Digitally Controlled Tone and Volume Circuit with Stereo Audio Power Amplifier, Microphone Preamp Stage and National 3D Sound
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | National Semiconductor(TI ) |
| 包装说明 | SOIC-28 |
| Reach Compliance Code | _compli |
| ECCN代码 | EAR99 |
| 其他特性 | MICROPHONE PREAMPLIFIER STAGE IS ALSO AVAILABLE |
| 信道分离 | 90 dB |
| 商用集成电路类型 | TONE CONTROL CIRCUIT |
| 谐波失真 | 10% |
| JESD-30 代码 | R-PDSO-G28 |
| JESD-609代码 | e0 |
| 长度 | 17.9 mm |
| 湿度敏感等级 | 2 |
| 频带数量 | 2 |
| 信道数量 | 2 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP28,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | 220 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 最大压摆率 | 21 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 7.5 mm |
| LM4832M | LM4832 | LM4832N | |
|---|---|---|---|
| 描述 | Digitally Controlled Tone and Volume Circuit with Stereo Audio Power Amplifier, Microphone Preamp Stage and National 3D Sound | Digitally Controlled Tone and Volume Circuit with Stereo Audio Power Amplifier, Microphone Preamp Stage and National 3D Sound | Digitally Controlled Tone and Volume Circuit with Stereo Audio Power Amplifier, Microphone Preamp Stage and National 3D Sound |
| 是否Rohs认证 | 不符合 | - | 不符合 |
| 厂商名称 | National Semiconductor(TI ) | - | National Semiconductor(TI ) |
| 包装说明 | SOIC-28 | - | DIP-28 |
| Reach Compliance Code | _compli | - | _compli |
| ECCN代码 | EAR99 | - | EAR99 |
| 其他特性 | MICROPHONE PREAMPLIFIER STAGE IS ALSO AVAILABLE | - | MICROPHONE PREAMPLIFIER STAGE IS ALSO AVAILABLE |
| 信道分离 | 90 dB | - | 90 dB |
| 商用集成电路类型 | TONE CONTROL CIRCUIT | - | TONE CONTROL CIRCUIT |
| 谐波失真 | 10% | - | 10% |
| JESD-30 代码 | R-PDSO-G28 | - | R-PDIP-T28 |
| JESD-609代码 | e0 | - | e0 |
| 长度 | 17.9 mm | - | 35.725 mm |
| 湿度敏感等级 | 2 | - | 1 |
| 频带数量 | 2 | - | 2 |
| 信道数量 | 2 | - | 2 |
| 功能数量 | 1 | - | 1 |
| 端子数量 | 28 | - | 28 |
| 最高工作温度 | 85 °C | - | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | SOP | - | DIP |
| 封装等效代码 | SOP28,.4 | - | DIP28,.6 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | - | IN-LINE |
| 峰值回流温度(摄氏度) | 220 | - | 260 |
| 认证状态 | Not Qualified | - | Not Qualified |
| 座面最大高度 | 2.65 mm | - | 5.334 mm |
| 最大压摆率 | 21 mA | - | 21 mA |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | - | 4.5 V |
| 表面贴装 | YES | - | NO |
| 技术 | CMOS | - | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | - | THROUGH-HOLE |
| 端子节距 | 1.27 mm | - | 2.54 mm |
| 端子位置 | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | - | 40 |
| 宽度 | 7.5 mm | - | 15.24 mm |
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