电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

SIHFR214-E3

产品描述2.2 A, 250 V, 2 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252AA
产品类别分立半导体    晶体管   
文件大小854KB,共11页
制造商Vishay(威世)
官网地址http://www.vishay.com
标准
下载文档 详细参数 选型对比 全文预览

SIHFR214-E3概述

2.2 A, 250 V, 2 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252AA

SIHFR214-E3规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Vishay(威世)
零件包装代码TO-252AA
包装说明SMALL OUTLINE, R-PSSO-G2
针数3
Reach Compliance Codeunknow
ECCN代码EAR99
其他特性AVALANCHE RATED
雪崩能效等级(Eas)190 mJ
外壳连接DRAIN
配置SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压250 V
最大漏极电流 (Abs) (ID)2.2 A
最大漏极电流 (ID)2.2 A
最大漏源导通电阻2 Ω
FET 技术METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码TO-252AA
JESD-30 代码R-PSSO-G2
JESD-609代码e3
湿度敏感等级1
元件数量1
端子数量2
工作模式ENHANCEMENT MODE
最高工作温度150 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)260
极性/信道类型N-CHANNEL
最大功率耗散 (Abs)25 W
最大脉冲漏极电流 (IDM)8.8 A
认证状态Not Qualified
表面贴装YES
端子面层Matte Tin (Sn)
端子形式GULL WING
端子位置SINGLE
处于峰值回流温度下的最长时间40
晶体管应用SWITCHING
晶体管元件材料SILICON

文档预览

下载PDF文档
IRFR214, IRFU214, SiHFR214, SiHFU214
www.vishay.com
Vishay Siliconix
Power MOSFET
PRODUCT SUMMARY
V
DS
(V)
R
DS(on)
()
Q
g
(Max.) (nC)
Q
gs
(nC)
Q
gd
(nC)
Configuration
V
GS
= 10 V
8.2
1.8
4.5
Single
D
FEATURES
250
2.0
Dynamic dV/dt Rating
Repetitive Avalanche Rated
Surface Mount (IRFR214, SiHFR214)
Straight Lead (IRFU214, SiHFU214)
Available in Tape and Reel
Fast Switching
Ease of Paralleling
Material categorization: For definitions of
compliance please see
www.vishay.com/doc?99912
DPAK
(TO-252)
D
D
IPAK
(TO-251)
DESCRIPTION
G
G
S
G
D S
S
N-Channel MOSFET
Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU, SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface mount applications.
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
Lead (Pb)-free
Note
a. See device orientation.
DPAK (TO-252)
SiHFR214-GE3
IRFR214PbF
SiHFR214-E3
DPAK (TO-252)
SiHFR214TRL-GE3
IRFR214TRLPbF
a
SiHFR214TL-E3
a
DPAK (TO-252)
SiHFR214TR-GE3
IRFR214TRPbF
a
SiHFR214T-E3
a
DPAK (TO-252)
SiHFR214TRR-GE3
-
-
IPAK (TO-251)
SiHFU214-GE3
IRFU214PbF
SiHFU214-E3
ABSOLUTE MAXIMUM RATINGS
(T
C
= 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain
Current
a
Mount)
e
E
AS
I
AR
E
AR
T
C
= 25 °C
T
A
= 25 °C
P
D
P
D
dV/dt
T
J
, T
stg
for 10 s
V
GS
at 10 V
T
C
= 25 °C
T
C
= 100 °C
SYMBOL
V
DS
V
GS
I
D
I
DM
LIMIT
250
± 20
2.2
1.4
8.8
0.20
0.020
190
2.2
2.5
25
2.5
4.8
- 55 to + 150
260
W/°C
mJ
A
mJ
W
W
V/ns
°C
A
UNIT
V
Linear Derating Factor
Linear Derating Factor (PCB
Single Pulse Avalanche Energy
b
Repetitive Avalanche Current
a
Repetitive Avalanche
Energy
a
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)
e
Peak Diode Recovery
dV/dt
c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
d
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
DD
= 50 V, Starting T
J
= 25 °C, L = 62 mH, R
g
= 25
,
I
AS
= 2.2 A (see fig. 12).
c. I
SD
2.2 A, dI/dt
65 A/μs, V
DD
V
DS
, T
J
150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 Material).
S13-0171-Rev. E, 04-Feb-13
Document Number: 91269
1
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000

SIHFR214-E3相似产品对比

SIHFR214-E3 IRFR214TR SIHFR214 SIHFR214T SIHFR214T-E3 SIHFR214TL-E3 SIHFR214TR SIHFU214 SIHFU214-E3 IRFR214TRL
描述 2.2 A, 250 V, 2 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252AA 2.2 A, 250 V, 2 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252AA 2.2 A, 250 V, 2 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252AA 2.2 A, 250 V, 2 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252AA 2.2 A, 250 V, 2 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252AA 2.2 A, 250 V, 2 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252AA 2.2 A, 250 V, 2 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252AA 2.2 A, 250 V, 2 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252AA 2.2 A, 250 V, 2 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252AA MOSFET N-CH 250V 2.2A DPAK
是否Rohs认证 符合 不符合 不符合 不符合 符合 符合 不符合 不符合 符合 不符合
厂商名称 Vishay(威世) Vishay(威世) Vishay(威世) Vishay(威世) Vishay(威世) Vishay(威世) Vishay(威世) Vishay(威世) Vishay(威世) Vishay(威世)
包装说明 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 IN-LINE, R-PSIP-T3 IN-LINE, R-PSIP-T3 ,
Reach Compliance Code unknow unknow unknow unknow unknow unknow unknow unknow unknow unknown
配置 SINGLE WITH BUILT-IN DIODE SINGLE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE Single
最大漏极电流 (Abs) (ID) 2.2 A 2.2 A 2.2 A 2.2 A 2.2 A 2.2 A 2.2 A 2.2 A 2.2 A 2.2 A
FET 技术 METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
工作模式 ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE
最高工作温度 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C
极性/信道类型 N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL
最大功率耗散 (Abs) 25 W 25 W 25 W 25 W 25 W 25 W 25 W 25 W 25 W 25 W
表面贴装 YES YES YES YES YES YES YES NO NO YES
是否无铅 不含铅 - 含铅 含铅 不含铅 不含铅 含铅 含铅 不含铅 -
零件包装代码 TO-252AA - TO-252AA TO-252AA TO-252AA TO-252AA TO-252AA TO-251AA TO-251AA -
针数 3 - 3 3 3 3 3 3 3 -
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 -
其他特性 AVALANCHE RATED - AVALANCHE RATED AVALANCHE RATED AVALANCHE RATED AVALANCHE RATED AVALANCHE RATED AVALANCHE RATED AVALANCHE RATED -
雪崩能效等级(Eas) 190 mJ - 190 mJ 190 mJ 190 mJ 190 mJ 190 mJ 190 mJ 190 mJ -
外壳连接 DRAIN DRAIN DRAIN DRAIN DRAIN DRAIN DRAIN DRAIN DRAIN -
最小漏源击穿电压 250 V 250 V 250 V 250 V 250 V 250 V 250 V 250 V 250 V -
最大漏极电流 (ID) 2.2 A 2.2 A 2.2 A 2.2 A 2.2 A 2.2 A 2.2 A 2.2 A 2.2 A -
最大漏源导通电阻 2 Ω 2 Ω 2 Ω 2 Ω 2 Ω 2 Ω 2 Ω 2 Ω 2 Ω -
JEDEC-95代码 TO-252AA TO-252AA TO-252AA TO-252AA TO-252AA TO-252AA TO-252AA TO-251AA TO-251AA -
JESD-30 代码 R-PSSO-G2 R-PSSO-G2 R-PSSO-G2 R-PSSO-G2 R-PSSO-G2 R-PSSO-G2 R-PSSO-G2 R-PSIP-T3 R-PSIP-T3 -
JESD-609代码 e3 e0 e0 e0 e3 e3 e0 e0 e3 -
元件数量 1 1 1 1 1 1 1 1 1 -
端子数量 2 2 2 2 2 2 2 3 3 -
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
封装形式 SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE -
峰值回流温度(摄氏度) 260 NOT SPECIFIED 240 240 260 260 240 240 260 -
最大脉冲漏极电流 (IDM) 8.8 A - 8.8 A 8.8 A 8.8 A 8.8 A 8.8 A 8.8 A 8.8 A -
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
端子面层 Matte Tin (Sn) TIN LEAD Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Matte Tin (Sn) Matte Tin (Sn) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Matte Tin (Sn) -
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE -
端子位置 SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE -
处于峰值回流温度下的最长时间 40 NOT SPECIFIED 30 30 40 40 30 30 40 -
晶体管应用 SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING -
晶体管元件材料 SILICON SILICON SILICON SILICON SILICON SILICON SILICON SILICON SILICON -
新一轮TI 技术研讨会即将开始!(8月2日-11日)——新增详细日程
呵呵 MCU DAY似乎还未结束,TI新的研讨会又开始了,呵呵 大家有更多的机会与TI工程师面对面,探讨相关的技术和产品了。 TI为您准备了一天丰富的研讨会内容,提供您: • 一系列的精彩 ......
soso 单片机
基于FPGA和CCD的图像采集系统设计
兄弟姐妹们好,我现在要做一个课题是基于FPGA和CCD的图像采集系统设计。但是看了看面阵CCD的datasheet,感觉它的时序都好麻烦,头有点晕。 想看看有没有哪位高人做过这方面的东西啊。可以和我 ......
wxq20061001 嵌入式系统
欢迎我们的国芯板块的新版主 lugl4313820~
咱们的国芯板块有新版主上任啦~~ @lugl4313820 欢迎加入EEWorld版主队伍~~今后我们共同努力打造更好的EEWorld论坛呀~~~~ ...
okhxyyo 聊聊、笑笑、闹闹
招聘:硬件工程师一名,地点:深圳
嵌入式硬件开发工程师 职位要求: 1、本科以上学历; 2、电子/无线电通訊/计算机专业; 3、熟悉电子、软件及机械知识,良好英语读写能力; 4、5年以上嵌入式系统硬件和电路设计(如Atmel、 ......
wlzwlz777 嵌入式系统
我怎么在程序中无法使用外设库?
#include "lm3s3739.h" #include "hw_sysctl.h"#include "hw_types.h"#include "hw_comp.h"#include "hw_gpio.h"#include "hw_ints.h"#include "hw_memmap.h"#include "hw_nvic.h"#include "hw ......
yuchenglin 微控制器 MCU
FPGA学习板,红色飓风,550,自己用过的,现在卖了,
初学者学习板,基础实验都有, 用起来不错,有想学FPGA的朋友,可以给你一些很好的资料。...
lxwljf2004 FPGA/CPLD

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2426  1247  1437  2666  2846  50  2  25  18  24 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved