Octal Buffers/Line Receivers/ Line Drivers with TRI-STATE Outputs
| MM54C941 | MM54C941J | MM54C941N | MM74C941 | MM74C941J | MM74C941N | |
|---|---|---|---|---|---|---|
| 描述 | Octal Buffers/Line Receivers/ Line Drivers with TRI-STATE Outputs | Octal Buffers/Line Receivers/ Line Drivers with TRI-STATE Outputs | Octal Buffers/Line Receivers/ Line Drivers with TRI-STATE Outputs | Octal Buffers/Line Receivers/ Line Drivers with TRI-STATE Outputs | Octal Buffers/Line Receivers/ Line Drivers with TRI-STATE Outputs | Octal Buffers/Line Receivers/ Line Drivers with TRI-STATE Outputs |
| 是否Rohs认证 | - | 不符合 | 不符合 | - | 不符合 | 不符合 |
| 包装说明 | - | DIP, DIP20,.3 | DIP, DIP20,.3 | - | DIP, DIP20,.3 | DIP, DIP20,.3 |
| Reach Compliance Code | - | unknown | compliant | - | compli | compli |
| 其他特性 | - | WITH DUAL OUTPUT ENABLE; DISABLE & ENABLE TIME @RL=1K | WITH DUAL OUTPUT ENABLE; DISABLE & ENABLE TIME @RL=1K | - | WITH DUAL OUTPUT ENABLE; DISABLE & ENABLE TIME @RL=1K | CMOS/TTL COMPATIBLE OUTPUTS; TTL COMPATIBLE INPUT @ VCC = 5V; IOH = 2.2MA @ VOH = 2.4V |
| 控制类型 | - | ENABLE HIGH | ENABLE HIGH | - | ENABLE HIGH | ENABLE HIGH |
| 系列 | - | CMOS | CMOS | - | CMOS | CMOS |
| JESD-30 代码 | - | R-GDIP-T20 | R-PDIP-T20 | - | R-GDIP-T20 | R-PDIP-T20 |
| JESD-609代码 | - | e0 | e0 | - | e0 | e0 |
| 长度 | - | 24.51 mm | 26.075 mm | - | 24.51 mm | 26.075 mm |
| 负载电容（CL） | - | 50 pF | 50 pF | - | 50 pF | 50 pF |
| 逻辑集成电路类型 | - | BUS DRIVER | BUS DRIVER | - | BUS DRIVER | BUS DRIVER |
| 位数 | - | 8 | 8 | - | 8 | 8 |
| 功能数量 | - | 1 | 1 | - | 1 | 1 |
| 端口数量 | - | 2 | 2 | - | 2 | 2 |
| 端子数量 | - | 20 | 20 | - | 20 | 20 |
| 最高工作温度 | - | 125 °C | 125 °C | - | 85 °C | 85 °C |
| 最低工作温度 | - | -55 °C | -55 °C | - | -40 °C | -40 °C |
| 输出特性 | - | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE |
| 输出极性 | - | TRUE | TRUE | - | TRUE | TRUE |
| 封装主体材料 | - | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | - | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | - | DIP | DIP | - | DIP | DIP |
| 封装等效代码 | - | DIP20,.3 | DIP20,.3 | - | DIP20,.3 | DIP20,.3 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | IN-LINE | IN-LINE | - | IN-LINE | IN-LINE |
| 传播延迟（tpd） | - | 140 ns | 140 ns | - | 140 ns | 140 ns |
| 认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | - | 5.08 mm | 5.08 mm | - | 5.08 mm | 5.08 mm |
| 最大供电电压 (Vsup) | - | 15 V | 15 V | - | 15 V | 15 V |
| 最小供电电压 (Vsup) | - | 3 V | 3 V | - | 3 V | 3 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | - | 5 V | 5 V |
| 表面贴装 | - | NO | NO | - | NO | NO |
| 技术 | - | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | - | MILITARY | MILITARY | - | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | - | 2.54 mm | 2.54 mm | - | 2.54 mm | 2.54 mm |
| 端子位置 | - | DUAL | DUAL | - | DUAL | DUAL |
| 宽度 | - | 7.62 mm | 7.62 mm | - | 7.62 mm | 7.62 mm |
FPGA/CPLD
stm32/stm8
DIY/开源硬件专区
嵌入式系统
嵌入式系统
NXP MCU
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