Dual Buffer Gate 6-SOT-23 -40 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOT-23 |
| 包装说明 | LSSOP, TSOP6,.11,37 |
| 针数 | 6 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-G6 |
| JESD-609代码 | e4 |
| 长度 | 2.9 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUFFER |
| 最大I（ol） | 0.032 A |
| 湿度敏感等级 | 1 |
| 功能数量 | 2 |
| 输入次数 | 1 |
| 端子数量 | 6 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LSSOP |
| 封装等效代码 | TSOP6,.11,37 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 包装方法 | TR |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| 最大电源电流（ICC） | 0.01 mA |
| Prop。Delay @ Nom-Su | 4.1 ns |
| 传播延迟（tpd） | 8.6 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 座面最大高度 | 1.45 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.95 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 1.6 mm |
| SN74LVC2G34DBVRE4 | SN74LVC2G34DCKRE4 | SN74LVC2G34DCKRG4 | SN74LVC2G34DBVT | SN74LVC2G34YZPR | SN74LVC2G34DRLR | SN74LVC2G34DBVRG4 | SN74LVC2G34DBVTG4 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Dual Buffer Gate 6-SOT-23 -40 to 125 | Buffer 2-CH Non-Inverting CMOS 6-Pin SC-70 T/R | Buffer 2-CH Non-Inverting CMOS 6-Pin SC-70 T/R | Dual Buffer Gate 6-SOT-23 -40 to 125 | Dual Buffer Gate 6-DSBGA -40 to 85 | Dual Buffer Gate 6-SOT-5X3 -40 to 125 | Buffer 2-CH Non-Inverting Push-Pull CMOS 6-Pin SOT-23 T/R | Dual Buffer Gate 6-SOT-23 -40 to 125 |
| Brand Name | Texas Instruments | - | - | Texas Instruments | Texas Instruments | Texas Instruments | - | Texas Instruments |
| 是否无铅 | 不含铅 | - | - | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 |
| 是否Rohs认证 | 符合 | - | - | 符合 | 符合 | 符合 | - | 符合 |
| 零件包装代码 | SOT-23 | - | - | SOT-23 | BGA | SOT | - | SOT-23 |
| 包装说明 | LSSOP, TSOP6,.11,37 | - | - | LSSOP, TSOP6,.11,37 | DSBGA-6 | VSOF, FL6,.047,20 | - | LSSOP, TSOP6,.11,37 |
| 针数 | 6 | - | - | 6 | 6 | 6 | - | 6 |
| Reach Compliance Code | compli | - | - | compli | compli | compli | - | compli |
| ECCN代码 | EAR99 | - | - | EAR99 | EAR99 | EAR99 | - | EAR99 |
| Factory Lead Time | 6 weeks | - | - | 1 week | 1 week | 1 week | - | 6 weeks |
| 系列 | LVC/LCX/Z | - | - | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | - | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-G6 | - | - | R-PDSO-G6 | R-XBGA-B6 | R-PDSO-F6 | - | R-PDSO-G6 |
| JESD-609代码 | e4 | - | - | e4 | e1 | e4 | - | e4 |
| 长度 | 2.9 mm | - | - | 2.9 mm | 1.4 mm | 1.6 mm | - | 2.9 mm |
| 负载电容（CL） | 50 pF | - | - | 50 pF | 50 pF | 50 pF | - | 50 pF |
| 逻辑集成电路类型 | BUFFER | - | - | BUFFER | BUFFER | BUFFER | - | BUFFER |
| 最大I（ol） | 0.032 A | - | - | 0.032 A | 0.032 A | 0.032 A | - | 0.032 A |
| 湿度敏感等级 | 1 | - | - | 1 | 1 | 1 | - | 1 |
| 功能数量 | 2 | - | - | 2 | 2 | 2 | - | 2 |
| 输入次数 | 1 | - | - | 1 | 1 | 1 | - | 1 |
| 端子数量 | 6 | - | - | 6 | 6 | 6 | - | 6 |
| 最高工作温度 | 125 °C | - | - | 125 °C | 85 °C | 125 °C | - | 125 °C |
| 最低工作温度 | -40 °C | - | - | -40 °C | -40 °C | -40 °C | - | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | LSSOP | - | - | LSSOP | VFBGA | VSOF | - | LSSOP |
| 封装等效代码 | TSOP6,.11,37 | - | - | TSOP6,.11,37 | BGA6,2X3,20 | FL6,.047,20 | - | TSOP6,.11,37 |
| 封装形状 | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | - | - | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, VERY THIN PROFILE | - | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 包装方法 | TR | - | - | TR | TR | TR | - | TR |
| 峰值回流温度（摄氏度） | 260 | - | - | 260 | 260 | 260 | - | 260 |
| 电源 | 3.3 V | - | - | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V |
| 最大电源电流（ICC） | 0.01 mA | - | - | 0.01 mA | 0.01 mA | 0.01 mA | - | 0.01 mA |
| Prop。Delay @ Nom-Su | 4.1 ns | - | - | 4.1 ns | 4.1 ns | 9.6 ns | - | 4.1 ns |
| 传播延迟（tpd） | 8.6 ns | - | - | 8.6 ns | 8.6 ns | 9.6 ns | - | 8.6 ns |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 施密特触发器 | NO | - | - | NO | NO | NO | - | NO |
| 座面最大高度 | 1.45 mm | - | - | 1.45 mm | 0.5 mm | 0.6 mm | - | 1.45 mm |
| 最大供电电压 (Vsup) | 5.5 V | - | - | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V | - | - | 1.65 V | 1.65 V | 1.65 V | - | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V | - | - | 1.8 V | 1.8 V | 1.8 V | - | 1.8 V |
| 表面贴装 | YES | - | - | YES | YES | YES | - | YES |
| 技术 | CMOS | - | - | CMOS | CMOS | CMOS | - | CMOS |
| 温度等级 | AUTOMOTIVE | - | - | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | - | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | - | - | GULL WING | BALL | FLAT | - | GULL WING |
| 端子节距 | 0.95 mm | - | - | 0.95 mm | 0.5 mm | 0.5 mm | - | 0.95 mm |
| 端子位置 | DUAL | - | - | DUAL | BOTTOM | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 宽度 | 1.6 mm | - | - | 1.6 mm | 0.9 mm | 1.2 mm | - | 1.6 mm |
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