FCBGA-484, Tray
| 参数名称 | 属性值 |
| Brand Name | Integrated Device Technology |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | FCBGA |
| 包装说明 | BGA, BGA484,22X22,40 |
| 针数 | 484 |
| 制造商包装代码 | HLG484 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Samacsys Description | FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH |
| Samacsys Manufacturer | IDT |
| 其他特性 | ALSO OPERATES AT 100 MHZ |
| 总线兼容性 | I2C; ISA; VGA |
| 最大时钟频率 | 125 MHz |
| 驱动器接口标准 | IEEE 1149.6AC; IEEE 1149.1 |
| JESD-30 代码 | S-PBGA-B484 |
| JESD-609代码 | e1 |
| 长度 | 23 mm |
| 湿度敏感等级 | 4 |
| 端子数量 | 484 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装等效代码 | BGA484,22X22,40 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 峰值回流温度（摄氏度） | 250 |
| 电源 | 1,3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.92 mm |
| 最大压摆率 | 3400 mA |
| 最大供电电压 | 1.1 V |
| 最小供电电压 | 0.9 V |
| 标称供电电压 | 1 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 1 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 23 mm |
| uPs/uCs/外围集成电路类型 | BUS CONTROLLER, PCI |
| 89H32NT8BG2ZCHLG | 89H32NT8BG2ZBHL | 89H32NT8BG2ZCHL | 89H32NT8BG2ZCHLGI | 89H32NT8BG2ZBHLI | |
|---|---|---|---|---|---|
| 描述 | FCBGA-484, Tray | FCBGA-484, Tray | FCBGA-484, Tray | FCBGA-484, Tray | FCBGA-484, Tray |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
| 是否无铅 | 不含铅 | 含铅 | 含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | 符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | FCBGA | FCBGA | FCBGA | FCBGA | FCBGA |
| 包装说明 | BGA, BGA484,22X22,40 | FCBGA-484 | FCBGA-484 | BGA, BGA484,22X22,40 | FCBGA-484 |
| 针数 | 484 | 484 | 484 | 484 | 484 |
| 制造商包装代码 | HLG484 | HL484 | HL484 | HLG484 | HL484 |
| Reach Compliance Code | compliant | not_compliant | not_compliant | compliant | not_compliant |
| ECCN代码 | EAR99 | 3A001.A.3 | 3A001.A.3 | EAR99 | 3A001.A.3 |
| 其他特性 | ALSO OPERATES AT 100 MHZ | ALSO OPERATES AT 100 MHZ | ALSO OPERATES AT 100 MHZ | ALSO OPERATES AT 100 MHZ | ALSO OPERATES AT 100 MHZ |
| 总线兼容性 | I2C; ISA; VGA | I2C; ISA; VGA | I2C; ISA; VGA | I2C; ISA; VGA | I2C; ISA; VGA |
| 最大时钟频率 | 125 MHz | 125 MHz | 125 MHz | 125 MHz | 125 MHz |
| 驱动器接口标准 | IEEE 1149.6AC; IEEE 1149.1 | IEEE 1149.6AC; IEEE 1149.1 | IEEE 1149.6AC; IEEE 1149.1 | IEEE 1149.6AC; IEEE 1149.1 | IEEE 1149.6AC; IEEE 1149.1 |
| JESD-30 代码 | S-PBGA-B484 | S-PBGA-B484 | S-PBGA-B484 | S-PBGA-B484 | S-PBGA-B484 |
| JESD-609代码 | e1 | e0 | e0 | e1 | e0 |
| 长度 | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm |
| 湿度敏感等级 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 484 | 484 | 484 | 484 | 484 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | BGA | BGA | BGA |
| 封装等效代码 | BGA484,22X22,40 | BGA484,22X22,40 | BGA484,22X22,40 | BGA484,22X22,40 | BGA484,22X22,40 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 峰值回流温度（摄氏度） | 250 | 225 | 225 | 250 | 225 |
| 电源 | 1,3.3 V | 1,3.3 V | 1,3.3 V | 1,3.3 V | 1,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.92 mm | 2.92 mm | 2.92 mm | 2.92 mm | 2.92 mm |
| 最大压摆率 | 3400 mA | 3400 mA | 3400 mA | 3400 mA | 3400 mA |
| 最大供电电压 | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| 最小供电电压 | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| 标称供电电压 | 1 V | 1 V | 1 V | 1 V | 1 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm |
| uPs/uCs/外围集成电路类型 | BUS CONTROLLER, PCI | BUS CONTROLLER, PCI | BUS CONTROLLER, PCI | BUS CONTROLLER, PCI | BUS CONTROLLER, PCI |
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