b. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 73117
S-83052-Rev. C, 29-Dec-08
www.vishay.com
1
Si7220DN
Vishay Siliconix
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
Parameter
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Diode Forward Voltage
a
Dynamic
b
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Source-Drain Reverse Recovery Time
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
rr
I
F
= 2.2 A, dI/dt = 100 A/µs
V
DD
= 30 V, R
L
= 30
Ω
I
D
≅
1 A, V
GEN
= 10 V, R
g
= 6
Ω
f = 1 MHz
V
DS
= 30 V, V
GS
= 10 V, I
D
= 4.8 A
13
2.3
2.6
2
10
10
20
10
30
15
15
30
15
60
ns
Ω
20
nC
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
V
SD
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= 0 V, V
GS
= ± 20 V
V
DS
= 60 V, V
GS
= 0 V
V
DS
= 60 V, V
GS
= 0 V, T
J
= 85 °C
V
DS
≥
5 V, V
GS
= 10 V
V
GS
= 10 V, I
D
= 4.8 A
V
GS
= 4.5 V, I
D
= 4.3 A
V
DS
= 10 V, I
D
= 4.8 A
I
S
= 2.2 A, V
GS
= 0 V
20
0.048
0.061
15
0.8
1.2
0.060
0.075
1
3
± 100
1
5
V
nA
µA
A
Ω
S
V
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Notes:
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
The minimum creepage between D1 and D2 for this 100 V device is 0.2 mm. Please see PowerPAK 1212-8 outline drawing, document # 71656,
for more information.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
语音作为自然的人机接口，可以使车载导航系统实现更安全、更人性化的操作。通过国内外车载导航系统的功能对比可知，支持语音交互是车载导航系统的一个发展趋势。另外，市场信息服务公司J.D Power and Associates的调研数据也表明，56％的消费者更倾向于选择声控的导航系统。因此，开发车载语音导航系统是很有意义的。目前，国内已经具备开发车载语音导航系统的技术基础，特别是文语转换TTS技术...[详细]
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