OTP ROM, 1MX16, 200ns, CMOS, PDSO48
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Macronix |
| 包装说明 | TSSOP, TSSOP48,.8,20 |
| Reach Compliance Code | unknow |
| 最长访问时间 | 200 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PDSO-G48 |
| JESD-609代码 | e0 |
| 内存密度 | 16777216 bi |
| 内存宽度 | 16 |
| 端子数量 | 48 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 1MX16 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP48,.8,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.06 mA |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| MX27C1610TC-20 | MX27C1610MC-10 | MX27C1610MC-15 | MX27C1610MC-20 | MX27C1610MI-12 | MX27C1610PI-15 | MX27C1610TI-10 | MX27C1610TI-12 | MX27C1610TI-15 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | OTP ROM, 1MX16, 200ns, CMOS, PDSO48 | OTP ROM, 1MX16, 100ns, CMOS, PDSO44 | OTP ROM, 1MX16, 150ns, CMOS, PDSO44 | OTP ROM, 1MX16, 200ns, CMOS, PDSO44 | OTP ROM, 1MX16, 120ns, CMOS, PDSO44 | OTP ROM, 1MX16, 150ns, CMOS, PDIP42 | OTP ROM, 1MX16, 100ns, CMOS, PDSO48 | OTP ROM, 1MX16, 120ns, CMOS, PDSO48 | OTP ROM, 1MX16, 150ns, CMOS, PDSO48 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Macronix | Macronix | Macronix | Macronix | Macronix | Macronix | Macronix | Macronix | Macronix |
| 包装说明 | TSSOP, TSSOP48,.8,20 | SOP, SOP44,.63 | SOP, SOP44,.63 | SOP, SOP44,.63 | SOP, SOP44,.63 | DIP, DIP42,.6 | TSSOP, TSSOP48,.8,20 | TSSOP, TSSOP48,.8,20 | TSSOP, TSSOP48,.8,20 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow |
| 最长访问时间 | 200 ns | 100 ns | 150 ns | 200 ns | 120 ns | 150 ns | 100 ns | 120 ns | 150 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PDSO-G48 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PDIP-T42 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 16777216 bi | 16777216 bi | 16777216 bi | 16777216 bi | 16777216 bi | 16777216 bi | 16777216 bi | 16777216 bi | 16777216 bi |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 端子数量 | 48 | 44 | 44 | 44 | 44 | 42 | 48 | 48 | 48 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | - | - | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | SOP | SOP | SOP | SOP | DIP | TSSOP | TSSOP | TSSOP |
| 封装等效代码 | TSSOP48,.8,20 | SOP44,.63 | SOP44,.63 | SOP44,.63 | SOP44,.63 | DIP42,.6 | TSSOP48,.8,20 | TSSOP48,.8,20 | TSSOP48,.8,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| 最大压摆率 | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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