Schmitt Trigger Buffer 2-CH Non-Inverting CMOS 6-Pin X2-DFN T/R
| 参数名称 | 属性值 |
| 欧盟限制某些有害物质的使用 | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.39.00.01 |
| Logic Family | LVC |
| Logic Function | Schmitt Trigger Buffer |
| Number of Elements per Chip | 2 |
| Number of Channels per Chip | 2 |
| Number of Inputs per Chip | 2 |
| Number of Input Enables per Chip | 0 |
| Number of Outputs per Chip | 2 |
| Number of Output Enables per Chip | 0 |
| Bus Hold | No |
| Polarity | Non-Inverting |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 7.1@3.3V|5.4@5V |
| Absolute Propagation Delay Time (ns) | 13.1 |
| Process Technology | CMOS |
| Input Signal Type | Single-Ended |
| Maximum Low Level Output Current (mA) | 32 |
| Maximum High Level Output Current (mA) | -32 |
| Minimum Operating Supply Voltage (V) | 1.65 |
| Typical Operating Supply Voltage (V) | 1.8|2.5|3.3|5 |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Tolerant I/Os (V) | 5.5 |
| Maximum Quiescent Current (uA) | 40 |
| Propagation Delay Test Condition (pF) | 50 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| 系列 Packaging | Tape and Reel |
| Standard Package Name | DFN |
| Supplier Package | X2-DFN |
| Pin Count | 6 |
| Mounting | Surface Mount |
| Package Height | 0.37 |
| Package Length | 1.4 |
| Package Width | 1 |
| PCB changed | 6 |
| Lead Shape | No Lead |
| 74LVC2G17FZ4-7 | 74LVC2G17FW4-7 | 302074-4P402K00TB | CC5-42701BBSANKWS | 74LVC2G17DW-7 | |
|---|---|---|---|---|---|
| 描述 | Schmitt Trigger Buffer 2-CH Non-Inverting CMOS 6-Pin X2-DFN T/R | Schmitt Trigger Buffer 2-CH Non-Inverting CMOS 6-Pin X2-DFN T/R | Fixed Resistor, Metal Foil, 0.5W, 402000ohm, 500V, 0.01% +/-Tol, -2,2ppm/Cel, | Fixed Resistor, Thin Film, 0.4W, 42700ohm, 200V, 0.1% +/-Tol, -10,10ppm/Cel, 1010, | Schmitt Trigger Buffer 2-CH Non-Inverting CMOS 6-Pin SOT-363 T/R |
| 是否Rohs认证 | - | 符合 | 不符合 | 符合 | 符合 |
| Reach Compliance Code | - | compliant | compliant | compliant | compliant |
| 系列 | - | LVC/LCX/Z | H(OTHER) | CC5 | LVC/LCX/Z |
| JESD-609代码 | - | e4 | e0 | - | e3 |
| 端子数量 | - | 6 | 4 | 2 | 6 |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -40 °C | -55 °C | -55 °C | -40 °C |
| 封装形式 | - | SMALL OUTLINE, VERY THIN PROFILE | 4 Terminals | SMT | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | - | TAPE AND REEL | Bulk | Waffle Pack | TAPE AND REEL |
| 技术 | - | CMOS | METAL FOIL | THIN FILM | CMOS |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) | Aluminum (Al) | Matte Tin (Sn) |
| ECCN代码 | - | - | EAR99 | EAR99 | EAR99 |
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