20
- 1.9
- 1.2
- 7.6
0.20
0.020
300
- 1.9
2.5
25
2.5
- 5.0
- 55 to + 150
260
W/°C
mJ
A
mJ
W
V/ns
°C
A
UNIT
V

SIHFU9210相似产品对比

SIHFU9210 SIHFR9210 SIHFR9210-E3 SIHFR9210T SIHFR9210T-E3 SIHFR9210TL SIHFU9210-E3 IRFR9210TRR
描述 1.9 A, 200 V, 3 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-252AA 1.9 A, 200 V, 3 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-252AA 1.9 A, 200 V, 3 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-252AA 1.9 A, 200 V, 3 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-252AA 1.9 A, 200 V, 3 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-252AA 1.9 A, 200 V, 3 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-252AA 1.9 A, 200 V, 3 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-252AA MOSFET P-CH 200V 1.9A DPAK
是否无铅 含铅 含铅 不含铅 含铅 不含铅 含铅 不含铅 -
是否Rohs认证 不符合 不符合 符合 不符合 符合 不符合 符合 -
零件包装代码 TO-251 TO-252 TO-252 TO-252 TO-252 TO-252 TO-251 -
包装说明 IN-LINE, R-PSIP-T3 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 IN-LINE, R-PSIP-T3 -
针数 3 3 3 3 3 3 3 -
Reach Compliance Code unknow unknow unknow unknow unknow unknow unknow -
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 -
其他特性 AVALANCHE RATED AVALANCHE RATED AVALANCHE RATED AVALANCHE RATED AVALANCHE RATED AVALANCHE RATED AVALANCHE RATED -
雪崩能效等级(Eas) 300 mJ 300 mJ 300 mJ 300 mJ 300 mJ 300 mJ 300 mJ -
外壳连接 DRAIN DRAIN DRAIN DRAIN DRAIN DRAIN DRAIN -
配置 SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE -
最小漏源击穿电压 200 V 200 V 200 V 200 V 200 V 200 V 200 V -
最大漏极电流 (Abs) (ID) 1.9 A 1.9 A 1.9 A 1.9 A 1.9 A 1.9 A 1.9 A -
最大漏极电流 (ID) 1.9 A 1.9 A 1.9 A 1.9 A 1.9 A 1.9 A 1.9 A -
最大漏源导通电阻 3 Ω 3 Ω 3 Ω 3 Ω 3 Ω 3 Ω 3 Ω -
FET 技术 METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR -
JEDEC-95代码 TO-251 TO-252 TO-252 TO-252 TO-252 TO-252 TO-251 -
JESD-30 代码 R-PSIP-T3 R-PSSO-G2 R-PSSO-G2 R-PSSO-G2 R-PSSO-G2 R-PSSO-G2 R-PSIP-T3 -
JESD-609代码 e0 e0 e3 e0 e3 e0 e3 -
元件数量 1 1 1 1 1 1 1 -
端子数量 3 2 2 2 2 2 3 -
工作模式 ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE -
最高工作温度 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C -
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
封装形式 IN-LINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE IN-LINE -
峰值回流温度(摄氏度) 240 240 260 240 260 240 260 -
极性/信道类型 P-CHANNEL P-CHANNEL P-CHANNEL P-CHANNEL P-CHANNEL P-CHANNEL P-CHANNEL -
最大功率耗散 (Abs) 25 W 25 W 25 W 25 W 25 W 25 W 25 W -
最大脉冲漏极电流 (IDM) 7.6 A 7.6 A 7.6 A 7.6 A 7.6 A 7.6 A 7.6 A -
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
表面贴装 NO YES YES YES YES YES NO -
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Matte Tin (Sn) Tin/Lead (Sn/Pb) Matte Tin (Sn) Tin/Lead (Sn/Pb) Matte Tin (Sn) -
端子形式 THROUGH-HOLE GULL WING GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE -
端子位置 SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE -
处于峰值回流温度下的最长时间 30 30 40 30 40 30 40 -
晶体管应用 SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING -
晶体管元件材料 SILICON SILICON SILICON SILICON SILICON SILICON SILICON -
Base Number Matches 1 1 1 1 1 1 1 -
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