PNP resistor-equipped transistors R1 = 4.7 kOhm, R2 = 47 kOhm
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | SC-101 |
包装说明 | 1 X 0.60 MM, 0.50 MM HEIGHT, LEADLESS, PLASTIC, SC-101, 3 PIN |
针数 | 3 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
其他特性 | BUILT-IN BIAS RESISTOR RATIO 10 |
外壳连接 | COLLECTOR |
最大集电极电流 (IC) | 0.1 A |
集电极-发射极最大电压 | 50 V |
配置 | SINGLE WITH BUILT-IN RESISTOR |
最小直流电流增益 (hFE) | 100 |
JESD-30 代码 | R-PBCC-N3 |
JESD-609代码 | e3 |
湿度敏感等级 | 1 |
元件数量 | 1 |
端子数量 | 3 |
最高工作温度 | 150 °C |
封装主体材料 | PLASTIC/EPOXY |
封装形状 | RECTANGULAR |
封装形式 | CHIP CARRIER |
峰值回流温度(摄氏度) | 260 |
极性/信道类型 | PNP |
最大功率耗散 (Abs) | 0.25 W |
认证状态 | Not Qualified |
表面贴装 | YES |
端子面层 | Tin (Sn) |
端子形式 | NO LEAD |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | 30 |
晶体管应用 | SWITCHING |
晶体管元件材料 | SILICON |
PDTA143ZM | PDTA143Z | PDTA143ZE | PDTA143ZEF | PDTA143ZK | PDTA143ZS | PDTA143ZT | PDTA143ZU | |
---|---|---|---|---|---|---|---|---|
描述 | PNP resistor-equipped transistors R1 = 4.7 kOhm, R2 = 47 kOhm | PNP resistor-equipped transistors R1 = 4.7 kOhm, R2 = 47 kOhm | PNP resistor-equipped transistors R1 = 4.7 kOhm, R2 = 47 kOhm | PNP resistor-equipped transistors R1 = 4.7 kOhm, R2 = 47 kOhm | PNP resistor-equipped transistors R1 = 4.7 kOhm, R2 = 47 kOhm | PNP resistor-equipped transistors R1 = 4.7 kOhm, R2 = 47 kOhm | PNP resistor-equipped transistors R1 = 4.7 kOhm, R2 = 47 kOhm | PNP resistor-equipped transistors R1 = 4.7 kOhm, R2 = 47 kOhm |
是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | - | 符合 | 符合 |
厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) |
零件包装代码 | SC-101 | - | SC-75 | SC-89 | SOT-23 | - | D2PAK | SOT-23 |
包装说明 | 1 X 0.60 MM, 0.50 MM HEIGHT, LEADLESS, PLASTIC, SC-101, 3 PIN | - | PLASTIC, SC-75, 3 PIN | PLASTIC, SC-89, 3 PIN | SMALL OUTLINE, R-PDSO-G3 | - | PLASTIC PACKAGE-3 | SMALL OUTLINE, R-PDSO-G3 |
针数 | 3 | - | 3 | 3 | 3 | - | 3 | 3 |
Reach Compliance Code | compli | - | compli | unknow | unknow | - | compli | compli |
ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 |
其他特性 | BUILT-IN BIAS RESISTOR RATIO 10 | - | BUILT-IN BIAS RESISTOR RATIO 10 | BUILT-IN BIAS RESISTOR RATIO 10 | BUILT-IN BIAS RESISTOR RATIO 10 | - | BUILT-IN BIAS RESISTOR RATIO 10 | BUILT-IN BIAS RESISTOR RATIO 10 |
最大集电极电流 (IC) | 0.1 A | - | 0.1 A | 0.1 A | 0.1 A | - | 0.1 A | 0.1 A |
集电极-发射极最大电压 | 50 V | - | 50 V | 50 V | 50 V | - | 50 V | 50 V |
配置 | SINGLE WITH BUILT-IN RESISTOR | - | SINGLE WITH BUILT-IN RESISTOR | SINGLE WITH BUILT-IN RESISTOR | SINGLE WITH BUILT-IN RESISTOR | - | SINGLE WITH BUILT-IN RESISTOR | SINGLE WITH BUILT-IN RESISTOR |
最小直流电流增益 (hFE) | 100 | - | 100 | 100 | 100 | - | 100 | 100 |
JESD-30 代码 | R-PBCC-N3 | - | R-PDSO-G3 | R-PDSO-F3 | R-PDSO-G3 | - | R-PDSO-G3 | R-PDSO-G3 |
JESD-609代码 | e3 | - | e3 | e3 | e3 | - | e3 | e3 |
元件数量 | 1 | - | 1 | 1 | 1 | - | 1 | 1 |
端子数量 | 3 | - | 3 | 3 | 3 | - | 3 | 3 |
最高工作温度 | 150 °C | - | 150 °C | - | 150 °C | - | 150 °C | 150 °C |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - | SMALL OUTLINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 | - | 260 | NOT SPECIFIED | 260 | - | 260 | 260 |
极性/信道类型 | PNP | - | PNP | PNP | PNP | - | PNP | PNP |
最大功率耗散 (Abs) | 0.25 W | - | 0.15 W | - | 0.25 W | - | 0.25 W | 0.2 W |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
表面贴装 | YES | - | YES | YES | YES | - | YES | YES |
端子面层 | Tin (Sn) | - | Tin (Sn) | TIN | Tin (Sn) | - | Tin (Sn) | Tin (Sn) |
端子形式 | NO LEAD | - | GULL WING | FLAT | GULL WING | - | GULL WING | GULL WING |
端子位置 | BOTTOM | - | DUAL | DUAL | DUAL | - | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | - | 30 | NOT SPECIFIED | 40 | - | 30 | 30 |
晶体管应用 | SWITCHING | - | SWITCHING | SWITCHING | SWITCHING | - | SWITCHING | SWITCHING |
晶体管元件材料 | SILICON | - | SILICON | SILICON | SILICON | - | SILICON | SILICON |
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