Si3456DDV-T1-GE3 (Lead (Pb)-free and Halogen-free)
S
N-Channel
MOSFET
ABSOLUTE MAXIMUM RATINGS
T
A
= 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T
J
= 150 °C)
Pulsed Drain Current
T
C
= 25 °C
Continuous Source-Drain Diode Current
T
A
= 25 °C
T
C
= 25 °C
T
C
= 70 °C
Maximum Power Dissipation
T
A
= 25 °C
T
A
= 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
Symbol
V
DS
V
GS
I
D
I
DM
I
S
Limit
30
± 20
6.3
5.1
5.0
a, b
4.0
a, b
20
2.2
1.4
a, b
2.7
1.7
1.7
a, b
1.1
a, b
- 55 to 150
260
Unit
V
A
P
D
T
J
, T
stg
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient
a, c
Maximum Junction-to-Foot (Drain)
t
≤
5s
Steady State
Symbol
R
thJA
R
thJF
Typical
61
38
Maximum
74
46
Unit
°C/W
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. t = 5 s.
c. Maximum under steady state conditions is 120 °C/W.
d. Based on T
C
= 25 °C.
Document Number: 69075
S09-1399-Rev. B, 20-Jul-09
www.vishay.com
1
New Product
Si3456DDV
Vishay Siliconix
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
b
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
I
F
= 4 A, dI/dt = 100 A/µs, T
J
= 25 °C
I
S
= 4 A, V
GS
=
0 V
0.8
11
4
6
5
T
C
= 25 °C
1.2
20
1.2
20
8
A
V
ns
nC
ns
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
V
DD
= 15 V, R
L
= 3.8
Ω
I
D
≅
4 A, V
GEN
= 10 V, R
g
= 1
Ω
V
DD
= 15 V, R
L
= 3.8
Ω
I
D
≅
4 A, V
GEN
= 4.5 V, R
g
= 1
Ω
f = 1 MHz
0.6
V
DS
= 15 V, V
GS
= 10 V, I
D
= 5 A
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 5 A
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
325
60
30
6
2.8
1.1
0.8
2.8
12
13
16
11
4
9
11
8
5.6
18
20
25
17
8
18
20
15
ns
Ω
9
4.2
nC
pF
V
DS
ΔV
DS
/T
J
ΔV
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
V
GS
= 0 V, I
D
= 250 µA
I
D
= 250 µA
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= 0 V, V
GS
= ± 20 V
V
DS
= 30 V, V
GS
= 0 V
V
DS
= 30 V, V
GS
= 0 V, T
J
= 70 °C
V
DS
≥
5 V, V
GS
= 10 V
V
GS
=
10 V, I
D
= 5.0 A
V
GS
=
4.5 V, I
D
= 4.5 A
V
DS
= 15 V, I
D
= 5.0 A
15
0.033
0.041
15
0.040
0.050
1.2
30
32
-5
3
± 100
1
10
V
mV/°C
V
nA
µA
A
Ω
S
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Notes:
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
www.vishay.com
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Document Number: 69075
S09-1399-Rev. B, 20-Jul-09
New Product
Si3456DDV
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
20
V
GS
= 10
V
thru 4
V
4
I
D
- Drain Current (A)
5
15
I
D
- Drain Current (A)
3
10
2
T
C
= 25 °C
1
T
C
= 125 °C
T
C
= - 55 °C
5
V
GS
= 3
V
0
0.0
0
0.5
1.0
1.5
2.0
2.5
0
1
2
3
4
V
DS
- Drain-to-Source
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Output Characteristics
0.06
400
Transfer Characteristics
C
iss
R
DS(on)
- On-Resistance (Ω)
0.05
V
GS
= 4.5
V
0.04
V
GS
= 10
V
0.03
C - Capacitance (pF)
300
200
100
C
oss
0.02
0
5
10
I
D
- Drain Current (A)
15
20
0
0
C
rss
5
10
15
20
25
30
V
DS
- Drain-to-Source
Voltage
(V)
On-Resistance vs. Drain Current
10
I
D
= 5.0 A
V
GS
- Gate-to-Source
Voltage
(V)
8
R
DS(on)
- On-Resistance
1.5
1.7
Capacitance
V
GS
= 10
V;
I
D
= 5.0 A
(Normalized)
6
V
DS
= 15
V
V
DS
= 24
V
4
1.3
1.1
V
GS
= 4.5
V;
I
D
= 4.5 A
2
0.9
0
0
1
2
3
4
5
6
0.7
- 50
- 25
0
25
50
75
100
125
150
Q
g
- Total Gate Charge (nC)
T
J
- Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 69075
S09-1399-Rev. B, 20-Jul-09
www.vishay.com
3
New Product
Si3456DDV
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
100
0.10
10
T
J
= 150 °C
T
J
= 25 °C
R
DS(on)
- On-Resistance (Ω)
0.08
I
S
- Source Current (A)
0.06
T
J
= 125 °C
0.04
T
J
= 25 °C
0.02
1
0.1
0.0
0.00
0.3
0.6
0.9
1.2
1.5
0
2
4
6
8
10
V
SD
- Source-to-Drain
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Source-Drain Diode Forward Voltage
2.3
25
On-Resistance vs. Gate-to-Source Voltage
2.1
20
1.9
Power (W)
V
GS(th)
(V)
I
D
= 250
µA
1.7
15
10
1.5
5
1.3
1.1
- 50
- 25
0
25
50
75
100
125
150
0
0.001
0.01
0.1
Time (s)
1
10
100
T
J
- Temperature (°C)
Threshold Voltage
100
Limited
by
R
DS(on)
*
10
100
µA
1
1 ms
10 ms
0.1
T
A
= 25 °C
Single Pulse
0.01
0.1
BVDSS Limited
100 ms
1 s, 10 s
DC
Single Pulse Power
I
D
- Drain Current (A)
1
10
100
V
DS
- Drain-to-Source
Voltage
(V)
*
V
GS
> minimum
V
GS
at
which
R
DS(on)
is specified
Safe Operating Area, Junction-to-Ambient
www.vishay.com
4
Document Number: 69075
S09-1399-Rev. B, 20-Jul-09
New Product
Si3456DDV
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
8
I
D
- Drain Current (A)
6
4
2
0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
Current Derating*
3.5
1.5
2.8
1.2
Power (W)
Power (W)
2.1
0.9
1.4
0.6
0.7
0.3
0.0
0
25
50
75
100
125
150
0.0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
T
A
- Ambient Temperature (°C)
Power Derating (T
C
)
Power Derating (T
A
)
* The power dissipation P
D
is based on T
J(max)
= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
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